会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • Opening-closing device for an opening-closing member of a vehicle
    • 用于车辆的开闭构件的开闭装置
    • US07140150B2
    • 2006-11-28
    • US10829429
    • 2004-04-22
    • Toshiyuki SakaiTakeshi YamamotoHiroji Ikeda
    • Toshiyuki SakaiTakeshi YamamotoHiroji Ikeda
    • E05F11/24
    • E05F15/603E05Y2201/216E05Y2201/246E05Y2201/462
    • An opening-closing device includes a driving source, an opening-closing mechanism for opening and closing an opening-closing member provided at a vehicle body by operation of the driving source, and a clutch positioned between the driving source and the opening-closing mechanism and sifting an energization state can transmit a driving force of the driving source to the opening-closing mechanism and a non-energization state can not transmit the drive force. The clutch includes a drive portion and a driven portion. The drive portion and the driven portion contact each other by a first load which can transmit the driving force from the driving source to the opening-closing mechanism when the clutch is the energization state. The drive portion and the driven portion contact each other by a second load which can not transmits the driving force from the driving source to opening-closing mechanism when the clutch is the non-energization state.
    • 开闭装置包括驱动源,用于通过驱动源的操作来打开和关闭设置在车身上的开闭部件的开闭机构,以及位于驱动源和开闭机构之间的离合器 并且筛选通电状态可以将驱动源的驱动力传递到打开 - 关闭机构,并且非通电状态不能传递驱动力。 离合器包括驱动部和被驱动部。 驱动部分和从动部分通过第一负载彼此接触,当负载处于通电状态时,第一负载能够将驱动力传递到开闭机构。 驱动部分和被驱动部分通过第二负载彼此接触,当第二负载在离合器处于非通电状态时不能将驱动力传递到打开 - 关闭机构。
    • 9. 发明授权
    • Wafer polishing method
    • 晶圆抛光方法
    • US07014536B2
    • 2006-03-21
    • US11000187
    • 2004-12-01
    • Toshiyuki Sakai
    • Toshiyuki Sakai
    • B24B1/00
    • B24B37/042
    • A wafer polishing method which can prevent polishing swarfs from entering the gap between the periphery of a wafer and a protective tape when the back surface of the wafer is dry polished with a polishing pad after the protective tape is affixed onto the front surface of the wafer, the method comprising the steps of cutting an arcuate chamfered portion formed at the periphery of the wafer to form a precipice at the periphery of the wafer; affixing the protective tape onto the surface to be held on the chuck table of a polishing machine, of the wafer; and placing the wafer on the chuck table in such a manner that the side of the protective tape comes into contact with the chuck table to dry polish the surface of the wafer with a polishing means.
    • 一种晶片抛光方法,当将保护带固定在晶片的前表面上之后,当晶片的背面用抛光垫进行干式抛光时,能够防止抛光切屑进入晶片周边与保护带之间的间隙 所述方法包括以下步骤:切割形成在所述晶片周围的弧形倒角部分,以在所述晶片的周边形成悬臂; 将保护带固定在待保持在晶片的抛光机的卡盘台上的表面上; 并且将晶片放置在卡盘台上,使得保护带的一侧与卡盘台接触,以抛光装置对晶片的表面进行干式抛光。
    • 10. 发明申请
    • Wafer polishing method
    • 晶圆抛光方法
    • US20050118933A1
    • 2005-06-02
    • US11000187
    • 2004-12-01
    • Toshiyuki Sakai
    • Toshiyuki Sakai
    • B24B37/30H01L21/304B24B1/00
    • B24B37/042
    • A wafer polishing method which can prevent polishing swarfs from entering the gap between the periphery of a wafer and a protective tape when the back surface of the wafer is dry polished with a polishing pad after the protective tape is affixed onto the front surface of the wafer, the method comprising the steps of cutting an arcuate chamfered portion formed at the periphery of the wafer to form a precipice at the periphery of the wafer; affixing the protective tape onto the surface to be held on the chuck table of a polishing machine, of the wafer; and placing the wafer on the chuck table in such a manner that the side of the protective tape comes into contact with the chuck table to dry polish the surface of the wafer with a polishing means.
    • 一种晶片抛光方法,当将保护带固定在晶片的前表面上之后,当晶片的背面用抛光垫进行干式抛光时,能够防止抛光切屑进入晶片周边与保护带之间的间隙 所述方法包括以下步骤:切割形成在所述晶片周围的弧形倒角部分,以在所述晶片的周边形成悬臂; 将保护带固定在待保持在晶片的抛光机的卡盘台上的表面上; 并且将晶片放置在卡盘台上,使得保护带的一侧与卡盘台接触,以抛光装置对晶片的表面进行干式抛光。