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    • 8. 发明申请
    • Photoresist composition and method for forming resist pattern using the same
    • 光刻胶组合物及其形成方法
    • US20060166130A1
    • 2006-07-27
    • US10547427
    • 2004-03-24
    • Toshiyuki OgataKotaro EndoHiromitsu TsujiMasaaki Yoshida
    • Toshiyuki OgataKotaro EndoHiromitsu TsujiMasaaki Yoshida
    • G03C1/76
    • G03F7/0046G03F7/0395Y10S430/108
    • A photoresist composition containing a polymer (A) containing an alkali-soluble constituent unit (a1) containing an alicyclic group having both a fluorine atom or a fluorinated alkyl group (i) and an alcoholic hydroxyl group (ii), whose alkali-solubility is changeable by an action of an acid; an acid generator (B) which generates an acid by light irradiation; and a dissolution inhibitor (C) having a fluorine atom(s) and/or a nitrogen-containing compound (D) selected from a tertiary amine (d1) having a polar group, a tertiary alkylamine (d2) having 7 or more and 15 or less of carbon atoms or an ammonium salt (d3). The composition has a resist property capable of accomplishing line and space (1:1) of 90 nm or less in good shape as a pattern processing accuracy of a semiconductor integrated circuit by lithography.
    • 1.一种光致抗蚀剂组合物,其含有含有具有氟原子或氟代烷基(i)和醇羟基(ii)的脂环族基团的碱溶性结构单元(a1)的聚合物(A),其碱溶性为 可以通过酸的作用而变化; 通过光照射产生酸的酸产生剂(B); 和具有氟原子的溶解抑制剂(C)和/或选自具有极性基团的叔胺(d1),具有7以上的叔烷基胺(d2)和15以上的含氮化合物(D) 或更少的碳原子或铵盐(d3)。 该组合物具有能够通过光刻作为半导体集成电路的图案处理精度而实现90nm或更小的线和空间(1:1)的良好形状的抗蚀剂性质。