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    • 4. 发明授权
    • Positive resist composition and method of forming resist pattern
    • 正型抗蚀剂组合物和形成抗蚀剂图案的方法
    • US07871753B2
    • 2011-01-18
    • US12090826
    • 2006-11-09
    • Tasuku MatsumiyaTakako Hirosaki
    • Tasuku MatsumiyaTakako Hirosaki
    • G03F7/004
    • G03F7/0397Y10S430/106Y10S430/111
    • A positive resist composition of the present invention includes a resin component (A) which displays increased alkali solubility under the action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the resin component (A) includes a structural unit (a0) containing a carboxyl group, and at least one structural unit (a1) selected from the group consisting of a structural unit represented by a general formula (a1-2) and a structural unit represented by a general formula (a1-4) shown below: (in the formula, Y represents an aliphatic cyclic group or a lower alkyl group; n represents an integer from 0 to 3; m represents 0 or 1; R represents a hydrogen atom, a halogen atom, a lower alkyl group, or a halogenated lower alkyl group; and R1′ and R2′ each independently represents a hydrogen atom or a lower alkyl group of 1 to 5 carbon atoms.).
    • 本发明的正型抗蚀剂组合物包括在酸的作用下显示增加的碱溶性的树脂组分(A)和暴露时产生酸的酸产生剂组分(B),其中树脂组分(A)包括 含有羧基的结构单元(a0)和选自由通式(a1-2)表示的结构单元和由通式(a1-2)表示的结构单元)组成的组中的至少一种结构单元(a1) -4)(式中,Y表示脂肪族环状或低级烷基,n表示0〜3的整数,m表示0或1,R表示氢原子,卤原子,低级 烷基或卤代低级烷基; R 1'和R 2'各自独立地表示氢原子或碳原子数为1〜5的低级烷基。
    • 5. 发明申请
    • POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
    • 正电阻组合物和形成电阻图案的方法
    • US20090162786A1
    • 2009-06-25
    • US12090826
    • 2006-11-09
    • Tasuku MatsumiyaTakako Hirosaki
    • Tasuku MatsumiyaTakako Hirosaki
    • G03F7/20G03F7/00
    • G03F7/0397Y10S430/106Y10S430/111
    • A positive resist composition of the present invention includes a resin component (A) which displays increased alkali solubility under the action of an acid, and an acid generator component (B) which generates an acid upon exposure, wherein the resin component (A) includes a structural unit (a0) containing a carboxyl group, and at least one structural unit (a1) selected from the group consisting of a structural unit represented by a general formula (a1-2) and a structural unit represented by a general formula (a1-4) shown below: (in the formula, Y represents an aliphatic cyclic group or a lower alkyl group; n represents an integer from 0 to 3; m represents 0 or 1; R represents a hydrogen atom, a halogen atom, a lower alkyl group, or a halogenated lower alkyl group; and R1′ and R2′ each independently represents a hydrogen atom or a lower alkyl group of 1 to 5 carbon atoms.).
    • 本发明的正型抗蚀剂组合物包括在酸的作用下显示增加的碱溶性的树脂组分(A)和暴露时产生酸的酸产生剂组分(B),其中树脂组分(A)包括 含有羧基的结构单元(a0)和选自由通式(a1-2)表示的结构单元和由通式(a1-2)表示的结构单元)组成的组中的至少一种结构单元(a1) -4)(式中,Y表示脂肪族环状或低级烷基,n表示0〜3的整数,m表示0或1,R表示氢原子,卤原子,低级 烷基或卤代低级烷基; R 1'和R 2'各自独立地表示氢原子或碳原子数为1〜5的低级烷基。
    • 8. 发明授权
    • Method for the formation of a planarizing coating film on substrate surface
    • 在基板表面上形成平坦化涂膜的方法
    • US06297174B2
    • 2001-10-02
    • US09765276
    • 2001-01-22
    • Etsuko IguchiTakako HirosakiMasakazu Kobayashi
    • Etsuko IguchiTakako HirosakiMasakazu Kobayashi
    • H01L2131
    • H01L21/02118H01L21/02282H01L21/31055H01L21/312
    • A method is disclosed for the formation of a planarizing coating film on the surface of a substrate having a stepped level difference under processing for the manufacture of semiconductor devices. The inventive method capable of giving a planarizing coating film of excellent planarity and good adhesion to the substrate surface comprises the steps of: (a) coating the substrate surface with a coating solution containing, as a film-forming solute uniformly dissolved in an ,organic solvent, a nitrogen-containing organic compound such as benzoguanamine and melamine having, in a molecule, at least two amino and/or imino groups each substituted for the nitrogen-bonded hydrogen atom by a hydroxyalkyl group or an alkoxyalkyl group to form a coating layer; (b) drying the coating layer by evaporating the organic solvent to form a dried coating layer; and (c) subjecting the dried coating layer to a baking treatment at a temperature in the range from 150 to 250° C.
    • 公开了一种用于在半导体器件的制造处理中在具有台阶级差的衬底的表面上形成平坦化涂膜的方法。 能够赋予平坦化性和对基材表面的良好粘合性的平坦化涂膜的本发明的方法包括以下步骤:(a)用包含均匀溶解在有机物中的成膜溶质的涂布溶液涂布基材表面 溶剂,诸如苯并胍胺和三聚氰胺的含氮有机化合物在分子中具有至少两个氨基和/或亚氨基,其各自通过羟烷基或烷氧基烷基取代与氮键合的氢原子,以形成涂层 ;(b)通过蒸发有机溶剂干燥涂层以形成干燥的涂层; 和(c)在150-250℃的温度下对干燥的涂层进行烘烤处理。