专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060003569A1 Semiconductor devices with permanent polymer stencil and method for manufacturing the same 有权
公开(公告)号：US20060003569A1
公开(公告)日：2006-01-05
申请号：US11210606
申请日：2005-08-23
申请人： Warren Farnworth , Alan Wood , James Wark , David Hembree , Syed Ahmad , Michael Hess , John Jacobson
发明人： Warren Farnworth , Alan Wood , James Wark , David Hembree , Syed Ahmad , Michael Hess , John Jacobson
IPC分类号： H01L21/44
CPC分类号： H01L23/544 , B33Y30/00 , B33Y80/00 , H01L21/563 , H01L23/293 , H01L23/3157 , H01L24/81 , H01L24/83 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/11005 , H01L2224/1147 , H01L2224/11472 , H01L2224/16 , H01L2224/293 , H01L2224/81011 , H01L2224/8121 , H01L2224/81815 , H01L2224/83851 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/3512 , H01L2924/00 , H01L2224/05599
摘要： Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.

2. 发明申请

US20070045857A1 Sloped vias in a substrate, spring-like deflecting contacts, and methods of making 有权
标题翻译：衬底中的斜槽，弹簧状偏转触点，以及制作方法
公开(公告)号：US20070045857A1
公开(公告)日：2007-03-01
申请号：US11588977
申请日：2006-10-27
申请人： James Wark , Syed Ahmad
发明人： James Wark , Syed Ahmad
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/5226 , H01L21/486 , H01L21/76898 , H01L23/49827 , H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/115 , H05K3/0029 , H05K3/0041 , H05K3/4611 , H05K3/4629 , H05K2201/09836 , H01L2924/00
摘要： Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.
摘要翻译：公开了形成通孔的方法。所述方法包括提供具有第一表面和相对的第二表面的基底。通孔形成在衬底内，以具有相对于垂直于衬底的第一表面和第二表面延伸的参考线成一定角度倾斜的纵向轴线。通孔可以由第一表面形成到相对的第二表面，或者通孔可以从第一表面形成为第一盲孔，然后可以从第二表面形成第二开口以与第一开口对准。可以通过第一基板和第二基板完全形成通孔，并且基板可以结合在一起。还公开了包括本发明的通孔的半导体器件。还公开了一种形成弹簧状触点的方法。

3. 发明申请

US20060046475A1 Sloped vias in a substrate, spring-like deflecting contacts, and methods of making 有权
标题翻译：衬底中的斜槽，弹簧状偏转触点，以及制作方法
公开(公告)号：US20060046475A1
公开(公告)日：2006-03-02
申请号：US10933847
申请日：2004-09-02
申请人： James Wark , Syed Ahmad
发明人： James Wark , Syed Ahmad
IPC分类号： H01L21/44
CPC分类号： H01L23/5226 , H01L21/486 , H01L21/76898 , H01L23/49827 , H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/115 , H05K3/0029 , H05K3/0041 , H05K3/4611 , H05K3/4629 , H05K2201/09836 , H01L2924/00
摘要： Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.
摘要翻译：公开了形成通孔的方法。所述方法包括提供具有第一表面和相对的第二表面的基底。通孔形成在衬底内，以具有相对于垂直于衬底的第一表面和第二表面延伸的参考线成一定角度倾斜的纵向轴线。通孔可以由第一表面形成到相对的第二表面，或者通孔可以从第一表面形成为第一盲孔，然后可以从第二表面形成第二开口以与第一开口对准。可以通过第一基板和第二基板完全形成通孔，并且基板可以结合在一起。还公开了包括本发明的通孔的半导体器件。还公开了一种形成弹簧状触点的方法。

4. 发明授权

US08434460B2 Integrally molded carbon canister 有权
标题翻译：整体成型碳罐
公开(公告)号：US08434460B2
公开(公告)日：2013-05-07
申请号：US12916120
申请日：2010-10-29
申请人： Jhun Lin , Mark Edward Hipp , Mohammad Usman , Syed Ahmad , Chris Kersman
发明人： Jhun Lin , Mark Edward Hipp , Mohammad Usman , Syed Ahmad , Chris Kersman
IPC分类号： F02M33/02 , F02M33/04
CPC分类号： F02M25/0854
摘要： An integrally molded carbon canister is provided. The integrally molded carbon canister includes a housing including four external side walls and an upper portion at least partially enclosing an internal cavity connected to a vapor inlet and outlet port, the upper portion including a depressed flow disruptor positioned rearward of an injection gate, and a first and second projected flow channel positioned adjacent to the injection gate and laterally spanning the housing. The depressed flow disruptor has a thickness that is less than a section of the upper portion surrounding the depressed flow disruptor and the projected flow channels have a thickness that is greater than a section of the upper portion surrounding the projected flow channels.
摘要翻译：提供一体成型的碳罐。整体模制的碳罐包括壳体，该壳体包括四个外侧壁和至少部分地封闭连接到蒸气入口和出口的内腔的上部，上部包括位于喷射门后方的凹陷流动干扰器，以及第一和第二预计流动通道定位成与喷射门相邻并横向跨越壳体。凹陷流量破坏器的厚度小于围绕凹陷流动干扰器的上部的一部分的厚度，并且突出的流动通道的厚度大于围绕投影流动通道的上部的一部分。

5. 发明申请

US20050208704A1 Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof 审中-公开
标题翻译：方法包括制造衬底和其它半导体器件部件，其上具有在其接触垫上或其周围的套环
公开(公告)号：US20050208704A1
公开(公告)日：2005-09-22
申请号：US11130622
申请日：2005-05-17
申请人： Salman Akram , Syed Ahmad
发明人： Salman Akram , Syed Ahmad
IPC分类号： H01L21/50 , H01L21/60 , H05K3/34
CPC分类号： H01L21/44 , B33Y10/00 , B33Y80/00 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/75 , H01L24/81 , H01L2224/0401 , H01L2224/05572 , H01L2224/10126 , H01L2224/1148 , H01L2224/1191 , H01L2224/13023 , H01L2224/13099 , H01L2224/1319 , H01L2224/16 , H01L2224/75 , H01L2224/81136 , H01L2224/81801 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/3436 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2224/05552 , H01L2924/00
摘要： Methods for fabricating carrier substrates and other semiconductor device components include disposing a collar around at least a portion of a contact. The collar may be formed by a programmed material consolidation process. The programmed material consolidation process may be effected in conjunction with a feature recognition technique, such as machine vision. Once one or more collars are in place, the semiconductor device component may be electrically connected to another semiconductor device component.
摘要翻译：用于制造载体基板和其它半导体器件部件的方法包括在接触件的至少一部分周围设置套环。套环可以通过编程材料固结工艺形成。编程材料合并过程可以结合诸如机器视觉的特征识别技术来实现。一旦一个或多个轴环就位，则半导体器件部件可以电连接到另一个半导体器件部件。

6. 发明申请

US20050282313A1 Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly 审中-公开
标题翻译：用于修改半导体器件以稳定其半导体器件组件的方法
公开(公告)号：US20050282313A1
公开(公告)日：2005-12-22
申请号：US11213094
申请日：2005-08-26
申请人： Salman Akram , Syed Ahmad
发明人： Salman Akram , Syed Ahmad
IPC分类号： H01L21/60 , H01L23/16 , H01L23/485 , H01L23/52 , H05K3/30 , H05K3/34 , H01L21/58
CPC分类号： H05K3/303 , B33Y80/00 , H01L23/16 , H01L24/10 , H01L24/13 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10135 , H01L2224/13 , H01L2224/13099 , H01L2224/75 , H01L2224/81136 , H01L2224/81139 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/3436 , H05K2201/10568 , H05K2201/10674 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2924/00 , H01L2224/05599
摘要： One or more stabilizers are disposed on the surface of a semiconductor device component prior to bonding the same to a higher-level substrate. The one or more stabilizers may be formed on or secured to the surface. Upon assembly of the semiconductor device component face down upon a higher-level substrate and joining conductive structures between the contact pads of the semiconductor device component and corresponding contact pads of the higher-level substrate, the stabilizers at least partially stabilize the semiconductor device component on the higher-level substrate to maintain a substantially parallel relation therebetween. The stabilizers can also be positioned and configured to define a minimum, substantially uniform distance between the semiconductor device component and the higher-level substrate.
摘要翻译：在将半导体器件部件的表面接合到更高级的衬底之前，将一个或多个稳定器设置在半导体器件部件的表面上。一个或多个稳定器可以形成在表面上或固定到表面上。当将半导体器件组件面向下放置在较高级别的衬底上并且在半导体器件部件的接触焊盘和较高级衬底的相应接触焊盘之间接合导电结构时，稳定器至少部分地将半导体器件部件稳定在较高级的衬底以保持它们之间的基本上平行的关系。稳定器还可以被定位和配置为在半导体器件部件和较高级基底之间限定最小的，基本均匀的距离。

7. 发明申请

US20050255612A1 Method of attaching a leadframe to singulated semiconductor dice 审中-公开
公开(公告)号：US20050255612A1
公开(公告)日：2005-11-17
申请号：US11188156
申请日：2005-07-22
申请人： Tongbi Jiang , Syed Ahmad , Walter Moden
发明人： Tongbi Jiang , Syed Ahmad , Walter Moden
IPC分类号： H01L21/66 , H01L23/495
CPC分类号： H01L23/49513 , H01L23/4951 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73257 , H01L2224/83855 , H01L2224/83856 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.

8. 发明申请

US20120103309A1 Integrally Molded Vapor Canister 有权
标题翻译：整体成型蒸气罐
公开(公告)号：US20120103309A1
公开(公告)日：2012-05-03
申请号：US12916120
申请日：2010-10-29
申请人： Jhun Lin , Mark Edward Hipp , Mohammad Usman , Syed Ahmad , Chris Kersman
发明人： Jhun Lin , Mark Edward Hipp , Mohammad Usman , Syed Ahmad , Chris Kersman
IPC分类号： F02M33/02 , B29C45/18
CPC分类号： F02M25/0854
摘要： An integrally molded carbon canister is provided. The integrally molded carbon canister includes a housing including four external side walls and an upper portion at least partially enclosing an internal cavity connected to a vapor inlet and outlet port, the upper portion including a depressed flow disruptor positioned rearward of an injection gate, and a first and second projected flow channel positioned adjacent to the injection gate and laterally spanning the housing.
摘要翻译：提供一体成型的碳罐。整体模制的碳罐包括壳体，该壳体包括四个外侧壁和至少部分地封闭连接到蒸气入口和出口的内腔的上部，上部包括位于喷射门后方的凹陷流动干扰器，以及第一和第二预计流动通道定位成与喷射门相邻并横向跨越壳体。

9. 发明申请

US20060017175A1 Collars, support structures, and forms for protuding conductive structures 失效
标题翻译：用于突出导电结构的轴环，支撑结构和形式
公开(公告)号：US20060017175A1
公开(公告)日：2006-01-26
申请号：US11169230
申请日：2005-06-28
申请人： Salman Akram , Syed Ahmad
发明人： Salman Akram , Syed Ahmad
IPC分类号： H01L23/48
CPC分类号： H01L21/44 , B33Y10/00 , B33Y80/00 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/75 , H01L24/81 , H01L2224/0401 , H01L2224/05572 , H01L2224/10126 , H01L2224/1148 , H01L2224/1191 , H01L2224/13023 , H01L2224/13099 , H01L2224/1319 , H01L2224/16 , H01L2224/75 , H01L2224/81136 , H01L2224/81801 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/3436 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2224/05552 , H01L2924/00
摘要： Collars, support structures, or forms for protruding conductive structures include apertures or receptacles through which the conductive structure may extend. The aperture or receptacle may be configured to contact a surface of the conductive structure, and even to define a shape of at least a portion of the conductive structure. Each collar, support structure, or form may include a plurality of adjacent, mutually adhered regions.
摘要翻译：用于突出导电结构的轴环，支撑结构或形式包括导电结构可延伸通过的孔或容座。孔或接收器可以被配置为接触导电结构的表面，并且甚至限定导电结构的至少一部分的形状。每个套环，支撑结构或形式可以包括多个相邻的相互粘合的区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式