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1. 发明授权

US10363521B2 Filter device, control valve comprising the filter device, and fuel cell system 有权
公开(公告)号：US10363521B2
公开(公告)日：2019-07-30
申请号：US14343507
申请日：2012-08-30
申请人： Tsuyoshi Takeda , Kazuhiko Osawa , Daisaku Inamura , Ichiro Okawara , Takatada Usami , Shinichiro Takemoto
发明人： Tsuyoshi Takeda , Kazuhiko Osawa , Daisaku Inamura , Ichiro Okawara , Takatada Usami , Shinichiro Takemoto
IPC分类号： H01M8/06 , B01D53/26 , B01D46/42 , H01M8/0662 , H01M8/04119
摘要： [Problem]The object of the invention is to provide the filter device disposed in the moist fluid passage of the fuel cell system in that, water is not adhered and never remains in the filter and when leaving it under the low temperature after the system stops, blockage by freezing the filter can surely be prevented, and the complex control and the heat source such as heaters for the decompression as conventional is unnecessary, and the filter device is cheap and compact.[Resolution Approach]A filter device 50 disposed on a moist fluid passage of a system including moisture in the fluid, the filter device comprising: a fluid introducing path 58 in which fluid that flows on the moist fluid passage is introduced into a filter room 60 from below filter room 60, a filter member 66 in which the fluid introduced from the fluid introducing path 58 into a filter room 60 is permeated and the foreign matter in the fluid is removed, a filter 62 placed in the filter room 60, a water pooling portion 72 disposed under the filter 62, and a fluid discharge path 70 in which the fluid that passed the filter 62 is discharged.

2. 发明申请

US20140220462A1 FILTER DEVICE, CONTROL VALVE COMPRISING THE FILTER DEVICE, AND FUEL CELL SYSTEM 审中-公开
标题翻译：过滤装置，包括过滤装置的控制阀和燃料电池系统
公开(公告)号：US20140220462A1
公开(公告)日：2014-08-07
申请号：US14343507
申请日：2012-08-30
申请人： Tsuyoshi Takeda , Kazuhiko Osawa , Daisaku Inamura , Ichiro Okawara , Takatada Usami , Shinichiro Takemoto
发明人： Tsuyoshi Takeda , Kazuhiko Osawa , Daisaku Inamura , Ichiro Okawara , Takatada Usami , Shinichiro Takemoto
IPC分类号： B01D53/26 , H01M8/06
CPC分类号： B01D53/268 , B01D46/42 , H01M8/04164 , H01M8/0662 , H01M8/0687
摘要： [Problem]The object of the invention is to provide the filter device disposed in the moist fluid passage of the fuel cell system in that, water is not adhered and never remains in the filter and when leaving it under the low temperature after the system stops, blockage by freezing the filter can surely be prevented, and the complex control and the heat source such as heaters for the decompression as conventional is unnecessary, and the filter device is cheap and compact.[Resolution Approach]A filter device 50 disposed on a moist fluid passage of a system including moisture in the fluid, the filter device comprising: a fluid introducing path 58 in which fluid that flows on the moist fluid passage is introduced into a filter room 60 from below filter room 60, a filter member 66 in which the fluid introduced from the fluid introducing path 58 into a filter room 60 is permeated and the foreign matter in the fluid is removed, a filter 62 placed in the filter room 60, a water pooling portion 72 disposed under the filter 62, and a fluid discharge path 70 in which the fluid that passed the filter 62 is discharged.
摘要翻译：发明内容本发明的目的是提供一种设置在燃料电池系统的潮湿流体通道中的过滤装置，其特征在于，水不粘附并且不会残留在过滤器中，并且在系统停止之后将其置于低温下可以确实地防止过滤器的冻结堵塞，并且不需要诸如常规的减压加热器等复杂控制和热源，并且过滤装置便宜而紧凑。 [分辨率方法]设置在包括流体中的湿气的系统的潮湿流体通道上的过滤装置50，该过滤装置包括：流体引入路径58，流过湿流体通道的流体被引入到过滤室60中从过滤室60下方，将从流体导入路58导入过滤室60的流体渗透过滤构件66，除去流体中的异物，将过滤室62配置在过滤室60内，设置在过滤器62下方的汇集部72以及排出通过过滤器62的流体的流体排出路径70。

3. 发明授权

US08929092B2 Circuit board, and semiconductor device having component mounted on circuit board 有权
标题翻译：电路板，以及具有安装在电路板上的元件的半导体器件
公开(公告)号：US08929092B2
公开(公告)日：2015-01-06
申请号：US13504281
申请日：2010-10-28
申请人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
发明人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
IPC分类号： H05K7/00 , H05K3/10 , H05K1/11 , H01L21/48 , H01L23/498 , H01L23/00 , H05K3/38 , H05K3/18
CPC分类号： H05K1/111 , H01L21/4846 , H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/16237 , H01L2224/81191 , H01L2224/81385 , H01L2224/82385 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K3/107 , H05K3/184 , H05K3/38 , H05K2201/0373 , H05K2201/0391 , H05K2201/09736 , H05K2201/2072 , H05K2203/0307 , H05K2203/0565 , Y02P70/611 , Y10T29/49155 , H01L2924/00
摘要： A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.
摘要翻译：电路板包括在绝缘基底的表面上具有布线部分和焊盘部分的电路。电路被配置为使得导体嵌入形成在基底绝缘体的表面中的电路凹槽中，并且导体的表面粗糙度在电路的布线部分和焊盘部分中是不同的。在这种情况下，优选的是，焊盘部中的导体的表面粗糙度大于布线部中的导体的表面粗糙度。

4. 发明授权

US09090969B2 Semiconductor device manufacturing and processing methods and apparatuses for forming a film 有权
公开(公告)号：US09090969B2
公开(公告)日：2015-07-28
申请号：US13529373
申请日：2012-06-21
申请人： Tsuyoshi Takeda , Taketoshi Sato
发明人： Tsuyoshi Takeda , Taketoshi Sato
IPC分类号： H01R11/01 , C23C16/30 , C23C16/32 , C23C16/36 , C23C16/44 , C23C16/455 , H01L21/02
CPC分类号： H01L21/0228 , C23C16/30 , C23C16/325 , C23C16/36 , C23C16/4412 , C23C16/45523 , H01L21/02126 , H01L21/02167 , H01L21/02211 , H01L21/02529 , H01L21/0262
摘要： A semiconductor device manufacturing method includes: accommodating a substrate in a processing chamber; and supplying a silicon-based gas and an amine-based gas into the processing chamber that is heated to form a film including silicon and carbon on the substrate. The forming of the film including silicon and carbon includes: supplying the silicon-based gas and the amine-based gas into the processing chamber and confining the silicon-based gas and the amine-based gas in the processing chamber; maintaining a state in which the silicon-based gas and the amine-based gas are confined in the processing chamber, and exhausting an inside of the processing chamber.

5. 发明授权

US09082635B2 Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board 有权
标题翻译：布线方法，表面具有布线的结构，半导体器件，布线板，存储卡，电子装置，模块和多层电路板
公开(公告)号：US09082635B2
公开(公告)日：2015-07-14
申请号：US13698975
申请日：2011-05-11
申请人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda , Yuko Konno
发明人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda , Yuko Konno
IPC分类号： H05K1/11 , H01L25/065 , H01L21/48 , H01L21/683 , H01L23/495 , H01L23/498 , H01L23/538 , H01L23/00 , H05K3/18 , H01L25/00 , H05K1/18 , C23C18/16 , C23C18/18 , H01L23/31 , H05K3/28 , H05K3/46
CPC分类号： H05K3/184 , C23C18/1608 , C23C18/1653 , C23C18/1893 , C25D7/0607 , H01L21/4832 , H01L21/6835 , H01L23/3121 , H01L23/49541 , H01L23/49582 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2221/68359 , H01L2221/68377 , H01L2224/24051 , H01L2224/24137 , H01L2224/24145 , H01L2224/24146 , H01L2224/24225 , H01L2224/24226 , H01L2224/24998 , H01L2224/32145 , H01L2224/82001 , H01L2224/82039 , H01L2224/82101 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06568 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H05K1/185 , H05K3/10 , H05K3/284 , H05K3/4644 , H05K2201/10636 , H05K2201/10674 , H05K2203/0264 , H05K2203/072 , H05K2203/0723 , H05K2203/0769 , H05K2203/1407 , H05K2203/1469 , Y02P70/611 , H05K3/4661 , H01L2924/00
摘要： A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.
摘要翻译：提供一种布线方法，其中绝缘层形成在半导体器件1的暴露多个连接端子的表面上，树脂膜形成在绝缘层的表面上，深度等于或超过树脂膜的厚度由树脂膜的表面侧形成，使得沟槽在要连接的连接端子附近通过，此外，连通孔将从该部分到达要连接的连接端子形成沟槽附近的沟槽。

6. 发明申请

US20130261283A1 COPOLYCARBONATE 有权
标题翻译：共聚碳酸酯
公开(公告)号：US20130261283A1
公开(公告)日：2013-10-03
申请号：US13884309
申请日：2011-11-10
申请人： Tetsuya Motoyoshi , Masatoshi Ando , Tsuyoshi Takeda
发明人： Tetsuya Motoyoshi , Masatoshi Ando , Tsuyoshi Takeda
IPC分类号： C08G64/16
CPC分类号： C08G64/1608 , C08G64/1616 , G02B1/04 , C08L69/00
摘要： The present invention provides a copolycarbonate that has a low photoelastic constant and has fewer foamed cells and that is in particular suitable for use in optical fields.The present invention is a copolycarbonate containing 10 to 90 mol % of a unit (A) derived from spiroglycol and 90 to 10 mol % of a unit (B) derived from aromatic phenol and having terminals satisfying the following expressions (i) and (ii), 0.0001
摘要翻译：本发明提供一种具有低光弹性常数且具有较少发泡泡孔的共聚碳酸酯，特别适用于光学领域。本发明是一种共聚碳酸酯，其含有10〜90摩尔％的来自螺旋体的单元（A）和90〜10摩尔％的来自芳香族苯酚的单元（B），并且具有满足以下表达式（i）和（ii）的末端），0.0001 <（a）/（d）<0.1（i）0.02 <（b）/（d）<0.8（ii）其中（a）是来自螺状二醇的末端基团的量，（b）来自芳香族苯酚的末端基团的量，（d）为总末端基团量。

7. 发明授权

US06341200B1 Lens-fitted film unit 失效
标题翻译：镜头式胶片单元
公开(公告)号：US06341200B1
公开(公告)日：2002-01-22
申请号：US09306352
申请日：1999-05-06
申请人： Kazuhiro Nakanishi , Kunikazu Takano , Hiroshi Kibayashi , Hiromi Nakanishi , Tetsufumi Takaba , Wataru Hiroshima , Tsuyoshi Takeda , Akira Aoki , Kanichi Onda
发明人： Kazuhiro Nakanishi , Kunikazu Takano , Hiroshi Kibayashi , Hiromi Nakanishi , Tetsufumi Takaba , Wataru Hiroshima , Tsuyoshi Takeda , Akira Aoki , Kanichi Onda
IPC分类号： G03B1702
CPC分类号： G03B17/02
摘要： A lens-fitted film unit includes: a main body; a photographic lens provided in the main body, having an aperture value; an aperture provided in the main body; a shutter provided in the main body, having a shutter speed; a photographic film loaded in the main body, having image frames each including an unexposed portion and a pre-exposed portion on which a latent image has been formed; and a masking member for masking the pre-exposed portion of the photographic film when a photographing operation is conducted. The latent image has been formed on the photographic film with a same exposure amount as that obtained when an object to be photographed having a brightness of not less than 10 and not more than 12.5 in terms of light values in which a photographic film whose ISO sensitivity is 100, is exposed to light with an aperture value of the photographic lens set by the aperture and with the shutter speed of the shutter.
摘要翻译：透镜配合膜单元包括：主体; 设置在主体中的具有孔径值的摄影镜头; 设置在主体中的孔; 设置在主体中的具有快门速度的快门; 装载在主体中的摄影胶片，具有各自包括未曝光部分的图像帧和在其上形成潜像的预曝光部分; 以及掩模构件，用于在进行拍摄操作时掩蔽摄影胶片的预曝光部分。曝光量与摄影胶片的曝光量相同时，曝光量与摄影胶片的ISO感光度相比，其亮度不低于10，但不高于12.5，是100，被曝光到具有由光圈设置的摄影镜头的光圈值和快门的快门速度的光。

8. 发明授权

US08816039B2 Copolycarbonate 有权
标题翻译：共聚碳酸酯
公开(公告)号：US08816039B2
公开(公告)日：2014-08-26
申请号：US13884309
申请日：2011-11-10
申请人： Tetsuya Motoyoshi , Masatoshi Ando , Tsuyoshi Takeda
发明人： Tetsuya Motoyoshi , Masatoshi Ando , Tsuyoshi Takeda
IPC分类号： C08G63/02 , G02B1/04 , C08G64/16 , C08G63/00
CPC分类号： C08G64/1608 , C08G64/1616 , G02B1/04 , C08L69/00
摘要： The present invention provides a copolycarbonate that has a low photoelastic constant and has fewer foamed cells and that is in particular suitable for use in optical fields.The present invention is a copolycarbonate containing 10 to 90 mol % of a unit (A) derived from spiroglycol and 90 to 10 mol % of a unit (B) derived from aromatic phenol and having terminals satisfying the following expressions (i) and (ii), 0.0001
摘要翻译：本发明提供一种具有低光弹性常数且具有较少发泡泡孔的共聚碳酸酯，特别适用于光学领域。本发明是一种共聚碳酸酯，其含有10〜90摩尔％的来自螺旋体的单元（A）和90〜10摩尔％的来自芳香族苯酚的单元（B），并且具有满足以下表达式（i）和（ii）的末端），0.0001 <（a）/（d）<0.1（i）0.02 <（b）/（d）<0.8（ii）其中（a）是来自螺状二醇的末端基团的量，（b）来自芳香族苯酚的末端基团的量，（d）为总末端基团量。

9. 发明申请

US20130337188A1 RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD 有权
标题翻译：用于生产电路板的树脂组合物和方法
公开(公告)号：US20130337188A1
公开(公告)日：2013-12-19
申请号：US14002970
申请日：2011-11-28
申请人： Yuko Konno , Hiromitsu Takashita , Tsuyoshi Takeda , Hiroaki Fujiwara , Shingo Yoshioka
发明人： Yuko Konno , Hiromitsu Takashita , Tsuyoshi Takeda , Hiroaki Fujiwara , Shingo Yoshioka
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： C08K5/3475 , C08K5/005 , C08L33/02 , C09D125/08 , C09D133/08 , H05K1/0353 , H05K3/0014 , H05K3/0026 , H05K3/0032 , H05K3/107 , H05K3/184 , H05K2201/0112 , H05K2201/0209 , H05K2201/0239 , H05K2203/0264 , H05K2203/0565 , H05K2203/0571
摘要： The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).
摘要翻译：本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。所使用的树脂组合物是当通过在溶剂中溶解通过将树脂组合物作为液体形成的树脂膜2溶解而制备的溶液中的E1表示树脂膜2的每单位重量的吸光度系数的树脂组合物在要照射树脂膜2的光波长处的E1为至少0.01（L /（g·cm））。

10. 发明申请

US20130056247A1 WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE AND MULTILAYER CIRCUIT BOARD 有权
标题翻译：布线方式，表面布线结构，半导体器件，接线板，存储卡，电气设备，模块和多层电路板
公开(公告)号：US20130056247A1
公开(公告)日：2013-03-07
申请号：US13698975
申请日：2011-05-11
申请人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda , Yuko Konno
发明人： Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda , Yuko Konno
IPC分类号： H05K1/02 , H05K3/10
CPC分类号： H05K3/184 , C23C18/1608 , C23C18/1653 , C23C18/1893 , C25D7/0607 , H01L21/4832 , H01L21/6835 , H01L23/3121 , H01L23/49541 , H01L23/49582 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2221/68359 , H01L2221/68377 , H01L2224/24051 , H01L2224/24137 , H01L2224/24145 , H01L2224/24146 , H01L2224/24225 , H01L2224/24226 , H01L2224/24998 , H01L2224/32145 , H01L2224/82001 , H01L2224/82039 , H01L2224/82101 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06568 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H05K1/185 , H05K3/10 , H05K3/284 , H05K3/4644 , H05K2201/10636 , H05K2201/10674 , H05K2203/0264 , H05K2203/072 , H05K2203/0723 , H05K2203/0769 , H05K2203/1407 , H05K2203/1469 , Y02P70/611 , H05K3/4661 , H01L2924/00
摘要： A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.
摘要翻译：提供一种布线方法，其中绝缘层形成在半导体器件1的暴露多个连接端子的表面上，树脂膜形成在绝缘层的表面上，深度等于或超过树脂膜的厚度由树脂膜的表面侧形成，使得沟槽在要连接的连接端子附近通过，此外，连通孔将从该部分到达要连接的连接端子形成沟槽附近的沟槽。

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