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1. 发明授权

US09926627B2 System and methods for processing a substrate 有权
公开(公告)号：US09926627B2
公开(公告)日：2018-03-27
申请号：US14364687
申请日：2011-12-21
申请人： Uwe Hermanns , Neil Morrison , Tobias Stolley , Volker Hacker
发明人： Uwe Hermanns , Neil Morrison , Tobias Stolley , Volker Hacker
IPC分类号： C23C16/503 , C23C14/54 , C23C14/56 , C23C16/44 , C23C16/52 , C23C16/54
CPC分类号： C23C16/503 , C23C14/54 , C23C14/562 , C23C14/564 , C23C16/4401 , C23C16/52 , C23C16/545
摘要： According to the present disclosure, a substrate processing apparatus for processing a flexible substrate including a vacuum chamber configured for being evacuated and being configured for having a process gas provided therein, a processing module adapted to process the flexible substrate, wherein the processing module is provided within the vacuum chamber, and a discharging assembly configured to generate a flow of charged particles to discharge the flexible substrate is provided. The discharging assembly is configured to generate an electric field for ionizing a processing gas.

2. 发明申请

US20150079271A1 SYSTEM AND METHODS FOR PROCESSING A SUBSTRATE 有权
标题翻译：用于处理基板的系统和方法
公开(公告)号：US20150079271A1
公开(公告)日：2015-03-19
申请号：US14364687
申请日：2011-12-21
申请人： Uwe Hermanns , Neil Morrison , Tobias Stolley , Volker Hacker
发明人： Uwe Hermanns , Neil Morrison , Tobias Stolley , Volker Hacker
IPC分类号： C23C16/503 , C23C16/54 , C23C16/52
CPC分类号： C23C16/503 , C23C14/54 , C23C14/562 , C23C14/564 , C23C16/4401 , C23C16/52 , C23C16/545
摘要： According to the present disclosure, a substrate processing apparatus for processing a flexible substrate including a vacuum chamber configured for being evacuated and being configured for having a process gas provided therein, a processing module adapted to process the flexible substrate, wherein the processing module is provided within the vacuum chamber, and a discharging assembly configured to generate a flow of charged particles to discharge the flexible substrate is provided. The discharging assembly is configured to generate an electric field for ionizing a processing gas.
摘要翻译：根据本公开，一种用于处理包括真空室的柔性基板的基板处理装置，所述真空室被构造成被抽真空并且被配置为具有设置在其中的处理气体;处理模块，其适于处理柔性基板，其中提供处理模块并且设置有用于产生带电粒子流以排出柔性基板的排出组件。放电组件被配置为产生用于电离处理气体的电场。

3. 发明授权

US07837799B2 Arrangement for transporting a flat substrate in a vacuum chamber 失效
标题翻译：用于在真空室中输送平面基板的布置
公开(公告)号：US07837799B2
公开(公告)日：2010-11-23
申请号：US10732179
申请日：2003-12-10
申请人： Stefan Bangert , Frank Fuchs , Uwe Schuessler , Ralph Lindenberg , Tobias Stolley
发明人： Stefan Bangert , Frank Fuchs , Uwe Schuessler , Ralph Lindenberg , Tobias Stolley
IPC分类号： C23C16/00 , C23C14/00 , C23F1/00 , H01L21/306 , C25B11/00 , C25B13/00
CPC分类号： B65G49/065 , B65G49/063 , B65G2249/02 , B65G2249/045 , Y10S414/139
摘要： An arrangement for transporting a flat substrate through a coating installation, wherein the coating installation comprises, e.g., several and different sputter cathodes, to which the flat substrate, for example a glass pane, is transported one after the other in vacuo. So that no abrasion is generated between glass pane and contact, the glass pane is kept spaced apart from the contact by means of gas pressure. The gas pressure is herein built up through relatively few and small holes in a gas channel. Since during flooding of the coating installation to atmospheric pressure or during evacuation, due to the small holes, no fast pressure equalization between gas channel and the remaining coating installation is possible, the gas channel is decoupled in terms of gas from the remaining coating installation and provided with a separate gas line, via which gas can be introduced into the gas channel or pumped out of it.
摘要翻译：用于将平坦基底输送通过涂覆装置的布置，其中所述涂覆装置包括例如多个和不同的溅射阴极，平坦基底例如玻璃板在其中真空地彼此输送。因此，玻璃板和接触件之间不会产生磨损，玻璃板通过气体压力与接触件保持间隔开。气体压力通过气体通道中相对较少和小的孔形成。由于涂层装置在大气压下或排空过程中，由于小孔，气体通道和剩余的涂层装置之间无法实现快速压力平衡，所以气体通道与剩余涂层装置的气体相分离，设置有单独的气体管线，通过该气体管线可以将气体引入气体通道中或从其中泵出。

4. 发明申请

US20050199493A1 Arrangement for transporting a flat substrate in a vacuum chamber 失效
标题翻译：用于在真空室中输送平面基板的布置
公开(公告)号：US20050199493A1
公开(公告)日：2005-09-15
申请号：US10732179
申请日：2003-12-10
申请人： Stefan Bangert , Frank Fuchs , Uwe Schuessler , Ralph Lindenberg , Tobias Stolley
发明人： Stefan Bangert , Frank Fuchs , Uwe Schuessler , Ralph Lindenberg , Tobias Stolley
IPC分类号： B65G49/06 , B65G49/07 , C23C14/00
CPC分类号： B65G49/065 , B65G49/063 , B65G2249/02 , B65G2249/045 , Y10S414/139
摘要： An arrangement for transporting a flat substrate through a coating installation, wherein the comprises, e.g., several and different sputter cathodes, to which the flat substrate, for example a glass pane, is transported one after the other in vacuo. So that no abrasion is generated between glass pane and contact, the glass pane is kept spaced apart from the contact by means of gas pressure. The gas pressure is herein built up through relatively few and small holes in a gas channel. Since during flooding of the coating installation to atmospheric pressure or during evacuation, due to the small holes, no fast pressure equalization between gas channel and the remaining coating installation is possible, the gas channel is decoupled in terms of gas from the remaining coating installation and provided with a separate gas line, via which gas can be introduced into the gas channel or pumped out of it.
摘要翻译：用于将平坦基板输送通过涂布设备的布置，其中包括例如几个和不同的溅射阴极，平板基板（例如玻璃板）在其中真空地一个接一个地输送到该喷涂阴极。因此，玻璃板和接触件之间不会产生磨损，玻璃板通过气体压力与接触件保持间隔开。气体压力通过气体通道中相对较少和小的孔形成。由于涂层装置在大气压下或排空过程中，由于小孔，气体通道和剩余的涂层装置之间无法实现快速压力平衡，所以气体通道与剩余涂层装置的气体相分离，设置有单独的气体管线，通过该气体管线可以将气体引入气体通道中或从其中泵出。

5. 发明授权

US08137510B2 Coater with a large-area assembly of rotatable magnetrons 有权
标题翻译：涂层机具有可旋转磁控管的大面积组件
公开(公告)号：US08137510B2
公开(公告)日：2012-03-20
申请号：US11121563
申请日：2005-05-04
申请人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schüssler , Tobias Stolley
发明人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schüssler , Tobias Stolley
IPC分类号： C23C14/00
CPC分类号： H01J37/3455 , C23C14/352 , C23C14/56 , H01J37/3405 , H01J2237/3325
摘要： This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly (2) where the material to be sputtered is located on a target (4) with a curved surface, the material to be sputtered being located, in particular, on the lateral surface of a cylinder, there being in a single coating chamber for a coherent coating zone at least three, preferably more, cathode assemblies (2) with rotatable, curved targets (4) positioned one beside the other.
摘要翻译：本发明涉及一种用于通过阴极溅射涂覆，特别是大面积基板的涂布机，涂布机具有涂覆室，并且在其中设置阴极组件（2），其中待溅射的材料位于具有弯曲表面的靶（4），待溅射的材料特别地位于圆柱体的侧表面上，在单个涂覆室中用于粘附涂层区域，至少三个，优选更多的阴极组件（2）具有位于另一个旁边的可旋转的弯曲目标（4）。

6. 发明申请

US20120285522A1 THIN-FILM SOLAR FABRICATION PROCESS, DEPOSITION METHOD FOR TCO LAYER, AND SOLAR CELL PRECURSOR LAYER STACK 审中-公开
标题翻译：薄膜太阳能制造工艺，TCO层沉积方法和太阳能电池前层堆叠
公开(公告)号：US20120285522A1
公开(公告)日：2012-11-15
申请号：US13468915
申请日：2012-05-10
申请人： Elisabeth Sommer , Philipp Obermeyer , Thomas Zilbauer , Inge Vermeir , Daniel Severin , Niels Kuhr , Markus Kress , Christof Kurthen , Ursula Ingeborg Schmidt , Stefan Klein , Susanne Buschbaum , Konrad Schwanitz , Christian Stoemmer , Tobias Stolley , Martin Rohde , Andreas Rembeck
发明人： Elisabeth Sommer , Philipp Obermeyer , Thomas Zilbauer , Inge Vermeir , Daniel Severin , Niels Kuhr , Markus Kress , Christof Kurthen , Ursula Ingeborg Schmidt , Stefan Klein , Susanne Buschbaum , Konrad Schwanitz , Christian Stoemmer , Tobias Stolley , Martin Rohde , Andreas Rembeck
IPC分类号： H01L31/0236 , H01L31/18 , H01L31/0224 , H01L31/076 , C23C14/34 , C23C14/08
CPC分类号： H01L31/1884 , H01L31/022466 , H01L31/022483 , H01L31/02366 , H01L31/076 , Y02E10/548
摘要： Method of depositing a TCO layer on a substrate, of depositing precursors of a solar cell and precursors of a solar cell are described. The methods includes DC sputtering a ZnO-containing transparent conductive oxide layer over the substrate, the substrate having a size of 1.4 m2 or above and texturing the ZnO-containing transparent conductive oxide layer, wherein the textured ZnO-containing transparent conductive oxide layer has a root means square roughness of 60 nm or below.
摘要翻译：描述了在衬底上沉积TCO层，沉积太阳能电池的前体和太阳能电池的前体的方法。所述方法包括在衬底上溅射含ZnO的透明导电氧化物层，所述衬底具有1.4m 2或更大的尺寸，并对含ZnO的透明导电氧化物层进行纹理化，其中织构化的含ZnO透明导电氧化物层具有根是指60nm以下的平方粗糙度。

7. 发明申请

US20090205954A1 APPARATUS FOR TREATING A SUBSTRATE 有权
标题翻译：用于处理基板的装置
公开(公告)号：US20090205954A1
公开(公告)日：2009-08-20
申请号：US12031339
申请日：2008-02-14
申请人： Markus Hanika , Tobias Stolley
发明人： Markus Hanika , Tobias Stolley
IPC分类号： C23C14/00
CPC分类号： C23C14/352 , H01J37/34 , H01J37/3438
摘要： This invention relates to an apparatus (1) for treating, e.g. coating, a substrate (35, 39) in a vacuum chamber (2). In this vacuum chamber (2) there are arranged n cathodes (7-10) and n+1 anodes (28-32), each of said anodes adjacent to a cathode (7-10). Each of the n cathodes (7-10) and n of the assigned anodes (29-32) are connected to a power supply (11-14). One of the anodes (28) not being assigned to a cathode (7-10) is connected to an electrical line (63) which is connecting each of the anodes (28-32). A pull-down resistor (34) is connected to said line (63) at its one end and to ground (33) at its other end.
摘要翻译：本发明涉及一种用于处理，例如，涂覆在真空室（2）中的基底（35,39）。在该真空室（2）中，设置n个阴极（7-10）和n + 1个阳极（28-32），每个阳极与阴极（7-10）相邻。分配的阳极（29-32）的n个阴极（7-10）和n中的每一个连接到电源（11-14）。未分配给阴极（7-10）的阳极（28）中的一个连接到连接每个阳极（28-32）的电线（63）。下拉电阻器（34）在其一端连接到所述线（63），并在其另一端连接到地（33）。

8. 发明申请

US20050252768A1 Coater with a large-area assembly of rotatable magnetrons 有权
标题翻译：涂层机具有可旋转磁控管的大面积组件
公开(公告)号：US20050252768A1
公开(公告)日：2005-11-17
申请号：US11121563
申请日：2005-05-04
申请人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schussler , Tobias Stolley
发明人： Stefan Bangert , Frank Fuchs , Ralph Lindenberg , Andreas Lopp , Uwe Schussler , Tobias Stolley
IPC分类号： C23C14/34 , C23C14/35 , C23C14/56 , H01J37/34 , C23C14/32
CPC分类号： H01J37/3455 , C23C14/352 , C23C14/56 , H01J37/3405 , H01J2237/3325
摘要： This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly (2) where the material to be sputtered is located on a target (4) with a curved surface, the material to be sputtered being located, in particular, on the lateral surface of a cylinder, there being in a single coating chamber for a coherent coating zone at least three, preferably more, cathode assemblies (2) with rotatable, curved targets (4) positioned one beside the other.
摘要翻译：本发明涉及一种用于通过阴极溅射涂覆，特别是大面积基板的涂布机，涂布机具有涂覆室，并且在其中设置阴极组件（2），其中待溅射的材料位于具有弯曲表面的靶（4），待溅射的材料特别地位于圆柱体的侧表面上，在单个涂覆室中用于粘附涂层区域，至少三个，优选更多的阴极组件（2）具有位于另一个旁边的可旋转的弯曲目标（4）。

9. 发明授权

US08083911B2 Apparatus for treating a substrate 有权
标题翻译：用于处理基底的装置
公开(公告)号：US08083911B2
公开(公告)日：2011-12-27
申请号：US12031339
申请日：2008-02-14
申请人： Markus Hanika , Tobias Stolley
发明人： Markus Hanika , Tobias Stolley
IPC分类号： C23C14/36
CPC分类号： C23C14/352 , H01J37/34 , H01J37/3438
摘要： This invention relates to an apparatus (1) for treating, e.g. coating, a substrate (35, 39) in a vacuum chamber (2). In this vacuum chamber (2) there are arranged n cathodes (7-10) and n+1 anodes (28-32), each of said anodes adjacent to a cathode (7-10). Each of the n cathodes (7-10) and n of the assigned anodes (29-32) are connected to a power supply (11-14). One of the anodes (28) not being assigned to a cathode (7-10) is connected to an electrical line (63) which is connecting each of the anodes (28-32). A pull-down resistor (34) is connected to said line (63) at its one end and to ground (33) at its other end.
摘要翻译：本发明涉及一种用于处理，例如，涂覆在真空室（2）中的基底（35,39）。在该真空室（2）中，设置n个阴极（7-10）和n + 1个阳极（28-32），每个阳极与阴极（7-10）相邻。分配的阳极（29-32）的n个阴极（7-10）和n中的每一个连接到电源（11-14）。未分配给阴极（7-10）的阳极（28）中的一个连接到连接每个阳极（28-32）的电线（63）。下拉电阻器（34）在其一端连接到所述线（63），并在其另一端连接到地（33）。

10. 发明授权

US07575662B2 Method for operating a sputter cathode with a target 有权
标题翻译：用靶操作溅射阴极的方法
公开(公告)号：US07575662B2
公开(公告)日：2009-08-18
申请号：US11170640
申请日：2005-06-29
申请人： Stefan Bangert , Wolfgang Buschbeck , Markus Hanika , Karl-Albert Keim , Michael Konig , Jorg Krempel-Hesse , Andreas Lopp , Harald Rost , Jurgen Schroeder , Tobias Stolley
发明人： Stefan Bangert , Wolfgang Buschbeck , Markus Hanika , Karl-Albert Keim , Michael Konig , Jorg Krempel-Hesse , Andreas Lopp , Harald Rost , Jurgen Schroeder , Tobias Stolley
IPC分类号： C23C14/35
CPC分类号： H01J37/3405 , C23C14/352 , H01J37/3455
摘要： The invention relates to a method for operating a magnetron sputter cathode, in particular a tube cathode or several tube cathodes forming an array. In such cathodes a target passes through a magnetic field, whereby induction currents flow in the target which distort the magnetic field. This results in the nonuniform coating of a substrate. By having the relative movement between magnetic field and target alternately reverse its direction, the effect of the magnetic field distortion can be compensated. This yields greater uniformity of the coating on a substrate to be coated.
摘要翻译：本发明涉及一种用于操作磁控溅射阴极的方法，特别是管阴极或形成阵列的多个管阴极。在这样的阴极中，目标通过磁场，由此感应电流流过靶，使磁场发生变形。这导致衬底的不均匀涂覆。通过使磁场和目标之间的相对运动交替地反转其方向，可以补偿磁场失真的影响。这样可以使待涂覆的基底上的涂层更均匀。

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