专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07543376B2 Manufacturing method of flexible printed wiring board 失效
标题翻译：柔性印刷电路板的制造方法
公开(公告)号：US07543376B2
公开(公告)日：2009-06-09
申请号：US11622950
申请日：2007-01-12
申请人： Toyokazu Yoshino , Katsuya Okamoto , Shigeki Ogata , Shinji Morimoto , Kouji Nakashima
发明人： Toyokazu Yoshino , Katsuya Okamoto , Shigeki Ogata , Shinji Morimoto , Kouji Nakashima
IPC分类号： H01K3/10
CPC分类号： H05K3/4046 , H05K1/0393 , H05K3/386 , H05K3/4084 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K3/4635 , H05K2201/0195 , H05K2201/0221 , H05K2201/0379 , H05K2201/043 , H05K2201/096 , H05K2201/10234 , H05K2201/10416 , H05K2203/0278 , H05K2203/041 , H05K2203/082 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49213
摘要： Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed. As a result, the contact area between the wiring layers 3 and 4 and the conductor 6 filled in the conductor press-fit hole 5 can be enlarged to retain the contact strength between the wiring layers 3 and 4 and the conductor 6 sufficiently thereby to provide a high connection reliability for the layer connection.
摘要翻译：提供一种FPC，其包括绝缘层2，层叠在绝缘层2上方和下方的布线层3和4以及用于电连接布线层3和4的层连接。层连接构成为包括：延伸穿过绝缘层2和上下布线层3和4的锥形导体压入孔5，并扩展到一个布线层3的侧面; 导体6在导体压配合孔内填充并压配合而没有任何间隙，使其接合到变形为导体压配合孔5的锥形的布线上层3，并从另一个突出布线下层4以使其表面部分涂覆和接合。结果，可以扩大布线层3和4与填充在导体压入孔5中的导体6之间的接触面积，以充分地保持布线层3和4与导体6之间的接触强度，从而提供层连接的高连接可靠性。

2. 发明授权

US07488408B2 Tin-plated film and method for producing the same 有权
标题翻译：镀锡膜及其制造方法
公开(公告)号：US07488408B2
公开(公告)日：2009-02-10
申请号：US11184079
申请日：2005-07-19
申请人： Hisahiro Tanaka , Shigeki Ogata
发明人： Hisahiro Tanaka , Shigeki Ogata
IPC分类号： C25D5/50 , C25D3/30
CPC分类号： H01L23/49582 , C25D5/505 , C25F3/02 , H01L2224/32245 , H01L2924/15173 , Y10S428/929 , Y10T428/12715
摘要： The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.
摘要翻译：本发明的目的是提供一种镀锡膜及其制造方法，其能够防止产生晶须，同时防止未被镀锡膜覆盖的基板表面，由于氧化引起的变色，通过其可以防止晶须生成的抑制，晶须生长的抑制以及防止被镀基板的变色，从而确保了优异的生产率。该方法具有以下步骤：去除在铜或铜合金上形成的一部分镀锡膜; 处理以防止除去镀锡膜的铜或铜合金的变色; 并对被加工成防止变色的铜或铜合金的镀锡膜施加热能。

3. 发明申请

US20060016694A1 Tin-plated film and method for producing the same 有权
公开(公告)号：US20060016694A1
公开(公告)日：2006-01-26
申请号：US11184079
申请日：2005-07-19
申请人： Hisahiro Tanaka , Shigeki Ogata
发明人： Hisahiro Tanaka , Shigeki Ogata
IPC分类号： C25D3/30
CPC分类号： H01L23/49582 , C25D5/505 , C25F3/02 , H01L2224/32245 , H01L2924/15173 , Y10S428/929 , Y10T428/12715
摘要： The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式