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    • 7. 发明授权
    • Sensor having direct-mounted sensing element
    • 传感器具有直接安装的传感元件
    • US5535626A
    • 1996-07-16
    • US361277
    • 1994-12-21
    • Robert H. BullisJames L. SwindalWalter J. WiegandCharles R. Winston, Jr.
    • Robert H. BullisJames L. SwindalWalter J. WiegandCharles R. Winston, Jr.
    • G01P1/02G01P15/125G01P15/08
    • G01P1/023G01P15/125G01P2015/0828
    • A silicon capacitive microsensor which is sensitive to acceleration forces includes a silicon capacitive sensing element 10 comprising three silicon layers 12,16,26 having glass dielectric layers 14,24 between each pair of silicon layers with the middle silicon layer 16 consisting of a proof mass 18 suspended between the two glass dielectric layers 14,24 by a silicon hinge 20 which is connected to a slightly thicker silicon support layer 17 around the periphery (FIG. 3 ) between the glass layers 14,24 (FIG. 1 ). Three metallic bond pads 40,42,44 on the surface 45 of the silicon layers 26,16,12, respectively, are soldered to circuit trace pads 108 on a circuit board 100 which has a glass upper layer 104 and a silicon support layer 102. The thermal expansion coefficient between the glass layer 104 and the sensing element 10 are substantially the same, thereby minimizing thermally induced stresses on the sensing element 10 and minimizing inaccuracies associated therewith. Such direct mounting greatly simplifies the manufacturing process for such sensors. Also, such direct mounting eliminates flying leads thereby allowing the sensing element 10 to be fabricated to much smaller dimensions than that of the prior art.
    • 对加速力敏感的硅电容微传感器包括硅电容感测元件10,其包括在每对硅层之间具有玻璃介电层14,24的三个硅层12,16,26,中间硅层16由检测质量块 18通过硅铰链20悬挂在两个玻璃介电层14,24之间,该硅铰链20连接到玻璃层14,24(图1)周围的周边(图3)之间的略厚的硅支撑层17。 分别在硅层26,16,12的表面45上的三个金属接合焊盘40,42,44焊接到电路板100上的电路迹线焊盘108,电路板100具有玻璃上层104和硅支撑层102 玻璃层104和感测元件10之间的热膨胀系数基本上相同,从而最小化感应元件10上的热致应力并最小化与之相关联的不准确度。 这种直接安装大大简化了这种传感器的制造过程。 此外,这种直接安装消除了飞行引线,从而允许将感测元件10制造成比现有技术小得多的尺寸。