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    • 2. 发明授权
    • Optical metrology model optimization based on goals
    • 基于目标的光学计量模型优化
    • US07588949B2
    • 2009-09-15
    • US11699837
    • 2007-01-29
    • Vi VuongEmmanuel DregeShifang LiJunwei Bao
    • Vi VuongEmmanuel DregeShifang LiJunwei Bao
    • H01L21/00G06F19/00
    • G03F7/70625G03F7/705
    • The optimization of an optical metrology model for use in measuring a wafer structure is evaluated. An optical metrology model having metrology model variables, which includes profile model parameters of a profile model, is developed. One or more goals for metrology model optimization are selected. One or more profile model parameters to be used in evaluating the one or more selected goals are selected. One or more metrology model variables to be set to fixed values are selected. One or more selected metrology model variables are set to fixed values. One or more termination criteria for the one or more selected goals are set. The optical metrology model is optimized using the fixed values for the one or more selected metrology model variables. Measurements for the one or more selected profile model parameters are obtained using the optimized optical metrology model. A determination is then made as to whether the one or more termination criteria are met by the obtained measurements.
    • 评估用于测量晶片结构的光学测量模型的优化。 开发了具有度量模型变量的光学测量模型,其包括轮廓模型的轮廓模型参数。 选择计量模型优化的一个或多个目标。 选择要用于评估一个或多个所选目标的一个或多个简档模型参数。 选择要设置为固定值的一个或多个计量模型变量。 一个或多个选定的计量模型变量被设置为固定值。 设置一个或多个所选目标的一个或多个终止标准。 光学测量模型使用一个或多个所选计量模型变量的固定值进行优化。 使用优化的光学测量模型获得一个或多个所选轮廓模型参数的测量。 然后确定所获得的测量是否满足一个或多个终止标准。
    • 5. 发明申请
    • Optical metrology model optimization based on goals
    • 基于目标的光学计量模型优化
    • US20070135959A1
    • 2007-06-14
    • US11699837
    • 2007-01-29
    • Vi VuongEmmanuel DregeShifang LiJunwei Bao
    • Vi VuongEmmanuel DregeShifang LiJunwei Bao
    • G06F19/00
    • G03F7/70625G03F7/705
    • The optimization of an optical metrology model for use in measuring a wafer structure is evaluated. An optical metrology model having metrology model variables, which includes profile model parameters of a profile model, is developed. One or more goals for metrology model optimization are selected. One or more profile model parameters to be used in evaluating the one or more selected goals are selected. One or more metrology model variables to be set to fixed values are selected. One or more selected metrology model variables are set to fixed values. One or more termination criteria for the one or more selected goals are set. The optical metrology model is optimized using the fixed values for the one or more selected metrology model variables. Measurements for the one or more selected profile model parameters are obtained using the optimized optical metrology model. A determination is then made as to whether the one or more termination criteria are met by the obtained measurements.
    • 评估用于测量晶片结构的光学测量模型的优化。 开发了具有度量模型变量的光学测量模型,其包括轮廓模型的轮廓模型参数。 选择计量模型优化的一个或多个目标。 选择要用于评估一个或多个所选目标的一个或多个简档模型参数。 选择要设置为固定值的一个或多个计量模型变量。 一个或多个选定的计量模型变量被设置为固定值。 设置一个或多个所选目标的一个或多个终止标准。 光学测量模型使用一个或多个所选计量模型变量的固定值进行优化。 使用优化的光学测量模型获得一个或多个所选轮廓模型参数的测量。 然后确定所获得的测量是否满足一个或多个终止标准。
    • 10. 发明授权
    • Integrated circuit profile value determination
    • 集成电路剖面值确定
    • US06842261B2
    • 2005-01-11
    • US10228692
    • 2002-08-26
    • Junwei BaoWen JinEmmanuel DregeSrinivas DoddiVi Vuong
    • Junwei BaoWen JinEmmanuel DregeSrinivas DoddiVi Vuong
    • G01B11/02G01N21/47G01N21/88G06F19/00H01L21/00
    • G01N21/4788G03F7/70625
    • A profile parameter value is determined in integrated circuit metrology by: a) determining a diffraction signal difference based on a measured diffraction signal and a previously generated diffraction signal; b) determining a first profile parameter value based on the previously generated diffraction signal; c) determining a first profile parameter value change based on the diffraction signal difference; d) determining a second profile parameter value based on the first profile parameter value change; e) determining a second profile parameter value change between the first and second profile parameter values; f) determining if the second profile parameter value change meets one or more preset criteria; and g) when the second profile parameter value change fails to meet the one or more preset criteria, iterating c) to g) using as the diffraction signal difference in the iteration of step c), a diffraction signal difference determined based on the measured diffraction signal and a diffraction signal for the second profile parameter value previously determined in step d), and as the first profile parameter value in the iteration of step e), the second profile parameter value previously determined in step d).
    • 在集成电路测量中通过以下方式确定轮廓参数值:a)基于测量的衍射信号和先前产生的衍射信号来确定衍射信号差; b)基于先前产生的衍射信号确定第一轮廓参数值; c)基于所述衍射信号差确定第一轮廓参数值变化; d)基于所述第一轮廓参数值变化来确定第二轮廓参数值; e)确定所述第一和第二轮廓参数值之间的第二轮廓参数值变化; f)确定第二轮廓参数值变化是否满足一个或多个预设标准; 并且g)当第二轮廓参数值改变不能满足一个或多个预设标准时,迭代c)至g)在步骤c)的迭代中使用作为衍射信号差的衍射信号差,基于测得的衍射 信号和用于在步骤d)中预先确定的第二轮廓参数值的衍射信号,以及作为步骤e)的迭代中的第一轮廓参数值,在步骤d)中预先确定的第二轮廓参数值。