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1. 发明授权

US06912761B2 Method of producing multilayer piezoelectric resonator 有权
标题翻译：生产多层压电谐振器的方法
公开(公告)号：US06912761B2
公开(公告)日：2005-07-05
申请号：US10269367
申请日：2002-10-12
申请人： Toshiyuki Yasugi , Yuji Fujino , Shoichi Kawabata , Mamoru Ogawa
发明人： Toshiyuki Yasugi , Yuji Fujino , Shoichi Kawabata , Mamoru Ogawa
IPC分类号： H01L41/22 , H01L41/083 , H01L41/338 , H01L41/339 , H03H3/02 , H04R17/00 , H01L41/04 , H01L41/08 , H01L41/18 , H01L2/00
CPC分类号： H01L41/273 , H01L41/338 , H03H3/02 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49789 , Y10T29/49798
摘要： A method of producing a piezoeIectric resonator includes the steps of forming first to third internal electrodes by printing an electrically conductive paste onto a green sheet, punching out portions of the green sheet having the first to third internal electrodes formed thereon, so that at least three types of green sheets are punched out with a location of the internal electrode serving as a reference location, in which the first sheet is punched out by shifting a punching location by a first shift amount in a first direction with respect to the reference location, the second sheet is punched out by shifting a punching location by the first shift amount in a direction opposite to the first direction, and the third sheet is punched out at the reference location, forming a layered body by stacking the punched out green sheets, and forming a unit by cutting the layered body.
摘要翻译：制造压电谐振器的方法包括以下步骤：通过将导电浆料印刷在生片上形成第一至第三内部电极，冲压其上形成有第一至第三内部电极的生片的部分，使得至少三个用内部电极的位置作为基准位置冲压生坯片的类型，其中通过相对于参考位置沿第一方向移动冲压位置第一移位量来冲压第一片材，通过以与第一方向相反的方向移动冲压位置第一移位量来冲压第二片材，并且在参考位置冲压第三片材，通过堆叠冲压的生片材形成层叠体，并形成一个单位通过切割分层体。

2. 发明授权

US6097134A Piezoelectric resonator and electronic component including same 失效
标题翻译：压电谐振器和包括其的电子部件
公开(公告)号：US6097134A
公开(公告)日：2000-08-01
申请号：US64327
申请日：1998-04-22
申请人： Shoichi Kawabata , Toshihiko Unami , Takashi Mizuguchi , Jiro Inoue , Mamoru Ogawa , Toshiyuki Baba , Toshio Nishimura
发明人： Shoichi Kawabata , Toshihiko Unami , Takashi Mizuguchi , Jiro Inoue , Mamoru Ogawa , Toshiyuki Baba , Toshio Nishimura
IPC分类号： H03H9/05 , H03H9/10 , H03H9/60 , H01L41/08
CPC分类号： H03H9/1014 , H03H9/178 , H03H9/605
摘要： A piezoelectric resonator having a small spurious resonance and a large difference .DELTA.F between the resonant frequency and the antiresonant frequency has a compact size and an external electrode has a structure which prevents damage or breaking of the external electrode. The piezoelectric resonator has a substantially rectangular-parallelepiped base member which includes a plurality of laminated piezoelectric layers. A middle portion of the piezoelectric layers is polarized in opposite directions relative to each other. On main surfaces of the middle part of the piezoelectric layers, first and second groups of inner electrodes and are exposed alternately at both side surfaces of the base member. On both side surfaces of the base member, first and second external electrodes are arranged so as to alternately connect to the first and second groups of inner electrodes.
摘要翻译：在谐振频率和反谐振频率之间具有小的寄生谐振和较大差ΔTA的压电谐振器具有紧凑的尺寸，并且外部电极具有防止外部电极损坏或断裂的结构。压电谐振器具有大致矩形平行六面体的基体，其包括多个层压压电层。压电层的中间部分相对于彼此在相反方向上极化。在压电层的中间部分的主表面上，第一和第二组内部电极在基体的两个侧表面交替暴露。在基体的两个侧表面上，第一和第二外部电极被布置成交替地连接到第一和第二组内部电极。

3. 发明申请

US20100148491A1 FLUID LINE COUPLING 有权
标题翻译：流体线耦合
公开(公告)号：US20100148491A1
公开(公告)日：2010-06-17
申请号：US12600696
申请日：2008-05-09
申请人： Yasuki Takenaka , Mamoru Ogawa , Norio Yokoo
发明人： Yasuki Takenaka , Mamoru Ogawa , Norio Yokoo
IPC分类号： F16L35/00
CPC分类号： F16L37/0985
摘要： The invention relates to a fluid line coupling which has a receiving part (1) and a locking part (15) which can be connected to the receiving part (1) and on which is formed a number of elastically resilient spring tongues (18) which are designed for engaging behind an annular collar (29) which is formed on a plug-in part (28) which is to be inserted into the receiving part (1). Also provided is a securing part (20) on which is formed a number, corresponding to the number of spring tongues (18), of elongate securing arms (22). Guide means (7; 24, 25) are formed on the securing part (20) and on the receiving part (1), which guide means (7; 24, 25) are in engagement with one another for the movement of the securing part (20) in relation to the receiving part (1). In a securing position of the securing part (20), each securing arm (22) bears at the outside against a respectively associated spring tongue (18) and prevents the latter from deflecting outward. The plug-in part (28) is thereby secured, with a very high pull-out force, so as to be prevented from being pulled out of the receiving part (1).
摘要翻译：本发明涉及一种具有接收部分（1）和可连接到接收部分（1）的锁定部分（15）的流体管线联接器，在该部件上形成有多个弹性弹性舌片（18），弹性舌片被设计用于接合在形成在插入到接收部分（1）中的插入部分（28）上的环形套环（29）的后面。还设置有固定部分（20），数目相应于细长固定臂（22）的弹簧舌片（18）的数量形成。引导装置（7; 24,25）形成在固定部分（20）上和接收部分（1）上，该引导装置（7; 24,25）彼此接合以便固定部分（20）相对于接收部分（1）。在固定部分（20）的固定位置中，每个固定臂（22）在外侧抵靠着相应的弹簧舌（18），并防止其向外偏转。因此，插拔部件28以非常高的拉出力固定，以防止从接收部件（1）拉出。

4. 发明授权

US5916395A Method for fabricating ceramic electronic parts 失效
标题翻译：陶瓷电子零件的制造方法
公开(公告)号：US5916395A
公开(公告)日：1999-06-29
申请号：US804896
申请日：1997-02-24
申请人： Mamoru Ogawa , Takashi Noji , Keiichi Inoue
发明人： Mamoru Ogawa , Takashi Noji , Keiichi Inoue
IPC分类号： H01G13/00 , B32B31/00
CPC分类号： H01G13/006 , Y10T156/1089 , Y10T29/49224
摘要： A method for fabricating ceramic electronic parts allows external electrodes to be baked onto the electronic parts without overlaying powder on the sagger. An adhesive material layer is provided on a surface of a sagger on which electronic parts are placed. The sagger is inserted into a firing oven with the electronic parts adhesively fixed onto the adhesive material layer, whereby the external electrodes of the electronic parts are baked. The adhesive layer burns away during the firing process. The method including such steps eliminates the need of overlaying powder onto the sagger, so that no powder sticks to the external electrodes after baking, so that the process of removing powder is no longer necessitated.
摘要翻译：制造陶瓷电子部件的方法允许将外部电极烘烤到电子部件上，而不会在粉碎机上重叠粉末。粘合材料层设置在其上放置有电子部件的砧座的表面上。将s子插入烧成炉中，将电子部件粘合地固定在粘合材料层上，由此烘烤电子部件的外部电极。在烧制过程中，粘合剂层烧掉。包括这样的步骤的方法消除了将粉末重叠在s子上的需要，使得烘烤后没有粉末粘附到外部电极，因此不再需要除去粉末的过程。

5. 发明授权

US06507139B1 Apparatus having an electronic component located on a surface of a package member with a space therebetween 失效
公开(公告)号：US06507139B1
公开(公告)日：2003-01-14
申请号：US09109333
申请日：1998-06-30
申请人： Satoshi Ishino , Kenji Kubota , Tsuyoshi Saito , Michinobu Maesaka , Mamoru Ogawa , Jiro Inoue , Hiroaki Kaida
发明人： Satoshi Ishino , Kenji Kubota , Tsuyoshi Saito , Michinobu Maesaka , Mamoru Ogawa , Jiro Inoue , Hiroaki Kaida
IPC分类号： H01L4108
CPC分类号： H03H9/0514 , H01L2224/16225 , H01L2924/16195 , H03H9/0557 , H03H9/1014 , Y10T29/42 , Y10T29/49146 , Y10T29/49162 , Y10T29/49163 , Y10T29/49171
摘要： An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.

6. 发明授权

US5726361A Vibrational processing apparatus and method 失效
公开(公告)号：US5726361A
公开(公告)日：1998-03-10
申请号：US687074
申请日：1996-07-15
申请人： Mamoru Ogawa
发明人： Mamoru Ogawa
IPC分类号： B24B1/04 , C25D5/22 , C25D17/26 , C25D21/10 , F16H37/06 , C25D17/00
CPC分类号： C25D5/22
摘要： In a plating apparatus 10, a known control signal for detection is supplied from a computer 50 to a motor 13 in advance; the motor 13 is rotated at a variable speed within a predetermined range; and the displacement of a basket 18 is detected by a displacement sensor 30 to obtain displacement characteristics data. Next, the computer 50 controls the rotating operation of the motor 13 through a motor controller 60 to put the basket 18 in a desired optimum state of vibration using the obtained displacement characteristics data and data of an optimum amplitude for the plating process obtained in advance.

7. 发明授权

US08205912B2 Fluid line coupling 有权
标题翻译：流体线耦合
公开(公告)号：US08205912B2
公开(公告)日：2012-06-26
申请号：US12600696
申请日：2008-05-09
申请人： Yasuki Takenaka , Mamoru Ogawa , Norio Yokoo
发明人： Yasuki Takenaka , Mamoru Ogawa , Norio Yokoo
IPC分类号： F16L35/00
CPC分类号： F16L37/0985
摘要： A fluid line coupling includes a receiving part and a locking part connectable to the receiving part. The locking part includes a plurality of elastically resilient spring tongues engageable behind an annular collar formed on a plug-in part that is insertable into the receiving part. A securing part includes a plurality of elongate securing arms. Guide elements are formed on the securing part and the receiving part that are engagable with one another to displace the securing part in relation to the receiving part. In a securing position of the securing part, each securing arm bears against a respective associated spring tongue and prevents the spring tongue from deflecting outwardly. In this manner, the plug-in part is secured by a very high pull-out force against being pulled out of the receiving part.
摘要翻译：流体管线联接器包括接收部件和可连接到接收部件的锁定部件。锁定部分包括多个弹性弹性舌片，该弹簧舌片可接合在可插入接收部件的插入部分上形成的环形套环的后面。固定部分包括多个细长的固定臂。引导元件形成在可接合的固定部分和接收部分上，以相对于接收部分移动固定部分。在固定部分的固定位置，每个固定臂抵靠相应的相关弹簧舌片并防止弹簧舌片向外偏转。以这种方式，插入部分被非常高的拉出力固定，以防止从接收部分拉出。

8. 发明授权

US06871388B2 Method of forming an electronic component located on a surface of a package member with a space therebetween 有权
标题翻译：形成位于封装构件的表面上的电子元件之间具有空间的方法
公开(公告)号：US06871388B2
公开(公告)日：2005-03-29
申请号：US10303421
申请日：2002-11-25
申请人： Satoshi Ishino , Kenji Kubota , Tsuyoshi Saito , Michinobu Maesaka , Mamoru Ogawa , Jiro Inoue , Hiroaki Kaida
发明人： Satoshi Ishino , Kenji Kubota , Tsuyoshi Saito , Michinobu Maesaka , Mamoru Ogawa , Jiro Inoue , Hiroaki Kaida
IPC分类号： H01L23/12 , H03H9/02 , H03H9/10 , H03H9/17 , H04R17/00
CPC分类号： H03H9/0514 , H01L2224/16225 , H01L2924/16195 , H03H9/0557 , H03H9/1014 , Y10T29/42 , Y10T29/49146 , Y10T29/49162 , Y10T29/49163 , Y10T29/49171
摘要： A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green sheet laminate at positions where via hole electrodes are to be located, applying conductive material into the through holes so as to fill the through holes and so as to be located on the upper surface of the ceramic green sheet laminate to form via hole electrodes, and sintering the ceramic green sheet laminate to form a substrate and so as to form protruding portions of the via hole electrodes which protrude upward from the upper surface of the substrate.
摘要翻译：形成电子部件的方法包括在支撑膜上层叠陶瓷生片以获得陶瓷生片层叠体，在通孔电极所在的位置处形成穿过陶瓷生片层叠体的通孔，将导电材料施加到通孔孔，以便填充通孔并且位于陶瓷生片层压板的上表面上以形成通孔电极，并且烧结陶瓷生片层压体以形成基底，从而形成突出部分从基板的上表面向上突出的通孔电极。

9. 发明授权

US5989726A Multi-layer ceramic electronic part 失效
标题翻译：多层陶瓷电子部件
公开(公告)号：US5989726A
公开(公告)日：1999-11-23
申请号：US886432
申请日：1997-07-02
申请人： Takashi Noji , Mamoru Ogawa
发明人： Takashi Noji , Mamoru Ogawa
IPC分类号： H01G4/12 , B32B18/00 , H01G2/06 , B32B15/00
CPC分类号： B32B18/00 , C04B2237/32 , C04B2237/68 , C04B2237/704 , Y10T428/12347 , Y10T428/12389 , Y10T428/12451 , Y10T428/12493 , Y10T428/12528 , Y10T428/12583 , Y10T428/12597 , Y10T428/12674 , Y10T428/12993
摘要： A highly reliable multi-layer ceramic electronic part in which is compact, in which cracks tend not to occur in the ceramic element even in cases where it is handled in bulk by a chip mounting device. A plurality of electrodes (internal electrodes) are disposed within a ceramic element whose length L.ltoreq.1.0 mm, height H.ltoreq.0.5 mm and width W.ltoreq.0.5 mm. The thickness t.sub.1 of a ceramic outer layer portion of the multi-layer ceramic electronic part, is 0.15 mm or less. The thickness of the ceramic outer layer portion t.sub.1 and the thickness t.sub.2 of the portion where the internal electrodes are disposed have the relationship 1/4 t.sub.2 .ltoreq.t.sub.1.ltoreq.1/3 t.sub.2.
摘要翻译：即使在通过芯片安装装置大量处理的情况下，陶瓷元件中也不会发生龟裂的高度可靠的多层陶瓷电子部件。多个电极（内部电极）设置在长度L <1.0mm，高度H <0.5mm，宽度W <0.5mm的陶瓷元件内。多层陶瓷电子部件的陶瓷外层部的厚度t1为0.15mm以下。陶瓷外层部分t1的厚度和内部电极配置部分的厚度t2具有关系+ E，fra 1/4 + EE t2

10. 发明授权

US6028390A Piezoelectric resonator and electronic component including same 失效
标题翻译：压电谐振器和包括其的电子部件
公开(公告)号：US6028390A
公开(公告)日：2000-02-22
申请号：US65998
申请日：1998-04-24
申请人： Mamoru Ogawa , Toshio Nishimura , Toshiyuki Baba , Jiro Inoue , Shigemasa Kusabiraki , Tetsuo Takeshima , Takeshi Yamazaki
发明人： Mamoru Ogawa , Toshio Nishimura , Toshiyuki Baba , Jiro Inoue , Shigemasa Kusabiraki , Tetsuo Takeshima , Takeshi Yamazaki
IPC分类号： H03H9/02 , H03H9/05 , H03H9/10 , H03H9/17 , H03H9/58 , H03H9/60 , H05K3/30 , H01L41/053
CPC分类号： H03H9/1014 , H03H9/178 , H03H9/605 , H05K3/303
摘要： A piezoelectric resonator includes a piezoelectric resonator element vibrating in a longitudinal vibration mode and having a mounting surface, wherein a resin material is provided on the mounting surface of the piezoelectric resonator element, and the resin material has a hardness of about 0 to about 50 in units defined in the JIS-A standards and/or an elastic modulus of about 0.1 to 10 MPa.
摘要翻译：压电谐振器包括以纵向振动模式振动并具有安装表面的压电谐振元件，其中树脂材料设置在压电谐振元件的安装表面上，并且树脂材料具有约0至约50的硬度 JIS-A标准中定义的单位和/或约0.1〜10MPa的弹性模量。

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