专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07767252B2 Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus 有权
标题翻译：多层结构形成方法，制造布线板的方法和电子设备的方法制造
公开(公告)号：US07767252B2
公开(公告)日：2010-08-03
申请号：US11222851
申请日：2005-09-12
申请人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/20
CPC分类号： H05K3/4664 , H01L51/0004 , H05K3/125 , H05K2201/09581 , H05K2201/09909 , H05K2203/013 , H05K2203/1173 , H05K2203/1476
摘要： A droplet discharge apparatus is used in a multilayer structure forming method of the invention. The multilayer structure forming method includes: discharging droplets of a first conductive material to form a first conductive material pattern on a surface of an object; baking the first conductive material pattern to form a wiring pattern; discharging droplets of a first insulating material including a first photo-curable material to form a first insulating material pattern bordering via holes on the wiring pattern; curing the first insulating material pattern to form a first insulating pattern bordering the via holes; making the surface of the object lyophilic; discharging droplets of a second insulating material including a second photo-curable material to form a second insulating material pattern that covers the wiring pattern and the surface of the object which has been made lyophilic, and surrounds the first insulating pattern; and curing the second insulating material pattern to form a second insulating pattern that surrounds the first insulating pattern. In addition, preferably, the first conductive material includes silver (Ag) nanoparticles.
摘要翻译：液滴喷射装置用于本发明的多层结构形成方法中。多层结构形成方法包括：排出第一导电材料的液滴以在物体的表面上形成第一导电材料图案; 烘烤第一导电材料图案以形成布线图案; 排出包括第一可光固化材料的第一绝缘材料的液滴，以形成与布线图案上的通孔邻接的第一绝缘材料图案; 固化第一绝缘材料图案以形成与通孔相邻的第一绝缘图案; 使物体的表面亲液; 排出包含第二可光固化材料的第二绝缘材料的液滴，以形成覆盖所述布线图形和所述物体表面的第二绝缘材料图案，所述第二绝缘材料图案已经被制成亲液性，并围绕所述第一绝缘图案; 以及固化所述第二绝缘材料图案以形成围绕所述第一绝缘图案的第二绝缘图案。此外，优选地，第一导电材料包括银（Ag）纳米颗粒。

2. 发明申请

US20060040489A1 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus 有权
标题翻译：多层结构形成方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US20060040489A1
公开(公告)日：2006-02-23
申请号：US11201100
申请日：2005-08-11
申请人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/4763
CPC分类号： H05K3/4664 , H05K3/125 , H05K2203/013 , Y10S257/921
摘要： There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
摘要翻译：提供一种多层结构形成方法，包括：（A）在基板上形成含有第一光固化材料的第一绝缘材料层; （B）通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; （C）通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴，在半硬化的第一绝缘材料层上形成导电材料层; （D）形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和（E）形成第一绝缘层，位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层，导电材料层和覆盖第一绝缘层和导电层的第二绝缘层第二绝缘材料层。

3. 发明授权

US07250377B2 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus 有权
标题翻译：多层结构形成方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US07250377B2
公开(公告)日：2007-07-31
申请号：US11201100
申请日：2005-08-11
申请人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/31
CPC分类号： H05K3/4664 , H05K3/125 , H05K2203/013 , Y10S257/921
摘要： There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
摘要翻译：提供一种多层结构形成方法，包括：（A）在基板上形成含有第一光固化材料的第一绝缘材料层; （B）通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; （C）通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴，在半硬化的第一绝缘材料层上形成导电材料层; （D）形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和（E）形成第一绝缘层，位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层，导电材料层和覆盖第一绝缘层和导电层的第二绝缘层第二绝缘材料层。

4. 发明申请

US20060068573A1 Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus 有权
标题翻译：多层结构形成方法，制造布线板的方法和电子设备的方法制造
公开(公告)号：US20060068573A1
公开(公告)日：2006-03-30
申请号：US11222851
申请日：2005-09-12
申请人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/20
CPC分类号： H05K3/4664 , H01L51/0004 , H05K3/125 , H05K2201/09581 , H05K2201/09909 , H05K2203/013 , H05K2203/1173 , H05K2203/1476
摘要： A droplet discharge apparatus is used in a multilayer structure forming method of the invention. The multilayer structure forming method includes: discharging droplets of a first conductive material to form a first conductive material pattern on a surface of an object; baking the first conductive material pattern to form a wiring pattern; discharging droplets of a first insulating material including a first photo-curable material to form a first insulating material pattern bordering via holes on the wiring pattern; curing the first insulating material pattern to form a first insulating pattern bordering the via holes; making the surface of the object lyophilic; discharging droplets of a second insulating material including a second photo-curable material to form a second insulating material pattern that covers the wiring pattern and the surface of the object which has been made lyophilic, and surrounds the first insulating pattern; and curing the second insulating material pattern to form a second insulating pattern that surrounds the first insulating pattern. In addition, preferably, the first conductive material includes silver (Ag) nanoparticles.
摘要翻译：液滴喷射装置用于本发明的多层结构形成方法中。多层结构形成方法包括：排出第一导电材料的液滴以在物体的表面上形成第一导电材料图案; 烘烤第一导电材料图案以形成布线图案; 排出包括第一可光固化材料的第一绝缘材料的液滴，以形成与布线图案上的通孔邻接的第一绝缘材料图案; 固化第一绝缘材料图案以形成与通孔相邻的第一绝缘图案; 使物体的表面亲液; 排出包含第二可光固化材料的第二绝缘材料的液滴，以形成覆盖所述布线图形和所述物体表面的第二绝缘材料图案，所述第二绝缘材料图案已经被制成亲液性，并围绕所述第一绝缘图案; 以及固化所述第二绝缘材料图案以形成围绕所述第一绝缘图案的第二绝缘图案。此外，优选地，第一导电材料包括银（Ag）纳米颗粒。

5. 发明申请

US20060060944A1 Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus 有权
标题翻译：形成多层结构的方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US20060060944A1
公开(公告)日：2006-03-23
申请号：US11196677
申请日：2005-08-04
申请人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L29/06 , H01L23/495 , H01L27/082
CPC分类号： H05K3/125 , H01L51/0022 , H01L2924/0002 , H05K3/1208 , H05K3/386 , H05K3/4664 , H05K2203/013 , H05K2203/1173 , H01L2924/00
摘要： A method for forming a multi-layered structure using a droplet-discharging device; the method comprises: (A) forming a first insulating-material layer covering the material-body surface by discharging a droplet of a first insulating material including a first photosensitive resin to a material-body surface; (B) obtaining a first insulating layer by curing in the first insulating-material layer; (C) forming a pattern of an electric conductive material layer on the first insulating layer by discharging a droplet of an electric conductive material to the first insulating layer; and (D) forming a wiring pattern on the first insulating layer by activating the pattern of the electric conductive material layer.
摘要翻译：一种使用液滴喷射装置形成多层结构的方法; 该方法包括：（A）通过将包括第一感光性树脂的第一绝缘材料的液滴喷射到材料体表面而形成覆盖材料体表面的第一绝缘材料层; （B）通过在第一绝缘材料层中固化获得第一绝缘层; （C）通过将导电材料的液滴喷射到第一绝缘层，在第一绝缘层上形成导电材料层的图案; 和（D）通过激活导电材料层的图案在第一绝缘层上形成布线图案。

6. 发明申请

US20070141828A1 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus 有权
公开(公告)号：US20070141828A1
公开(公告)日：2007-06-21
申请号：US11707022
申请日：2007-02-16
申请人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/4763
CPC分类号： H05K3/4664 , H05K3/125 , H05K2203/013 , Y10S257/921
摘要： There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.

7. 发明授权

US07972651B2 Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus 有权
标题翻译：形成多层结构的方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US07972651B2
公开(公告)日：2011-07-05
申请号：US11196677
申请日：2005-08-04
申请人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L29/06
CPC分类号： H05K3/125 , H01L51/0022 , H01L2924/0002 , H05K3/1208 , H05K3/386 , H05K3/4664 , H05K2203/013 , H05K2203/1173 , H01L2924/00
摘要： A method for forming a multi-layered structure using a droplet-discharging device; the method comprises: (A) forming a first insulating-material layer covering the material-body surface by discharging a droplet of a first insulating material including a first photosensitive resin to a material-body surface; (B) obtaining a first insulating layer by curing in the first insulating-material layer; (C) forming a pattern of an electric conductive material layer on the first insulating layer by discharging a droplet of an electric conductive material to the first insulating layer; and (D) forming a wiring pattern on the first insulating layer by activating the pattern of the electric conductive material layer.
摘要翻译：一种使用液滴喷射装置形成多层结构的方法; 该方法包括：（A）通过将包括第一感光性树脂的第一绝缘材料的液滴喷射到材料体表面，形成覆盖材料体表面的第一绝缘材料层; （B）通过在第一绝缘材料层中固化获得第一绝缘层; （C）通过将导电材料的液滴喷射到第一绝缘层，在第一绝缘层上形成导电材料层的图案; 和（D）通过激活导电材料层的图案在第一绝缘层上形成布线图案。

8. 发明授权

US07723243B2 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus 有权
标题翻译：多层结构形成方法，布线基板的制造方法以及电子设备的制造方法
公开(公告)号：US07723243B2
公开(公告)日：2010-05-25
申请号：US11707022
申请日：2007-02-16
申请人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
发明人： Tsuyoshi Shintate , Toshiaki Mikoshiba , Kenji Wada , Kazuaki Sakurada , Jun Yamada
IPC分类号： H01L21/31
CPC分类号： H05K3/4664 , H05K3/125 , H05K2203/013 , Y10S257/921
摘要： There is provided a multi-layered structure forming method comprising: (A) forming a first insulating material layer containing a first photo-curing material on a substrate; (B) semi-hardening the first insulating material layer by radiating light having a first wavelength to the first insulating material layer; (C) forming a conductive material layer on the semi-hardened first insulating material layer by ejecting droplets of a conductive material to the semi-hardened first insulating material layer from a nozzle of a liquid droplet ejecting apparatus; (D) forming a second insulating material layer containing a second photo-curing material so as to cover the semi-hardened first insulating material layer and the conductive material layer; and (E) forming a first insulating layer, a conductive layer positioned on the first insulating material, and a second insulating layer covering the first insulating layer and the conductive layer by simultaneously heating the first insulating material layer, the conductive material layer, and the second insulating material layer.
摘要翻译：提供一种多层结构形成方法，包括：（A）在基板上形成含有第一光固化材料的第一绝缘材料层; （B）通过向第一绝缘材料层照射具有第一波长的光而使第一绝缘材料层半硬化; （C）通过从液滴喷射装置的喷嘴向半硬化的第一绝缘材料层喷射导电材料的液滴，在半硬化的第一绝缘材料层上形成导电材料层; （D）形成包含第二光固化材料的第二绝缘材料层以覆盖半硬化的第一绝缘材料层和导电材料层; 和（E）形成第一绝缘层，位于第一绝缘材料上的导电层和通过同时加热第一绝缘材料层，导电材料层和覆盖第一绝缘层和导电层的第二绝缘层第二绝缘材料层。

9. 发明授权

US07541063B2 Method for forming layer 失效
标题翻译：形成层的方法
公开(公告)号：US07541063B2
公开(公告)日：2009-06-02
申请号：US11530583
申请日：2006-09-11
申请人： Tsuyoshi Shintate , Koichi Mizugaki , Jun Yamada
发明人： Tsuyoshi Shintate , Koichi Mizugaki , Jun Yamada
IPC分类号： B05D5/00
CPC分类号： B41J2/14233
摘要： In a method for forming a layer using a droplet discharging device that discharges droplets from a plurality of nozzles while relatively moving a surface in a first direction with respect to a head including the plurality of nozzles, the method for forming a layer comprises: a) respectively arranging a first droplet on each of two reference regions on the surface and providing two separate patterns corresponding to the two reference regions; b) fixing the two patterns; c) making the surface lyophilic after fixing the two patterns; and d) arranging a second droplet between the two reference regions and connecting the two patterns after making the surface lyophilic.
摘要翻译：在使用液滴排出装置形成层的方法中，用于相对于包括多个喷嘴的头沿第一方向相对移动表面而从多个喷嘴排出液滴的方法，所述形成层的方法包括：a）分别在表面上的两个参考区域中的每一个上布置第一液滴并提供对应于两个参考区域的两个分离的图案; b）固定两种图案; c）在固定两种图案之后使表面亲液; 以及d）在两个参考区域之间布置第二液滴并在使表面亲液化之后连接两个图案。

10. 发明授权

US08322033B2 Method for forming a conductive post for a multilayered wiring substrate 失效
标题翻译：用于形成多层布线基板的导电柱的方法
公开(公告)号：US08322033B2
公开(公告)日：2012-12-04
申请号：US12206800
申请日：2008-09-09
申请人： Toshimitsu Hirai , Tsuyoshi Shintate , Jun Yamada
发明人： Toshimitsu Hirai , Tsuyoshi Shintate , Jun Yamada
IPC分类号： H01R43/16
CPC分类号： H05K3/4069 , H05K1/092 , H05K3/125 , H05K3/4664 , H05K3/4679 , H05K2201/09909 , H05K2203/013 , H05K2203/1131 , H05K2203/1173 , Y10T29/49149 , Y10T29/49155 , Y10T29/49206
摘要： A method for forming a conductive post include: a) forming a liquid repellent portion having a thickness of 100 nm or less by disposing a liquid repellent material in a conductive post forming region on a conductive layer; b) forming an insulation layer having an opening in a region overlapping with the conductive post forming region by disposing a liquid including an insulation layer forming material on the conductive layer having the liquid repellent portion formed thereon and polymerizing the insulation layer forming material; c) disposing metal particulates in the opening; and d) heating the metal particulates at a fusing temperature of the metal particulates or higher so as to fusion bond the metal particulates to each other in order to form the conductive post, and to fusion bond the metal particulates and the conductive layer in order to couple the conductive post with the conductive layer.
摘要翻译：形成导电柱的方法包括：a）通过在导电层上的导电柱形成区域中设置疏液材料，形成厚度为100nm以下的疏液部分; b）通过在其上形成有疏液部分的导电层上设置包括绝缘层形成材料的液体来形成在与导电柱形成区域重叠的区域中具有开口的绝缘层，并使绝缘层形成材料聚合; c）在开口处设置金属微粒; 以及d）在所述金属微粒的熔融温度以上加热所述金属微粒以将所述金属微粒彼此熔合以形成所述导电柱，并将所述金属微粒和所述导电层熔合，以便将导电柱与导电层耦合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式