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1. 发明授权

US06930027B2 Method of manufacturing a semiconductor component 有权
标题翻译：制造半导体部件的方法
公开(公告)号：US06930027B2
公开(公告)日：2005-08-16
申请号：US10369874
申请日：2003-02-18
申请人： Vijay Parthasarathy , Vishnu Khemka , Ronghua Zhu , Amitava Bose , Todd Roggenbauer , Paul Hui , Michael C. Butner
发明人： Vijay Parthasarathy , Vishnu Khemka , Ronghua Zhu , Amitava Bose , Todd Roggenbauer , Paul Hui , Michael C. Butner
IPC分类号： H01L21/308 , H01L21/762 , H01L21/425
CPC分类号： H01L21/3081 , H01L21/76229
摘要： A method of manufacturing a semiconductor component includes forming a first electrically insulating layer (120) and a second electrically insulating layer (130) over a semiconductor substrate (110). The method further includes etching a first trench (140) and a second trench (150) through the first and second electrically insulating layers and into the semiconductor substrate, and etching a third trench (610) through a bottom surface of the second trench and into the semiconductor substrate. The third trench has a first portion (920) and a second portion (930) interior to the first portion. The method still further includes forming a third electrically insulating layer (910) filling the first trench and the first portion of the third trench without filling the second portion of the third trench, and also includes forming a plug layer (1010) in the second portion of the third trench.
摘要翻译：制造半导体部件的方法包括在半导体衬底（110）上形成第一电绝缘层（120）和第二电绝缘层（130）。该方法还包括通过第一和第二电绝缘层蚀刻第一沟槽（140）和第二沟槽（150）并进入半导体衬底，以及通过第二沟槽的底表面蚀刻第三沟槽（610）并且进入半导体衬底。第三沟槽在第一部分内部具有第一部分（920）和第二部分（930）。该方法还包括形成填充第一沟槽和第三沟槽的第一部分的第三电绝缘层（910），而不填充第三沟槽的第二部分，并且还包括在第二部分中形成插塞层（1010）的第三沟。

2. 发明授权

US06734524B1 Electronic component and method of manufacturing same 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US06734524B1
公开(公告)日：2004-05-11
申请号：US10335030
申请日：2002-12-31
申请人： Vijay Parthasarathy , Vishnu Khemka , Ronghua Zhu , Amitava Bose , Todd Roggenbauer , Paul Hui
发明人： Vijay Parthasarathy , Vishnu Khemka , Ronghua Zhu , Amitava Bose , Todd Roggenbauer , Paul Hui
IPC分类号： H01L2900
CPC分类号： H01L27/088 , H01L21/76232
摘要： An electronic component includes a semiconductor substrate (110), an epitaxial semiconductor layer (120, 221, 222) over the semiconductor substrate, and a semiconductor region (130, 230) in the epitaxial semiconductor layer. The epitaxial semiconductor layer has an upper surface (123). A first portion (121) of the epitaxial semiconductor layer is located below the semiconductor region, and a second portion (122) of the epitaxial semiconductor layer is located above the semiconductor region. The semiconductor substrate and the first portion of the epitaxial semiconductor layer have a first conductivity type, and the semiconductor region has a second conductivity type. At least one electrically insulating trench (140, 240) extends from the upper surface of the epitaxial semiconductor layer into at least a portion of the semiconductor region. The semiconductor substrate has a doping concentration higher than a doping concentration of the first portion of the epitaxial semiconductor layer.
摘要翻译：电子部件包括半导体衬底（110），半导体衬底上的外延半导体层（120,221,222）以及外延半导体层中的半导体区域（130,230）。外延半导体层具有上表面（123）。外延半导体层的第一部分（121）位于半导体区域的下方，并且外延半导体层的第二部分（122）位于半导体区域的上方。半导体衬底和外延半导体层的第一部分具有第一导电类型，并且半导体区域具有第二导电类型。至少一个电绝缘沟槽（140,240）从外延半导体层的上表面延伸到半导体区域的至少一部分。半导体衬底的掺杂浓度高于外延半导体层的第一部分的掺杂浓度。

3. 发明申请

US20080122025A1 ELECTRONIC DEVICE INCLUDING A CONDUCTIVE STRUCTURE EXTENDING THROUGH A BURIED INSULATING LAYER 有权
标题翻译：电子设备，包括通过绝缘绝缘层延伸的导电结构
公开(公告)号：US20080122025A1
公开(公告)日：2008-05-29
申请号：US11556576
申请日：2006-11-03
申请人： Todd C. Roggenbauer , Vishnu K. Khemka , Ronghua Zhu , Amitava Bose , Paul Hui , Xiaoqiu Huang
发明人： Todd C. Roggenbauer , Vishnu K. Khemka , Ronghua Zhu , Amitava Bose , Paul Hui , Xiaoqiu Huang
IPC分类号： H01L27/00
CPC分类号： H01L27/105 , H01L21/76264 , H01L21/84 , H01L27/1203 , H01L27/13
摘要： An electronic device can include a substrate, a buried insulating layer overlying the substrate, and a semiconductor layer overlying the buried insulating layer, wherein the semiconductor layer is substantially monocrystalline. The electronic device can also include a conductive structure extending through the semiconductor layer and buried insulating layer and abutting the substrate, and an insulating spacer lying between the conductive structure and each of the semiconductor layer and the buried insulating layer.
摘要翻译：电子器件可以包括衬底，覆盖衬底的掩埋绝缘层和覆盖掩埋绝缘层的半导体层，其中半导体层基本上是单晶的。电子器件还可以包括延伸穿过半导体层和掩埋绝缘层并邻接衬底的导电结构，以及位于导电结构与半导体层和埋入绝缘层中的每一个之间的绝缘衬垫。

4. 发明授权

US07820519B2 Process of forming an electronic device including a conductive structure extending through a buried insulating layer 有权
标题翻译：形成包括延伸穿过掩埋绝缘层的导电结构的电子器件的工艺
公开(公告)号：US07820519B2
公开(公告)日：2010-10-26
申请号：US11556544
申请日：2006-11-03
申请人： Todd C. Roggenbauer , Vishnu K. Khemka , Ronghua Zhu , Amitava Bose , Paul Hui , Xiaoqiu Huang , Van Wong
发明人： Todd C. Roggenbauer , Vishnu K. Khemka , Ronghua Zhu , Amitava Bose , Paul Hui , Xiaoqiu Huang , Van Wong
IPC分类号： H01L21/331
CPC分类号： H01L21/84 , H01L21/823481 , H01L21/823878 , H01L27/0617 , H01L27/08 , H01L27/088 , H01L27/1203
摘要： A process of forming an electronic device can include providing a semiconductor-on-insulator substrate including a substrate, a first semiconductor layer, and a buried insulating layer lying between the first semiconductor layer and the substrate. The process can also include forming a field isolation region within the semiconductor layer, and forming an opening extending through the semiconductor layer and the buried insulating layer to expose the substrate. The process can further include forming a conductive structure within the opening, wherein the conductive structure abuts the substrate.
摘要翻译：形成电子器件的工艺可以包括提供绝缘体上半导体衬底，其包括位于第一半导体层和衬底之间的衬底，第一半导体层和掩埋绝缘层。该工艺还可以包括在半导体层内形成场隔离区域，以及形成延伸穿过半导体层和掩埋绝缘层的开口以露出衬底。该方法还可以包括在开口内形成导电结构，其中导电结构邻接衬底。

5. 发明授权

US08188543B2 Electronic device including a conductive structure extending through a buried insulating layer 有权
标题翻译：电子器件包括延伸穿过掩埋绝缘层的导电结构
公开(公告)号：US08188543B2
公开(公告)日：2012-05-29
申请号：US11556576
申请日：2006-11-03
申请人： Todd C. Roggenbauer , Vishnu K. Khemka , Ronghua Zhu , Amitava Bose , Paul Hui , Xiaoqiu Huang
发明人： Todd C. Roggenbauer , Vishnu K. Khemka , Ronghua Zhu , Amitava Bose , Paul Hui , Xiaoqiu Huang
IPC分类号： H01L27/01
CPC分类号： H01L27/105 , H01L21/76264 , H01L21/84 , H01L27/1203 , H01L27/13
摘要： An electronic device can include a substrate, a buried insulating layer overlying the substrate, and a semiconductor layer overlying the buried insulating layer, wherein the semiconductor layer is substantially monocrystalline. The electronic device can also include a conductive structure extending through the semiconductor layer and buried insulating layer and abutting the substrate, and an insulating spacer lying between the conductive structure and each of the semiconductor layer and the buried insulating layer.
摘要翻译：电子器件可以包括衬底，覆盖衬底的掩埋绝缘层和覆盖掩埋绝缘层的半导体层，其中半导体层基本上是单晶的。电子器件还可以包括延伸穿过半导体层和掩埋绝缘层并邻接衬底的导电结构，以及位于导电结构与半导体层和埋入绝缘层中的每一个之间的绝缘衬垫。

6. 发明申请

US20050042418A1 Molding for automotive application 失效
标题翻译：汽车应用成型
公开(公告)号：US20050042418A1
公开(公告)日：2005-02-24
申请号：US10646211
申请日：2003-08-22
申请人： Paul Hui , William Raymor
发明人： Paul Hui , William Raymor
IPC分类号： B32B3/04 , B60R13/04 , B60R13/06
CPC分类号： B60R13/04 , B60R13/06 , Y10T428/24008 , Y10T428/24198 , Y10T428/24983
摘要： A molding for closing a recess between a pair of body panels includes a head portion, a stem portion, and at least one leg member. The head portion has a width sufficient to close the opening when the molding is installed in the recess. The stem portion can be formed of a harder plastic material than the leg member and has a width enabling the stem portion to pass through an opening in the recess. The leg member is formed of a softer material and extends from the stem portion for frictional engagement with the side wall of the recess. A living hinge can be formed in the leg member to facilitate deflection of the leg member during insertion.
摘要翻译：用于封闭一对主体板之间的凹部的模制件包括头部，杆部和至少一个腿部构件。当模制件安装在凹部中时，头部具有足以闭合开口的宽度。杆部分可以由比腿部件更硬的塑料材料形成，并且具有使杆部分能够通过凹部中的开口的宽度。腿部件由较软的材料形成，并从杆部分延伸，以与凹槽的侧壁摩擦接合。活动铰链可以形成在腿部件中，以便于插入时腿部件的偏转。

7. 发明申请

US20050212318A1 SEALER TAPE AND CLIP ASSEMBLY 失效
标题翻译：密封胶带和夹子组件
公开(公告)号：US20050212318A1
公开(公告)日：2005-09-29
申请号：US10807600
申请日：2004-03-24
申请人： Paul Hui , George Floarea
发明人： Paul Hui , George Floarea
IPC分类号： B60R13/02 , B60R13/04 , B62D27/00
CPC分类号： B60R13/04
摘要： A sealer tape and clip assembly in accordance with the present invention is adapted to be disposed in a recess, defined by at least one interior surface. The assembly includes a sealer tape member having an upper surface, a lower surface, and opposed side surfaces. An aperture extends through the upper surface and the lower surface, and is disposed between but does not extend through the opposed side surfaces. A clip body includes an upper portion, a lower portion, and an intermediate portion extending therebetween. The intermediate portion of the clip body is disposed in the aperture, the upper portion of the clip body engages the upper surface of the sealer tape member, and the lower portion of the clip body engages the lower surface of the sealer tape member. The sealer tape member sealingly bonds with the interior surface of the recess to secure the assembly in the recess.
摘要翻译：根据本发明的密封胶带和夹子组件适于设置在由至少一个内表面限定的凹部中。组件包括具有上表面，下表面和相对侧表面的密封胶带构件。孔延伸穿过上表面和下表面，并且设置在相对的侧表面之间但不延伸通过相对的侧表面。夹体包括上部，下部和在其间延伸的中间部。夹体的中间部分设置在孔中，夹体的上部与密封带构件的上表面接合，夹体的下部与密封带构件的下表面接合。密封胶带部件与凹部的内表面密封地结合，以将组件固定在凹部中。

8. 发明申请

US20100196629A1 DIMENSIONALLY STABLE MOLDING 审中-公开
标题翻译：尺寸稳定的模具
公开(公告)号：US20100196629A1
公开(公告)日：2010-08-05
申请号：US12362961
申请日：2009-01-30
申请人： Julien P. Mourou , Thomas J. Pickett , Paul Hui
发明人： Julien P. Mourou , Thomas J. Pickett , Paul Hui
IPC分类号： B60R13/02
CPC分类号： B60R13/02 , B60R13/04
摘要： A vehicle molding includes a first elongated component formed of a first material and a second elongated component formed of a second material. The first material has a first coefficient of linear thermal expansion and the second material has a second coefficient of linear thermal expansion. The second elongated component defines a plurality of holes. A difference between the first coefficient of linear thermal expansion and the second coefficient of linear thermal expansion is at least 20×10−6 cm/cm ° C. The first material substantially fills the plurality of holes so that the second elongated component is embedded in and interlocked with the first elongated component.
摘要翻译：车辆模制品包括由第一材料形成的第一细长部件和由第二材料形成的第二细长部件。第一材料具有第一线性热膨胀系数，第二材料具有第二系数的线性热膨胀。第二细长部件限定多个孔。所述第一线性热膨胀系数与所述第二线性热膨胀系数之间的差为至少20×10 -6 cm / cm·℃。所述第一材料基本上填充所述多个孔，使得所述第二细长部件嵌入并与第一细长部件互锁。

9. 发明授权

US07045189B2 Molding for automotive application 失效
标题翻译：汽车应用成型
公开(公告)号：US07045189B2
公开(公告)日：2006-05-16
申请号：US10646211
申请日：2003-08-22
申请人： Paul Hui , William J. Raymor
发明人： Paul Hui , William J. Raymor
IPC分类号： B32B3/06
CPC分类号： B60R13/04 , B60R13/06 , Y10T428/24008 , Y10T428/24198 , Y10T428/24983
摘要： A molding for closing a recess between a pair of body panels includes a head portion, a stem portion, and at least one leg member. The head portion has a width sufficient to close the opening when the molding is installed in the recess. The stem portion can be formed of a harder plastic material than the leg member and has a width enabling the stem portion to pass through an opening in the recess. The leg member is formed of a softer material and extends from the stem portion for frictional engagement with the side wall of the recess. A living hinge can be formed in the leg member to facilitate deflection of the leg member during insertion.
摘要翻译：用于封闭一对主体板之间的凹部的模制件包括头部，杆部和至少一个腿部构件。当模制件安装在凹部中时，头部具有足以闭合开口的宽度。杆部分可以由比腿部件更硬的塑料材料形成，并且具有使杆部分能够通过凹部中的开口的宽度。腿部件由较软的材料形成，并从杆部分延伸，以与凹槽的侧壁摩擦接合。活动铰链可以形成在腿部件中，以便于插入时腿部件的偏转。

10. 发明授权

US06945592B1 Sealer tape and clip assembly 失效
标题翻译：密封胶带和夹子组件
公开(公告)号：US06945592B1
公开(公告)日：2005-09-20
申请号：US10807600
申请日：2004-03-24
申请人： Paul Hui , George C. Floarea
发明人： Paul Hui , George C. Floarea
IPC分类号： B60R13/02 , B60R13/04 , B62D27/00
CPC分类号： B60R13/04
摘要： A sealer tape and clip assembly in accordance with the present invention is adapted to be disposed in a recess, defined by at least one interior surface. The assembly includes a sealer tape member having an upper surface, a lower surface, and opposed side surfaces. An aperture extends through the upper surface and the lower surface, and is disposed between but does not extend through the opposed side surfaces. A clip body includes an upper portion, a lower portion, and an intermediate portion extending therebetween. The intermediate portion of the clip body is disposed in the aperture, the upper portion of the clip body engages the upper surface of the sealer tape member, and the lower portion of the clip body engages the lower surface of the sealer tape member. The sealer tape member sealingly bonds with the interior surface of the recess to secure the assembly in the recess.
摘要翻译：根据本发明的密封胶带和夹子组件适于设置在由至少一个内表面限定的凹部中。组件包括具有上表面，下表面和相对侧表面的密封胶带构件。孔延伸穿过上表面和下表面，并且设置在相对的侧表面之间但不延伸通过相对的侧表面。夹体包括上部，下部和在其间延伸的中间部。夹体的中间部分设置在孔中，夹体的上部与密封带构件的上表面接合，夹体的下部与密封带构件的下表面接合。密封胶带部件与凹部的内表面密封地结合，以将组件固定在凹部中。

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