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1. 发明授权

US07927190B2 Retaining ring with shaped surface 有权
公开(公告)号：US07927190B2
公开(公告)日：2011-04-19
申请号：US12049650
申请日：2008-03-17
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B5/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

2. 发明授权

US08585468B2 Retaining ring with shaped surface 有权
公开(公告)号：US08585468B2
公开(公告)日：2013-11-19
申请号：US13305589
申请日：2011-11-28
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B5/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

3. 发明申请

US20120071067A1 RETAINING RING WITH SHAPED SURFACE 有权
标题翻译：具有形状表面的保持环
公开(公告)号：US20120071067A1
公开(公告)日：2012-03-22
申请号：US13305589
申请日：2011-11-28
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B41/06
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨期间，可以允许环围绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

4. 发明申请

US20110195639A1 RETAINING RING WITH SHAPED SURFACE 有权
标题翻译：具有形状表面的保持环
公开(公告)号：US20110195639A1
公开(公告)日：2011-08-11
申请号：US13089174
申请日：2011-04-18
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B1/00 , B23P19/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨过程中，可以允许环绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

5. 发明授权

US07530153B2 Attaching components of a carrier head 失效
标题翻译：安装承载头的部件
公开(公告)号：US07530153B2
公开(公告)日：2009-05-12
申请号：US11233154
申请日：2005-09-21
申请人： Trung T. Doan , Jeffrey Schmidt , Douglas R. McAllister , Stacy Meyer
发明人： Trung T. Doan , Jeffrey Schmidt , Douglas R. McAllister , Stacy Meyer
IPC分类号： B23P11/00 , B23P19/00 , B23P21/00 , B23Q17/00 , B23Q17/24
CPC分类号： B24B37/32 , Y10T29/49764 , Y10T29/49766 , Y10T29/49769 , Y10T29/49771 , Y10T29/49778 , Y10T29/4978 , Y10T29/49947 , Y10T29/53039 , Y10T29/5343
摘要： Techniques for attaching a retaining ring to a carrier head so that the bottom surface of the retaining ring is orthogonal to a central rotational axis of the carrier head are described.
摘要翻译：描述了用于将保持环附接到承载头使得保持环的底表面与载体头的中心旋转轴线正交的技术。

6. 发明申请

US20080196833A1 RETAINING RING WITH SHAPED SURFACE 有权
标题翻译：具有形状表面的保持环
公开(公告)号：US20080196833A1
公开(公告)日：2008-08-21
申请号：US12049650
申请日：2008-03-17
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： H01L21/306 , B24B1/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨期间，可以允许环围绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

7. 发明授权

US07344434B2 Retaining ring with shaped surface 有权
标题翻译：带环形表面的保持环
公开(公告)号：US07344434B2
公开(公告)日：2008-03-18
申请号：US10988211
申请日：2004-11-12
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Stacy Meyer , Trung T. Doan , Daniel Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Stacy Meyer , Trung T. Doan , Daniel Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B5/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨期间，可以允许环围绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

8. 发明授权

US08066551B2 Retaining ring with shaped surface 有权
标题翻译：带环形表面的保持环
公开(公告)号：US08066551B2
公开(公告)日：2011-11-29
申请号：US13089174
申请日：2011-04-18
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B1/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨期间，可以允许环围绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

9. 发明授权

US08384192B2 Methods for forming small-scale capacitor structures 有权
标题翻译：形成小型电容器结构的方法
公开(公告)号：US08384192B2
公开(公告)日：2013-02-26
申请号：US13047430
申请日：2011-03-14
申请人： Lingyi A. Zheng , Trung T. Doan , Lyle D. Breiner , Er-Xuan Ping , Kevin L. Beaman , Ronald A. Weimer , Cem Basceri , David J. Kubista
发明人： Lingyi A. Zheng , Trung T. Doan , Lyle D. Breiner , Er-Xuan Ping , Kevin L. Beaman , Ronald A. Weimer , Cem Basceri , David J. Kubista
IPC分类号： H01L21/02
CPC分类号： H01L28/40 , H01L21/3141 , H01L27/10852 , H01L28/60 , H01L28/84
摘要： The present disclosure provides small scale capacitors (e.g., DRAM capacitors) and methods of forming such capacitors. One exemplary implementation provides a method of fabricating a capacitor that includes sequentially forming a first electrode, a dielectric layer, and a second electrode. At least one of the electrodes may be formed by a) reacting two precursors to deposit a first conductive layer at a first deposition rate, and b) depositing a second conductive layer at a second, lower deposition rate by depositing a precursor layer of one precursor at least one monolayer thick and exposing that precursor layer to another precursor to form a nanolayer reaction product. The second conductive layer may be in contact with the dielectric layer and have a thickness of no greater than about 50 Å.
摘要翻译：本公开提供小尺寸电容器（例如，DRAM电容器）以及形成这种电容器的方法。一个示例性实施例提供了一种制造电容器的方法，该电容器包括顺序地形成第一电极，电介质层和第二电极。可以通过以下方式形成至少一个电极：a）使两个前体反应以第一沉积速率沉积第一导电层，以及b）通过沉积一个前体的前体层以第二较低沉积速率沉积第二导电层至少一层单层，并将该前体层暴露于另一种前体以形成纳米层反应产物。第二导电层可以与介电层接触并具有不大于约的厚度。

10. 发明授权

US08124491B2 Container capacitor structure and method of formation thereof 失效
标题翻译：集装箱电容器结构及其形成方法
公开(公告)号：US08124491B2
公开(公告)日：2012-02-28
申请号：US12547197
申请日：2009-08-25
申请人： D. Mark Durcan , Trung T. Doan , Roger R. Lee , Fernando Gonzalez
发明人： D. Mark Durcan , Trung T. Doan , Roger R. Lee , Fernando Gonzalez
IPC分类号： H01L21/8242
CPC分类号： H01L28/91 , H01L27/10811 , H01L27/10817 , H01L27/10852 , H01L27/10888 , H01L28/65 , Y10S257/905
摘要： Disclosed is a container capacitor structure and method of constructing it. An etch mask and etch are used to expose portions of an exterior surface of electrode (“bottom electrodes”) of the container capacitor structure. The etch provides a recess between proximal pairs of container capacitor structures, which recess is available for forming additional capacitance. Accordingly, a capacitor dielectric and a top electrode are formed on and adjacent to, respectively, both an interior surface and portions of the exterior surface of the first electrode. Advantageously, surface area common to both the first electrode and second electrodes is increased over using only the interior surface, which provides additional capacitance without a decrease in spacing for clearing portions of the capacitor dielectric and the second electrode away from a contact hole location. Furthermore, such clearing of the capacitor dielectric and the second electrode portions may be done at an upper location of a substrate assembly in contrast to clearing at a bottom location of a contact via.
摘要翻译：公开了一种容器电容器结构及其构造方法。蚀刻掩模和蚀刻用于暴露容器电容器结构的电极（“底部电极”）的外部表面的部分。蚀刻在容器电容器结构的近端对之间提供凹槽，该凹槽可用于形成额外的电容。因此，电容器电介质和顶电极分别形成在第一电极的外表面的内表面和部分上并相邻。有利地，仅使用内表面增加了第一电极和第二电极两者共同的表面积，这提供了额外的电容，而不会减小用于清除电容器电介质部分和第二电极远离接触孔位置的间隔。此外，与在接触通孔的底部位置处的清除相反，电容器电介质和第二电极部分的这种清除可以在衬底组件的上部位置进行。

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