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热词
    • 8. 发明授权
    • Method of manufacturing a circuit board
    • 制造电路板的方法
    • US06666964B2
    • 2003-12-23
    • US10026660
    • 2001-12-27
    • Hisahiro Tanaka
    • Hisahiro Tanaka
    • C25D502
    • H05K3/244H01L23/49827H01L2924/0002H05K1/112H05K2201/0394H05K2201/09472Y10T29/49165H01L2924/00
    • A circuit board comprising an insulating substrate, via-holes made in the insulating substrate, and a wiring conductor having at least one layer disposed on the insulating substrate. The circuit board is characterized in that a gold-plated layer of the wiring conductor exposed to the inside of the via-hole is thinner than a gold-plated layer of the wiring conductor exposed to a portion other than the inside of the via-hole in the insulating substrate. A method of manufacturing the circuit board is characterized in that gold electroplating of the wiring conductor is performed with the open-end of the via-hole contacted on a shielding board in a plating bath. The present invention provides a circuit board capable of satisfying the requirements for long-lasting strength of solder ball junction and good wire bonding ability at the same time.
    • 一种电路板,包括绝缘衬底,在绝缘衬底中制成的通孔,以及布线导体,其具有设置在绝缘衬底上的至少一层。 电路板的特征在于,露出到通孔内部的布线导体的镀金层比暴露于通孔内部以外的部分的布线导体的镀金层薄 在绝缘基板中。 制造电路板的方法的特征在于,在电镀槽中的屏蔽板上接触的通孔的开口端进行布线导体的金电镀。 本发明提供一种电路板,能够同时满足焊球接头的持久强度和良好的引线接合能力的要求。