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1. 发明授权

US6097134A Piezoelectric resonator and electronic component including same 失效
标题翻译：压电谐振器和包括其的电子部件
公开(公告)号：US6097134A
公开(公告)日：2000-08-01
申请号：US64327
申请日：1998-04-22
申请人： Shoichi Kawabata , Toshihiko Unami , Takashi Mizuguchi , Jiro Inoue , Mamoru Ogawa , Toshiyuki Baba , Toshio Nishimura
发明人： Shoichi Kawabata , Toshihiko Unami , Takashi Mizuguchi , Jiro Inoue , Mamoru Ogawa , Toshiyuki Baba , Toshio Nishimura
IPC分类号： H03H9/05 , H03H9/10 , H03H9/60 , H01L41/08
CPC分类号： H03H9/1014 , H03H9/178 , H03H9/605
摘要： A piezoelectric resonator having a small spurious resonance and a large difference .DELTA.F between the resonant frequency and the antiresonant frequency has a compact size and an external electrode has a structure which prevents damage or breaking of the external electrode. The piezoelectric resonator has a substantially rectangular-parallelepiped base member which includes a plurality of laminated piezoelectric layers. A middle portion of the piezoelectric layers is polarized in opposite directions relative to each other. On main surfaces of the middle part of the piezoelectric layers, first and second groups of inner electrodes and are exposed alternately at both side surfaces of the base member. On both side surfaces of the base member, first and second external electrodes are arranged so as to alternately connect to the first and second groups of inner electrodes.
摘要翻译：在谐振频率和反谐振频率之间具有小的寄生谐振和较大差ΔTA的压电谐振器具有紧凑的尺寸，并且外部电极具有防止外部电极损坏或断裂的结构。压电谐振器具有大致矩形平行六面体的基体，其包括多个层压压电层。压电层的中间部分相对于彼此在相反方向上极化。在压电层的中间部分的主表面上，第一和第二组内部电极在基体的两个侧表面交替暴露。在基体的两个侧表面上，第一和第二外部电极被布置成交替地连接到第一和第二组内部电极。

2. 发明授权

US06800189B2 Method of forming insulating film of conductive cap by anodizing or electrodeposition 有权
标题翻译：通过阳极氧化或电沉积形成导电帽绝缘膜的方法
公开(公告)号：US06800189B2
公开(公告)日：2004-10-05
申请号：US10192666
申请日：2002-07-11
申请人： Toshiyuki Baba , Toshio Nishimura , Tsuyoshi Kitagawa , Jiro Inoue , Shoichi Kawabata
发明人： Toshiyuki Baba , Toshio Nishimura , Tsuyoshi Kitagawa , Jiro Inoue , Shoichi Kawabata
IPC分类号： C25D1100
CPC分类号： H01L21/4803 , H01L23/06 , H01L23/10 , H01L2224/16 , H01L2924/01068 , H01L2924/01078 , H01L2924/09701 , H01L2924/16152 , H01L2924/3011 , H01L2924/3025
摘要： A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.
摘要翻译：用于电子部件的导电盖在其底部具有开口，并被构造成在盖的开口部分处固定到电子部件的基板的上表面，以至少覆盖电子元件安装在具有设置在其上的端子电极的基板的上表面上。开口的端面及其内表面和外表面在端表面附近和附近设置有设置在其上的绝缘膜。

3. 发明授权

US06866893B2 Conductive cap, electronic component, and method of forming insulating film of conductive cap 有权
标题翻译：导电帽，电子部件和形成导电帽绝缘膜的方法
公开(公告)号：US06866893B2
公开(公告)日：2005-03-15
申请号：US10192665
申请日：2002-07-11
申请人： Toshiyuki Baba , Toshio Nishimura , Tsuyoshi Kitagawa , Jiro Inoue , Shoichi Kawabata
发明人： Toshiyuki Baba , Toshio Nishimura , Tsuyoshi Kitagawa , Jiro Inoue , Shoichi Kawabata
IPC分类号： H01L41/08 , H01L21/48 , H01L23/02 , H01L23/06 , H01L23/10 , B05D3/02
CPC分类号： H01L21/4803 , H01L23/06 , H01L23/10 , H01L2224/16 , H01L2924/01068 , H01L2924/01078 , H01L2924/09701 , H01L2924/16152 , H01L2924/3011 , H01L2924/3025
摘要： A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.
摘要翻译：用于电子部件的导电盖在其底部具有开口，并被构造成在盖的开口部分处固定到电子部件的基板的上表面，以至少覆盖电子元件安装在具有设置在其上的端子电极的基板的上表面上。开口的端面及其内表面和外表面在端表面附近和附近设置有设置在其上的绝缘膜。

4. 发明授权

US06489558B1 Conductive cap, electronic component, and method of forming insulating film of conductive cap 有权
公开(公告)号：US06489558B1
公开(公告)日：2002-12-03
申请号：US09642486
申请日：2000-08-18
申请人： Toshiyuki Baba , Toshio Nishimura , Tsuyoshi Kitagawa , Jiro Inoue , Shoichi Kawabata
发明人： Toshiyuki Baba , Toshio Nishimura , Tsuyoshi Kitagawa , Jiro Inoue , Shoichi Kawabata
IPC分类号： H01L2302
CPC分类号： H01L21/4803 , H01L23/06 , H01L23/10 , H01L2224/16 , H01L2924/01068 , H01L2924/01078 , H01L2924/09701 , H01L2924/16152 , H01L2924/3011 , H01L2924/3025
摘要： A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.

5. 发明授权

US06369487B1 Piezoelectric resonance component 有权
标题翻译：压电谐振分量
公开(公告)号：US06369487B1
公开(公告)日：2002-04-09
申请号：US09536887
申请日：2000-03-28
申请人： Eitaro Kameda , Toshiyuki Baba , Jiro Inoue , Shoichi Kawabata
发明人： Eitaro Kameda , Toshiyuki Baba , Jiro Inoue , Shoichi Kawabata
IPC分类号： H01L4104
CPC分类号： H03H9/1014 , H03H9/0557 , H03H9/178
摘要： A piezoelectric resonance component includes a capacitor substrate, a piezoelectric resonator mounted on the capacitor substrate, and a cover member fixedly attached to the capacitor substrate. The capacitor substrate includes a dielectric substrate, a plurality of inner electrodes arranged in layers within the dielectric substrate, and a plurality of outer electrodes disposed on at least one of opposed side surfaces of the dielectric substrate. The plurality of inner electrodes include an inner electrode to be connected to a ground potential and a pair of split inner electrodes located at a common vertical position and spaced apart from each other with respect to a central portion of the dielectric substrate.
摘要翻译：压电谐振部件包括电容器基板，安装在电容器基板上的压电谐振器和固定地附接到电容器基板的盖部件。所述电容器基板包括电介质基板，在所述电介质基板内分层配置的多个内部电极以及设置在所述电介质基板的至少一个相对侧面上的多个外部电极。多个内部电极包括要连接到地电位的内部电极和位于公共垂直位置并且相对于电介质基板的中心部彼此间隔开的一对分离的内部电极。

6. 发明授权

US06707228B2 Method for adjusting frequency of electronic component 失效
标题翻译：调整电子元器件频率的方法
公开(公告)号：US06707228B2
公开(公告)日：2004-03-16
申请号：US09816898
申请日：2001-03-23
申请人： Takashi Mizuguchi , Shoichi Kawabata
发明人： Takashi Mizuguchi , Shoichi Kawabata
IPC分类号： H01L4122
CPC分类号： H03H3/10 , H01J2237/3151 , Y10T29/42
摘要： A method for adjusting the frequency of an electronic component device includes the step of etching an electrode disposed on a surface of the electronic component device by irradiating an ion beam onto the electrode. The ion beam irradiation is performed while moving at least one of the electronic component device and the ion beam in directions along the surface on which the electrode is disposed.
摘要翻译：一种用于调整电子部件装置的频率的方法包括通过将离子束照射到电极上来蚀刻设置在电子部件装置的表面上的电极的步骤。在沿着电极配置的表面的方向移动电子部件装置和离子束中的至少一个的同时进行离子束照射。

7. 发明授权

US06912761B2 Method of producing multilayer piezoelectric resonator 有权
标题翻译：生产多层压电谐振器的方法
公开(公告)号：US06912761B2
公开(公告)日：2005-07-05
申请号：US10269367
申请日：2002-10-12
申请人： Toshiyuki Yasugi , Yuji Fujino , Shoichi Kawabata , Mamoru Ogawa
发明人： Toshiyuki Yasugi , Yuji Fujino , Shoichi Kawabata , Mamoru Ogawa
IPC分类号： H01L41/22 , H01L41/083 , H01L41/338 , H01L41/339 , H03H3/02 , H04R17/00 , H01L41/04 , H01L41/08 , H01L41/18 , H01L2/00
CPC分类号： H01L41/273 , H01L41/338 , H03H3/02 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49789 , Y10T29/49798
摘要： A method of producing a piezoeIectric resonator includes the steps of forming first to third internal electrodes by printing an electrically conductive paste onto a green sheet, punching out portions of the green sheet having the first to third internal electrodes formed thereon, so that at least three types of green sheets are punched out with a location of the internal electrode serving as a reference location, in which the first sheet is punched out by shifting a punching location by a first shift amount in a first direction with respect to the reference location, the second sheet is punched out by shifting a punching location by the first shift amount in a direction opposite to the first direction, and the third sheet is punched out at the reference location, forming a layered body by stacking the punched out green sheets, and forming a unit by cutting the layered body.
摘要翻译：制造压电谐振器的方法包括以下步骤：通过将导电浆料印刷在生片上形成第一至第三内部电极，冲压其上形成有第一至第三内部电极的生片的部分，使得至少三个用内部电极的位置作为基准位置冲压生坯片的类型，其中通过相对于参考位置沿第一方向移动冲压位置第一移位量来冲压第一片材，通过以与第一方向相反的方向移动冲压位置第一移位量来冲压第二片材，并且在参考位置冲压第三片材，通过堆叠冲压的生片材形成层叠体，并形成一个单位通过切割分层体。

8. 发明授权

US5635669A Multilayer electronic component 失效
标题翻译：多层电子元件
公开(公告)号：US5635669A
公开(公告)日：1997-06-03
申请号：US483799
申请日：1995-06-07
申请人： Kenji Kubota , Norio Sakai , Shoichi Kawabata
发明人： Kenji Kubota , Norio Sakai , Shoichi Kawabata
IPC分类号： H01G2/06 , H01G4/232 , H01L21/66 , H01L23/498 , H01L23/58 , H05K1/09 , H05K3/00 , H05K3/34 , H05K3/40 , H02G3/08 , H01L23/02 , H01R29/00 , H05K7/00
CPC分类号： H01G4/232 , H01G2/065 , H01L22/20 , H01L22/32 , H01L23/49805 , H01L2924/0002 , H01L2924/014 , H05K1/092 , H05K2201/09181 , H05K2201/09563 , H05K2201/09845 , H05K3/0052 , H05K3/3442 , H05K3/4061
摘要： A multilayer electronic component having reduced arrangement pitches for external electrodes is formed by providing via holes in a mother laminate with conductive materials. The mother laminate is obtained by stacking a plurality of insulating sheets with interposition of conductor films in positions that are parted by cutting. The conductive materials define external electrodes for individual multilayer electronic components which are obtained by cutting the mother laminate. A specific step for forming the external electrodes is not required, and characteristics of each multilayer electronic component can be efficiently measured while each multilayer electronic component is still part of the mother laminate.
摘要翻译：通过在母层叠体中提供导电材料的通孔来形成具有减小的用于外部电极的布置间距的多层电子部件。通过将多个绝缘片层叠在通过切割分割的位置中的导体膜上而获得母层压体。导电材料限定通过切割母层压板而获得的单个多层电子部件的外部电极。不需要形成外部电极的特定步骤，并且可以在每个多层电子部件仍然是母体层叠体的一部分的同时有效地测量每个多层电子部件的特性。

9. 发明授权

US5019200A Method of fabricating multilayer capacitor 失效
标题翻译：制作多层电容器的方法
公开(公告)号：US5019200A
公开(公告)日：1991-05-28
申请号：US451300
申请日：1989-12-15
申请人： Shoichi Kawabata , Toshimi Yoshimura
发明人： Shoichi Kawabata , Toshimi Yoshimura
IPC分类号： H01G4/12 , B28B1/00 , B28B11/12 , B28B11/16 , B28B13/02 , B28B13/04 , H01G4/30 , H01G13/00
CPC分类号： B28B11/12 , B28B1/00 , B28B11/168 , B28B13/0205 , B28B13/04 , H01G13/00 , H01G4/308 , Y10T156/1064 , Y10T156/1075 , Y10T156/1082 , Y10T156/1085
摘要： A method of fabricating a multilayer capacitor including a series of steps of applying an electrode paste on a ceramic green sheet supported on a supporting film, cutting the ceramic green sheet to a predetermined size by employing a cutting head having drawing means, stripping the cut ceramic green sheet from the supporting film with the ceramic green sheet being held in the cutting head, transferring the ceramic green sheet held in the cutting head to a metallic pressing mold, and laminating a plurality of ceramic green sheets in the metallic mold to obtain a laminated body by repeating the above step of stripping the ceramic green sheet from the supporting film and the above step of transferring the ceramic green sheet to the metallic mold.
摘要翻译：一种制造多层电容器的方法，包括以下步骤：将电极浆料涂覆在支撑在支撑膜上的陶瓷生片上，通过使用具有拉丝装置的切割头将陶瓷生片切割成预定尺寸，剥离切割的陶瓷将来自支撑膜的生片与陶瓷生片保持在切割头中，将保持在切割头中的陶瓷生片转移到金属压模上，并在金属模中层叠多个陶瓷生片以获得层压通过重复上述从支撑膜剥离陶瓷生片的步骤和将陶瓷生片转移到金属模的上述步骤。

10. 发明授权

US5625935A Method of manufacturing a multilayer electronic component 失效
公开(公告)号：US5625935A
公开(公告)日：1997-05-06
申请号：US227022
申请日：1994-04-13
申请人： Kenji Kubota , Norio Sakai , Shoichi Kawabata
发明人： Kenji Kubota , Norio Sakai , Shoichi Kawabata
IPC分类号： H01G2/06 , H01G4/232 , H01L21/66 , H01L23/10 , H01L23/498 , H01L23/58 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/34 , H05K3/40 , H01R43/00
CPC分类号： H01G4/232 , H01G2/065 , H01L22/20 , H01L22/32 , H01L23/10 , H01L23/49805 , H05K3/403 , H01L2924/014 , H01L2924/16152 , H05K1/0306 , H05K1/092 , H05K2201/09181 , H05K2201/09563 , H05K2201/09845 , H05K3/0052 , H05K3/3442 , H05K3/4061 , Y10T29/435 , Y10T29/49004 , Y10T29/4902 , Y10T29/49165 , Y10T29/49169
摘要： In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

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