专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US6080040A Wafer carrier head with inflatable bladder and attack angle control for polishing 失效
标题翻译：晶圆承载头带充气气囊和攻角控制抛光
公开(公告)号：US6080040A
公开(公告)日：2000-06-27
申请号：US965033
申请日：1997-11-05
申请人： Gregory A. Appel , Ethan C. Wilson , Shou-sung Chang
发明人： Gregory A. Appel , Ethan C. Wilson , Shou-sung Chang
IPC分类号： B24B21/04 , B24B37/04 , B24B49/00 , H01L21/304
CPC分类号： B24B49/00 , B24B21/04 , B24B37/04
摘要： A carrier head that holds an object such as a wafer for a polishing system can be rotated during polishing. One such carrier head includes a sensor that determines the relative orientation of (or the angle between) a movable chuck and a fixed drive structure. A control system uses these measurements to select the edge pressure applied to the wafer or the chuck to control the attack angle of the wafer against polishing pads. By actively adjusting the attack angle, a carrier head can accommodate torques about an axis not in the plane of contact between the wafer and the polishing pad even when the wafer is otherwise free to rotate about the axis. One carrier head includes a drive plate with projections ending with balls that are disposed in matching openings in a carrier plate. Radial elongation of openings and curvature of the balls permit rotation of the carrier plate about an axis in plane passing between the carrier and drive plates. Another aspect of the invention provides a flexible bladder connected to a conduit formed in a drive shaft of the carrier head. A wafer is mounted adjacent the bladder so that pressure from the conduit causes the bladder to expand and apply a uniform pressure to the wafer for polishing.
摘要翻译：保持诸如用于抛光系统的晶片的物体的载体头可以在抛光期间旋转。一个这样的载体头包括确定可移动卡盘和固定驱动结构之间的（或其角度）的相对取向的传感器。控制系统使用这些测量来选择施加到晶片或卡盘的边缘压力，以控制晶片对抛光垫的攻角。通过主动地调整攻角，载体头可以适应不是在晶片和抛光垫之间的接触平面中的轴的扭矩，即使当晶片绕其轴线自由旋转时也是如此。一个承载头包括具有以滚珠结束的突起的驱动板，其布置在承载板中的匹配开口中。开口的径向伸长率和滚珠的曲率允许承载板围绕载体和驱动板之间的平面轴线旋转。本发明的另一方面提供一种连接到形成在承载头的驱动轴中的导管的柔性囊。晶片邻近气囊安装，使得来自导管的压力导致气囊膨胀，并向晶片施加均匀的压力用于抛光。

2. 发明授权

US6159083A Polishing head for a chemical mechanical polishing apparatus 失效
标题翻译：抛光头用于化学机械抛光装置
公开(公告)号：US6159083A
公开(公告)日：2000-12-12
申请号：US116160
申请日：1998-07-15
申请人： Gregory A. Appel , Charles J. Regan , David E. Weldon , Shou-sung Chang , Gregory C. Lee
发明人： Gregory A. Appel , Charles J. Regan , David E. Weldon , Shou-sung Chang , Gregory C. Lee
IPC分类号： B24B37/30 , B24B7/22
CPC分类号： B24B37/30 , Y10S977/775 , Y10S977/888
摘要： A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier by a bellows. The polishing head may further include a lift plate disposed on the subcarrier and beneath the bladder member. A method for polishing a substrate includes placing a substrate on the bladder member and positioning the substrate against a polishing pad such that the bladder member applies a selected pressure profile on the substrate.
摘要翻译：用于化学机械抛光（CMP）装置的抛光头。抛光头包括背板，由背板支撑的保持环和由保持环包围的气囊构件。抛光头的背板包括通过波纹管偏压耦合到副载波的驱动板。抛光头还可以包括设置在副载架上并在气囊构件下方的提升板。抛光衬底的方法包括将衬底放置在气囊构件上并将衬底定位在抛光垫上，使得气囊构件在衬底上施加选定的压力分布。

3. 发明授权

US6000997A Temperature regulation in a CMP process 失效
标题翻译： CMP工艺中的温度调节
公开(公告)号：US6000997A
公开(公告)日：1999-12-14
申请号：US113450
申请日：1998-07-10
申请人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
发明人： Shu-Hsin Kao , Shou-sung Chang , Huey M. Tzeng , Gregory C. Lee , Greg Simon , Harry Lee , David E. Weldon , Garry Kwong , William F. Lapson , Gregory A. Appel , Peter Mok
IPC分类号： B24B21/04 , B24B37/015 , B24B49/14
CPC分类号： B24B37/015 , B24B21/04
摘要： Heat is transferred between a linear CMP belt and an adjacent heat transfer source, providing a predetermined lateral temperature distribution across the belt. Temperature sensors generate feedback signals to control the heat transfer sources. Alternatively, process monitoring sensors provide feedback signals. The heat transfer source can include multiple selectively controllable individual heat transfer sources having differing temperatures, which can be above or below ambient temperature. The mechanism of heat transfer can include one or more of convection, conduction, and radiation. The configuration provides substantial flexibility to establish and maintain selective non-uniform temperature distributions across the polishing belt. This in turn permits precise control and stability of the polishing process. Heat transfer sources can include pulleys, slurry dispensers, polishing pad conditioners or conditioner back supports, fluid nozzles, and sealed fluid cavity belt supports.
摘要翻译：热量在线性CMP带和相邻的传热源之间传递，从而提供穿过带的预定横向温度分布。温度传感器产生反馈信号来控制传热源。或者，过程监控传感器提供反馈信号。传热源可以包括具有不同温度的多个选择性可控的单个热传递源，其可以高于或低于环境温度。传热的机理可以包括一个或多个对流，传导和辐射。该配置提供了大量灵活性，以建立和保持穿过抛光带的选择性不均匀的温度分布。这又允许精确的控制和抛光过程的稳定性。传热源可以包括滑轮，浆液分配器，抛光垫调节器或调节器背部支撑件，流体喷嘴和密封的流体腔体带支撑件。

4. 发明授权

US6062961A Wafer polishing head drive 失效
标题翻译：晶圆抛光头驱动
公开(公告)号：US6062961A
公开(公告)日：2000-05-16
申请号：US964817
申请日：1997-11-05
申请人： Linh X. Can , Kelvin Lum , Gregory A. Appel
发明人： Linh X. Can , Kelvin Lum , Gregory A. Appel
IPC分类号： B24B21/04 , B24B37/04 , B24B41/06
CPC分类号： B24B37/04 , B24B21/04
摘要： A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion. The pivot mechanism includes a hollow shaft connected to said head drive housing; and a motor, gearbox and a ball screw and nut assembly in driving connection between the gearbox and the hollow shaft for transversing in a direction parallel to the belt.
摘要翻译：晶片抛光头驱动器包括头驱动器壳体; 当所述头驱动器壳体和头部部分处于水平方向时，从所述壳体延伸的用于安装未抛光晶片的头部; 从所述头驱动壳体延伸的枢转机构，用于将所述头驱动器壳体和所述头部部分从所述水平定向枢转到与所述连续旋转抛光带的横向垂直部分并置的垂直取向; 壳体中的驱动器，用于将头部部分和安装的晶片从壳体向外移动旋转抛光带的横向垂直部分; 以及用于旋转头部和安装的晶片的壳体中的驱动。头驱动器壳体可以从垂直于带横向垂直部分或从带横向垂直部分平行延伸的摆动弧中扫掠的弧线从竖直方向枢转。枢转机构包括连接到所述头驱动器壳体的空心轴; 以及在齿轮箱和中空轴之间的驱动连接中的马达，齿轮箱和滚珠丝杠和螺母组件，用于在平行于带的方向上横切。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式