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1. 发明授权

US5449584A Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound 失效
标题翻译：包含光敏聚苯并恶唑或聚苯并恶唑，有机溶剂可溶性聚合物和重氮醌和/或二氢吡啶化合物的混合物的正型光敏树脂组合物
公开(公告)号：US5449584A
公开(公告)日：1995-09-12
申请号：US210417
申请日：1994-03-18
申请人： Toshio Banba , Etsu Takeuchi , Toshiro Takeda , Naoshige Takeda , Akira Tokoh
发明人： Toshio Banba , Etsu Takeuchi , Toshiro Takeda , Naoshige Takeda , Akira Tokoh
IPC分类号： G03F7/004 , G03F7/022 , G03F7/023 , G03F7/039 , G03F7/075
CPC分类号： G03F7/0233 , G03F7/0045 , G03F7/0046 , G03F7/0226 , G03F7/039 , G03F7/0757 , Y10S430/107
摘要： The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent. This photo-sensitive resin composition has excellent alkali resistance when unexposed to a light and accordingly can give a high residual film ratio.
摘要翻译：本发明提供一种正型光敏树脂组合物，其包含作为基础树脂的聚苯并恶唑前体，作为赋予改善的粘合性，柔软性或耐热性的组分的有机溶剂可溶性聚合物或其前体（例如，聚酰胺酸），以及重氮醌化合物和/或二氢吡啶化合物作为感光剂。该感光性树脂组合物可以形成高分辨率的图案，并且还具有优异的粘附性和机械性能。本发明还提供三种新型的重氮醌化合物作为光敏剂，当在正性光敏树脂组合物中配合时，该化合物具有高分辨率，高对比度和厚膜成形性。本发明还提供了一种通过聚苯并恶唑前体与重氮醌化合物作为感光剂反应获得的新型正光敏树脂组合物。该光敏树脂组合物在未曝光时具有优异的耐碱性，因此可以得到高残留膜比。

2. 发明授权

US5206337A Solvent-soluble polyimidesiloxane oligomer and process for producing the same 失效
标题翻译：溶剂型溶胶聚硅氧烷低聚物及其制造方法
公开(公告)号：US5206337A
公开(公告)日：1993-04-27
申请号：US696647
申请日：1991-05-07
申请人： Toshiro Takeda , Naoshige Takeda , Akira Tokoh
发明人： Toshiro Takeda , Naoshige Takeda , Akira Tokoh
IPC分类号： C08G73/10 , C08G77/455
CPC分类号： C08G73/106 , C08G77/455
摘要： The present invention provides an oligomer having an inherent viscosity .eta. of 0.001-0.5 dl/g as measured at a concentration of 0.5 g/dl in N-methyl-2-pyrrolidone at 30.degree. C., which has been obtained by subjecting to polymerization and imidization (a) an acid component consisting of an aromatic tetracarboxylic acid dianhydride and/or a derivative thereof and (b) a diamine component consisting of 5-100 mole % of a diaminosiloxane represented by the undermentioned formula (I) and 95-0 mole % of an organic diamine other than the formula (I): ##STR1## wherein R.sub.1 is a divalent aliphatic group of 1-5 carbon atoms or a divalent aromatic group of 6 or more carbon atoms; R.sub.2 and R.sub.3 are each a monovalent aliphatic or aromatic group and may be the same or different; and m is an integer of 1-100, as well as an oligomer solution obtained by dissolving the above oligomer in an organic solvent.

3. 发明授权

US06235436B1 Semiconductor device using positive photosensitive resin composition and process for preparation thereof 有权
标题翻译：使用正型感光性树脂组合物的半导体装置及其制备方法
公开(公告)号：US06235436B1
公开(公告)日：2001-05-22
申请号：US09442277
申请日：1999-11-17
申请人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
发明人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
IPC分类号： G03F730
CPC分类号： G03F7/0226 , G03F7/0755 , G03F7/0757 , Y10S430/107
摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 &mgr;m on a semiconductor element.
摘要翻译：一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的二价基团：其中R 1和R 2表示二价有机基团，并且R 3和R 4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

4. 发明授权

US6071666A Positive type photosensitive resin composition and semiconductor device using the same 失效
标题翻译：正型感光性树脂组合物及使用其的半导体装置
公开(公告)号：US6071666A
公开(公告)日：2000-06-06
申请号：US854863
申请日：1997-05-12
申请人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
发明人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
IPC分类号： G03F7/022 , G03F7/075 , G03F7/023
CPC分类号： G03F7/0226 , G03F7/0755 , G03F7/0757 , Y10S430/107
摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): ##STR1## wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a group represented by the formula: ##STR2## in which R.sub.1 and R.sub.2 represent organic groups and R.sub.3 and R.sub.4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 .mu.m on a semiconductor element.
摘要翻译：一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的基团：其中R1和R2表示有机基团，R3和R4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

5. 发明授权

US5756260A Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same 失效
标题翻译：含有稳定剂的感光性聚酰亚胺树脂组合物和使用其形成浮雕图案的方法
公开(公告)号：US5756260A
公开(公告)日：1998-05-26
申请号：US732836
申请日：1996-10-15
申请人： Nobuyuki Sashida , Toshio Banba , Naoshige Takeda , Mitsuhiro Yamamoto
发明人： Nobuyuki Sashida , Toshio Banba , Naoshige Takeda , Mitsuhiro Yamamoto
IPC分类号： G03F7/004 , G03F7/012 , G03F7/023 , G03F7/037 , G03F7/038 , H05K1/00 , G03C1/73
CPC分类号： G03F7/0233 , G03F7/0045 , G03F7/0125 , G03F7/037 , G03F7/0387 , H05K3/4676
摘要： By using a polyamic acid ester comprising the following structural units (1a), (1b) and (1c) as a photosensitive resin and a sulfonamide compound or a specific glycol ether acetate as a stabilizer, a photo-sensitive resin composition excellent especially in viscosity stability can be obtained, and by using the above photosensitive resin and a specific developer, a relief pattern of high resolution can be formed. ##STR1## (the symbols in the formulas are as defined in the specification)
摘要翻译：通过使用包含以下结构单元（1a），（1b）和（1c）作为感光性树脂和磺酰胺化合物或特定二醇醚乙酸酯作为稳定剂的聚酰胺酸酯，特别优选粘度可以获得稳定性，并且通过使用上述感光性树脂和特定的显影剂，可以形成高分辨率的浮雕图案。（1a）在规范中定义的（1b）

6. 发明授权

US5648451A Process for producing photosensitive resin 失效
标题翻译：感光性树脂的制造方法
公开(公告)号：US5648451A
公开(公告)日：1997-07-15
申请号：US541582
申请日：1995-10-10
申请人： Nobuyuki Sashida , Toshio Banba , Naoshige Takeda
发明人： Nobuyuki Sashida , Toshio Banba , Naoshige Takeda
IPC分类号： C07D249/18 , C08G73/10 , G03F7/037 , C08G69/26
CPC分类号： G03F7/037 , C07D249/18 , C08G73/1007
摘要： A process for producing a photosensitive resin, comprises reacting a diamine with a tetracarboxylic acid tetraester represented by the formula (1) at a temperature of 0.degree. to 50.degree. C. in an aprotic polar solvent: ##STR1## wherein R.sub.1 is a tetravalent organic group; R.sub.2 is a group represented by the formula: ##STR2## in which R.sub.5 is a divalent to hexavalent organic group, R.sub.6 is H or CH.sub.3 and p is an integer of 1 to 5; R.sub.3 is a group represented by --OCH.sub.3, --OC.sub.2 H.sub.5, --OC.sub.3 H.sub.7 or the formula: ##STR3## and R.sub.4 is a group of the formula: ##STR4## the tetracarboxylic acid tetraester of the formula (1) is obtained by subjecting to addition reaction a tetracarboxylic dianhydride, an alcohol compound represented by the formula R.sub.2 H in which R.sub.2 is as defined above and an alcohol compound represented by the formula R.sub.3 H in which R.sub.3 is as defined above and thereafter subjecting the resulting addition reaction product to dehydration-condensation with 1-hydroxy-1,2,3-benzotriazole using a carbodiimide compound as a condensation agent.
摘要翻译：一种感光性树脂的制造方法，其特征在于，在0〜50℃的温度下，使二胺与式（1）表示的四羧酸四酯在非质子传递极性溶剂中反应：（1）其中R1为四价有机基团; R2是由下式表示的基团：其中R5是二价至六价有机基团，R6是H或CH3，p是1至5的整数; R3是由-OCH3，-OC2H5，-OC3H7或式AGE表示的基团，式（1）的四羧酸四酯通过将四羧酸二酐，由式R 2 H表示的醇化合物加成其中R 2如上所定义，和由式R3H表示的醇化合物，其中R3如上定义，然后使用碳二亚胺化合物将所得加成反应产物与1-羟基-1,2,3-苯并三唑进行脱水缩合作为缩合剂。

7. 发明申请

US20100196808A1 Positive photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device therewith 审中-公开
标题翻译：正型感光性树脂组合物，固化膜，保护膜，绝缘膜和半导体器件及其显示装置
公开(公告)号：US20100196808A1
公开(公告)日：2010-08-05
申请号：US12311235
申请日：2009-01-07
申请人： Ayako Mizushima , Hiroaki Makabe , Naoshige Takeda
发明人： Ayako Mizushima , Hiroaki Makabe , Naoshige Takeda
IPC分类号： G03F7/004
CPC分类号： G03F7/0233 , C08G69/42 , G03F7/022 , G03F7/0757
摘要： An objective of the present invention is to achieve both prevention of scum generation in an open area and improvement in sensitivity in patterning process of the positive photosensitive resin composition. This objective can be achieved by a positive photosensitive resin composition comprising an alkali-soluble resin (A) containing an ingredient having a molecular weight of 80,000 or more in 0.5% or less and a photosensitizing agent (B), wherein the amount of said photosensitizing agent (B) is 10 parts by weight or more and 40 parts by weight or less to 100 parts by weight of said alkali-soluble resin (A).
摘要翻译：本发明的目的在于实现防止开放区域中的浮渣生成和提高正型感光性树脂组合物的图案化处理的灵敏度。该目的可以通过包含含有分子量为80,000以上的成分为0.5％以下的碱溶性树脂（A）和光敏剂（B）的正型感光性树脂组合物来实现，其中所述光敏剂（B）为10重量份以上且40重量份以下至100重量份的所述碱溶性树脂（A）。

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