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    • 9. 发明申请
    • METHOD OF HEAT-TREATING SEMICONDUCTOR
    • 热处理半导体的方法
    • US20090253273A1
    • 2009-10-08
    • US12305180
    • 2007-04-25
    • Naoki SanoToshiyuki Sameshima
    • Naoki SanoToshiyuki Sameshima
    • H01L21/268
    • H01L21/324H01L21/02381H01L21/02683H01L21/02691H01L21/268H01L27/1285
    • The present invention relates to a method of heat-treating a semiconductor, and the object is to enable heat-treating to a semiconductor or semiconductor device in a short period time and to obtain a stable and high reforming effect. The present invention is a method in which carbon or a layer including carbon is provided as a light absorbing layer, and a semiconductor material as a heat-treating target layer or semiconductor device contacting the heat absorbing layer directly or through a heat transfer layer of 5 nm-100 μm in thickness is heat-treated, and the light source to be used is a semiconductor laser light of wavelength of 600 nm-2 μm, and this semiconductor laser light is caused to continuously irradiate and sweep the surface of the heat-treating target material. The light source can be easily made to output high power, and heat-treating at a high speed and with low energy consumption is realized.
    • 半导体热处理方法技术领域本发明涉及半导体的热处理方法,其目的在于能够在短时间内对半导体或半导体器件进行热处理,并获得稳定且高的重整效果。 本发明是提供碳或包含碳的层作为光吸收层的方法,以及作为热处理对象层的半导体材料或半导体器件直接或通过5的传热层与吸热层接触 热处理厚度为nm-100μm的光,所使用的光源为波长为600nm-2μm的半导体激光,并且使该半导体激光连续地照射并扫描散热片的表面, 处理目标材料。 可以容易地实现光源输出高功率,实现高速,低能耗的热处理。