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1. 发明申请

US20060136786A1 Component mounting apparatus, service providing device and servicing method 有权
标题翻译：组件安装装置，服务提供装置和维修方法
公开(公告)号：US20060136786A1
公开(公告)日：2006-06-22
申请号：US11341691
申请日：2006-01-30
申请人： Satoshi Nonaka , Hitoshi Nakamura , Yoshiyuki Hattori , Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
发明人： Satoshi Nonaka , Hitoshi Nakamura , Yoshiyuki Hattori , Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
IPC分类号： G06F11/00
CPC分类号： G05B19/41805 , G05B2219/31457 , G05B2219/32226 , G05B2219/45026 , G06Q10/10 , H05K13/0465 , H05K13/0882 , Y02P90/04 , Y02P90/14 , Y02P90/18 , Y02P90/22 , Y10T29/4913 , Y10T29/5137 , Y10T29/53022 , Y10T29/53161 , Y10T29/53174 , Y10T29/53178
摘要： A method for monitoring a mounting tact of a component mounting apparatus including a component supplier for supplying a component and a component holder for holding the component from the component supplying device and mounting the component onto a circuit board. The method includes collecting and monitoring a mounting tact result value of the component mounting apparatus during a mounting operation via a communication system. The method further includes calculating a tact loss corresponding to an amount by which the mounting tact result value is greater than a standard mounting tact and monitoring the calculated tact loss.
摘要翻译：一种用于监视组件安装装置的安装方法，包括用于提供部件的部件供应器和用于将部件保持在部件供应装置上并将部件安装到电路板上的部件保持器。该方法包括在通过通信系统的安装操作期间收集和监视部件安装装置的安装节奏结果值。该方法还包括计算与安装节拍结果值大于标准安装节拍的量相对应的节拍损失，并监视所计算的节拍损失。

2. 发明授权

US07885718B2 Component mounting apparatus, service providing device and servicing method 有权
标题翻译：组件安装装置，服务提供装置和维修方法
公开(公告)号：US07885718B2
公开(公告)日：2011-02-08
申请号：US12421272
申请日：2009-04-09
申请人： Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
发明人： Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
IPC分类号： G06F19/00 , G05B19/18
CPC分类号： G05B19/41805 , G05B2219/31457 , G05B2219/32226 , G05B2219/45026 , G06Q10/10 , H05K13/0465 , H05K13/0882 , Y02P90/04 , Y02P90/14 , Y02P90/18 , Y02P90/22 , Y10T29/4913 , Y10T29/5137 , Y10T29/53022 , Y10T29/53161 , Y10T29/53174 , Y10T29/53178
摘要： A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.
摘要翻译：一种服务接收方法，用于经由包括因特网的通信系统，接收由安装的组件数据生成的组件库，包括组件尺寸和安装条件。该方法包括服务提供者接收具有通过无缺陷产品的制造实际实现的安装条件的安装的组件数据。该方法还包括从安装的组件数据库导出组件库的服务提供者。

3. 发明授权

US07536236B2 Component mounting apparatus, service providing device and servicing method 有权
标题翻译：组件安装装置，服务提供装置和维修方法
公开(公告)号：US07536236B2
公开(公告)日：2009-05-19
申请号：US11341693
申请日：2006-01-30
申请人： Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
发明人： Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
IPC分类号： G06F19/00
CPC分类号： G05B19/41805 , G05B2219/31457 , G05B2219/32226 , G05B2219/45026 , G06Q10/10 , H05K13/0465 , H05K13/0882 , Y02P90/04 , Y02P90/14 , Y02P90/18 , Y02P90/22 , Y10T29/4913 , Y10T29/5137 , Y10T29/53022 , Y10T29/53161 , Y10T29/53174 , Y10T29/53178
摘要： A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.
摘要翻译：一种服务接收方法，用于通过通信系统通过服务接收机向服务提供商输入具有无缺陷产品制造结果的已安装组件数据，从而接收包括安装生产所需的组件尺寸的组件尺寸的组件库，互联网并由服务接收器从服务提供商中提供的已安装的组件数据库导出组件库，所安装的组件数据库包含为每种类型的组件累积的输入安装组件数据。

4. 发明授权

US07142939B2 Component mounter, service supplier, and service supplying method 失效
标题翻译：组件贴片机，服务供应商和服务提供方式
公开(公告)号：US07142939B2
公开(公告)日：2006-11-28
申请号：US10451637
申请日：2002-01-10
申请人： Satoshi Nonaka , Hitoshi Nakamura , Yoshiyuki Hattori , Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
发明人： Satoshi Nonaka , Hitoshi Nakamura , Yoshiyuki Hattori , Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
IPC分类号： G06F19/00
CPC分类号： G05B19/41805 , G05B2219/31457 , G05B2219/32226 , G05B2219/45026 , G06Q10/10 , H05K13/0465 , H05K13/0882 , Y02P90/04 , Y02P90/14 , Y02P90/18 , Y02P90/22 , Y10T29/4913 , Y10T29/5137 , Y10T29/53022 , Y10T29/53161 , Y10T29/53174 , Y10T29/53178
摘要： A service receiving device is provided for in a production facility such as a component mounting apparatus. A service providing device is provided for on a manufacturer's side of the production facility. The service receiving device and service providing device are configured to communicate with each other through various communication systems including, for example, the Internet. The communication system can be operated by software to create and/or transmit service responses to problems or production matters, including productivity or quality of maintenance.
摘要翻译：在诸如部件安装装置的生产设备中提供了一种服务接收装置。在生产设备的制造商侧提供服务提供装置。服务接收装置和服务提供装置被配置为通过包括例如因特网的各种通信系统相互通信。通信系统可以由软件操作，以创建和/或发送对问题或生产事务的服务响应，包括生产力或维护质量。

5. 发明申请

US20060136787A1 Component mounting apparatus, service providing device and servicing method 有权
公开(公告)号：US20060136787A1
公开(公告)日：2006-06-22
申请号：US11341693
申请日：2006-01-30
申请人： Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
发明人： Toshio Yano , Hiroshi Okamura , Yoshihiko Misawa , Yoshinori Isobata , Ken Takahashi , Masuo Masui , Eigo Sarashina , Akira Iizuka
IPC分类号： G06F11/00
CPC分类号： G05B19/41805 , G05B2219/31457 , G05B2219/32226 , G05B2219/45026 , G06Q10/10 , H05K13/0465 , H05K13/0882 , Y02P90/04 , Y02P90/14 , Y02P90/18 , Y02P90/22 , Y10T29/4913 , Y10T29/5137 , Y10T29/53022 , Y10T29/53161 , Y10T29/53174 , Y10T29/53178
摘要： A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.

6. 发明授权

US06217669B1 Cleaning apparatus and cleaning method 失效
标题翻译：清洁装置和清洁方法
公开(公告)号：US06217669B1
公开(公告)日：2001-04-17
申请号：US09155795
申请日：1998-10-06
申请人： Eigo Sarashina , Ken Takahashi , Masuo Masui , Takao Naito
发明人： Eigo Sarashina , Ken Takahashi , Masuo Masui , Takao Naito
IPC分类号： B08B504
CPC分类号： H05K3/1233 , B41F35/005 , H05K3/1216 , H05K3/26 , H05K2203/0139
摘要： In a printing device in which a printing material is printed on or applied to a to-be-printed surface of a circuit board through a screen mask for printing having openings formed therein in a predetermined pattern, it is intended to reliably remove cream solder remaining in the openings in the screen mask. After an air suction mechanism (19) has its flow rate controlled by a flow rate controller (20). An air suction section (15) is lifted until its front end contacts with the screen mask (5), the air suction mechanism (19) starts cleaning by sucking air from the openings (6) in the screen mask (5). An inspecting camera (2) is used to observe the cream solder (4) remaining in the openings (6) after cleaning, and the air suction flow rate is controlled according to the results thereof to effect cleaning again.
摘要翻译：在印刷装置中，其印刷材料通过其中形成有预定图案的开口的印刷用屏幕掩模印刷在电路板的被印刷表面上或涂布在印刷电路板的被印刷表面上，旨在可靠地除去剩余的膏状焊剂在屏幕上的开口中。空气抽吸机构（19）的流量由流量控制器（20）控制。抽吸部分15被提升直到其前端与屏幕面罩5接触，空气抽吸机构19通过从屏幕面罩5中的开口6吸入空气开始清洗。检查照相机（2）用于在清洁之后观察剩余在开口（6）中的膏状焊料（4），并且根据其结果控制空气吸入流量以再次进行清洁。

7. 发明授权

US6120585A Reflow soldering device 失效
标题翻译：回流焊接装置
公开(公告)号：US6120585A
公开(公告)日：2000-09-19
申请号：US155932
申请日：1998-10-07
申请人： Akio Inomata , Masaru Nonomura , Masuo Masui , Naoichi Chikahisa
发明人： Akio Inomata , Masaru Nonomura , Masuo Masui , Naoichi Chikahisa
IPC分类号： B01D53/34 , B01D46/42 , B23K1/012 , H05K3/34 , B01D46/00
CPC分类号： B23K1/012
摘要： A reflow soldering device extracts a vaporized component of a contaminative material, such as flux, from exhaust gas from a reflow furnace. The device includes a conveyor for transferring a circuit substrate, a heater for heating the transferred circuit substrate, a cooler for cooling the circuit substrate which has been reflow soldered by heater, discharge pipes and a discharge blower for discharging an exhaust gas at high temperature from the heater to the outside of the device, and a flux remover mounted in the discharge pipes which cools the exhaust gas to 70.degree. C. and below, preferably 60.degree. C. and below, so as to cause a vaporized component, such as flux contained in the exhaust gas, to become liquid or solid and to be removed.
摘要翻译： PCT No.PCT / JP97 / 01608 Sec。 371日期：1998年10月7日 102（e）日期1998年10月7日PCT提交1997年5月12日PCT公布。出版物WO97 / 43884 日期1997年11月20日回流焊接装置从回流炉的废气中提取污染物质（例如助熔剂）的蒸发成分。该装置包括用于传送电路基板的输送机，用于加热转移的电路基板的加热器，用于冷却已经被加热器回流焊接的电路基板的冷却器，排出管和用于将高温排出的废气排出的排气鼓风机加热器到装置的外部，以及安装在排气管中的助焊剂去除器，其将排气冷却至70℃以下，优选在60℃以下，从而使汽化成分例如助熔剂包含在废气中，成为液体或固体并被除去。

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