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1. 发明授权

US08530119B2 Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same 有权
标题翻译：正型感光性树脂组合物，固化膜，保护膜，层间绝缘膜，以及使用其的显示元件
公开(公告)号：US08530119B2
公开(公告)日：2013-09-10
申请号：US13321180
申请日：2009-05-20
申请人： Takashi Hirano , Toshio Banba , Shusaku Okamyo , Hiroaki Makabe
发明人： Takashi Hirano , Toshio Banba , Shusaku Okamyo , Hiroaki Makabe
IPC分类号： G03F7/023
CPC分类号： G03F7/0233 , G03F7/0226
摘要： A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.
摘要翻译：正型感光性树脂组合物包含（A）聚苯并恶唑前体树脂，（B）感光性重氮醌化合物，（C）下述通式（1）所示的受阻酚抗氧化剂，（D）下述通式通式（2）。式（1）为：式中，R 1表示氢原子或碳原子数1〜4的有机基团，a为1〜3的整数，b为1〜3的整数。式（2）表示亚甲基或单键，c为1〜3的整数，d为1〜3的整数。保护膜，层间绝缘膜及半导体装置以及使用该键的显示元件也是披露

2. 发明申请

US20120135352A1 Preparation of Norbornane-based PAC Ballasts 有权
标题翻译：制备降冰片烷基PAC镇流器
公开(公告)号：US20120135352A1
公开(公告)日：2012-05-31
申请号：US13248015
申请日：2011-09-28
申请人： Andrew Bell , Keitaro Seto , Hiroaki Makabe , Edmund Elce
发明人： Andrew Bell , Keitaro Seto , Hiroaki Makabe , Edmund Elce
IPC分类号： G03F7/027 , C07C43/11 , C07C43/10 , C07C39/17
CPC分类号： G03F7/022 , C07C39/17 , C07C43/1782 , C07C43/1783 , C07C43/1788 , C07C245/12 , C07C309/71 , C07C2601/16 , C07C2602/10 , C07C2602/24 , C07C2603/86 , G03F7/023 , G03F7/0233 , G03F7/40
摘要： Embodiments in accordance with the present invention provide for norbornane-type ballast materials, norbornane-type photoactive compounds derived from such ballast materials and alkali-soluble positive-tone polymer compositions that encompass such norbornane-type photoactive compounds and one of a PBO or PNB resin.
摘要翻译：根据本发明的实施方案提供了降冰片烷型镇流材料，衍生自这种压载材料的降冰片烷酮型光活性化合物和包括这种降冰片烷烷型光敏化合物和PBO或PNB树脂之一的碱溶性正色聚合物组合物。

3. 发明授权

US07781131B2 Positive photosensitive resin composition, cured layer , protecting layer, insulating layer and semiconductor device and display therewith 有权
标题翻译：正型光敏树脂组合物，固化层，保护层，绝缘层和半导体器件，并显示
公开(公告)号：US07781131B2
公开(公告)日：2010-08-24
申请号：US12194634
申请日：2008-08-20
申请人： Hiroaki Makabe
发明人： Hiroaki Makabe
IPC分类号： G03F7/004
CPC分类号： G03F7/0007 , G03F7/0226 , G03F7/0233 , G03F7/11
摘要： A positive-type photosensitive resin composition comprises (A) an alkali-soluble resin having at least a polybenzoxazole precursor structure, (B) a sensitizer, and (C) a cyclic compound having an alcoholic hydroxyl group. A protecting layer and an insulating layer include a cured layer which is a cured product of the positive-type photosensitive resin composition. A semiconductor device and a display device include the cured layer. According to the present invention, a highly reliable positive-type photosensitive resin composition can be obtained even when cured at a low temperature.
摘要翻译：正型感光性树脂组合物包含（A）至少具有聚苯并恶唑前体结构的碱溶性树脂，（B）敏化剂，（C）具有醇羟基的环状化合物。保护层和绝缘层包括作为正型感光性树脂组合物的固化物的固化层。半导体器件和显示器件包括固化层。根据本发明，即使在低温下固化也可以获得高可靠性的正型感光性树脂组合物。

4. 发明申请

US20100196808A1 Positive photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device therewith 审中-公开
标题翻译：正型感光性树脂组合物，固化膜，保护膜，绝缘膜和半导体器件及其显示装置
公开(公告)号：US20100196808A1
公开(公告)日：2010-08-05
申请号：US12311235
申请日：2009-01-07
申请人： Ayako Mizushima , Hiroaki Makabe , Naoshige Takeda
发明人： Ayako Mizushima , Hiroaki Makabe , Naoshige Takeda
IPC分类号： G03F7/004
CPC分类号： G03F7/0233 , C08G69/42 , G03F7/022 , G03F7/0757
摘要： An objective of the present invention is to achieve both prevention of scum generation in an open area and improvement in sensitivity in patterning process of the positive photosensitive resin composition. This objective can be achieved by a positive photosensitive resin composition comprising an alkali-soluble resin (A) containing an ingredient having a molecular weight of 80,000 or more in 0.5% or less and a photosensitizing agent (B), wherein the amount of said photosensitizing agent (B) is 10 parts by weight or more and 40 parts by weight or less to 100 parts by weight of said alkali-soluble resin (A).
摘要翻译：本发明的目的在于实现防止开放区域中的浮渣生成和提高正型感光性树脂组合物的图案化处理的灵敏度。该目的可以通过包含含有分子量为80,000以上的成分为0.5％以下的碱溶性树脂（A）和光敏剂（B）的正型感光性树脂组合物来实现，其中所述光敏剂（B）为10重量份以上且40重量份以下至100重量份的所述碱溶性树脂（A）。

5. 发明授权

US07524594B2 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films 有权
标题翻译：感光介电树脂组合物，由其形成的薄膜和包含这种薄膜的半导体和显示装置
公开(公告)号：US07524594B2
公开(公告)日：2009-04-28
申请号：US11171391
申请日：2005-07-01
申请人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Ho Kang
发明人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Ho Kang
IPC分类号： G03F7/004 , G03F7/30
CPC分类号： G03F7/0395 , C08F232/08 , C08G61/02 , C08G61/06 , C08G61/12 , C08L65/00 , G03F7/0046 , G03F7/0233 , G03F7/038 , Y10S430/106
摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
摘要翻译：根据本发明的一些实施方案涉及降冰片烯型聚合物和由其形成的光敏介电树脂组合物。其它实施方案涉及由这种组合物形成的膜以及包含这种膜的诸如电子，电子和光电子器件的器件。

6. 发明授权

US08530133B2 Preparation of norbornane-based PAC ballasts 有权
标题翻译：制备降冰片烷基PAC镇流器
公开(公告)号：US08530133B2
公开(公告)日：2013-09-10
申请号：US13248015
申请日：2011-09-28
申请人： Andrew Bell , Keitaro Seto , Hiroaki Makabe , Edmund Elce
发明人： Andrew Bell , Keitaro Seto , Hiroaki Makabe , Edmund Elce
IPC分类号： G03F7/023 , C07C39/12 , C07C245/18 , C07C39/17
CPC分类号： G03F7/022 , C07C39/17 , C07C43/1782 , C07C43/1783 , C07C43/1788 , C07C245/12 , C07C309/71 , C07C2601/16 , C07C2602/10 , C07C2602/24 , C07C2603/86 , G03F7/023 , G03F7/0233 , G03F7/40
摘要： Embodiments in accordance with the present invention provide for norbornane-type ballast materials, norbornane-type photoactive compounds derived from such ballast materials and alkali-soluble positive-tone polymer compositions that encompass such norbornane-type photoactive compounds and one of a PBO or PNB resin.
摘要翻译：根据本发明的实施方案提供了降冰片烷型镇流材料，衍生自这种压载材料的降冰片烷酮型光活性化合物和包括这种降冰片烷烷型光敏化合物和PBO或PNB树脂之一的碱溶性正色聚合物组合物。

7. 发明授权

US07858721B2 Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films 有权
标题翻译：感光介电树脂组合物，由其形成的薄膜和包含这种薄膜的半导体和显示装置
公开(公告)号：US07858721B2
公开(公告)日：2010-12-28
申请号：US12387025
申请日：2009-04-27
申请人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Ho Kang
发明人： Dino Amoroso , Brian Bedwell , Andrew Bell , Edmund Elce , Rajesh Raja Puthenkovilakom , Ramakrishna Ravikiran , Robert Shick , Xiaoming Wu , Hiroaki Makabe , Yasunori Takahashi , Etsu Takeuchi , Daoji Gan , Seok Ho Kang
IPC分类号： C08F232/02 , G03F7/004
CPC分类号： G03F7/0395 , C08F232/08 , C08G61/02 , C08G61/06 , C08G61/12 , C08L65/00 , G03F7/0046 , G03F7/0233 , G03F7/038 , Y10S430/106
摘要： Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
摘要翻译：根据本发明的一些实施方案涉及降冰片烯型聚合物和由其形成的光敏介电树脂组合物。其它实施方案涉及由这种组合物形成的膜以及包含这种膜的诸如电子，电子和光电子器件的器件。

8. 发明授权

US06576381B1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06576381B1
公开(公告)日：2003-06-10
申请号：US09913156
申请日：2001-08-10
申请人： Takashi Hirano , Kagehisa Yamamoto , Toshio Banba , Hiroaki Makabe
发明人： Takashi Hirano , Kagehisa Yamamoto , Toshio Banba , Hiroaki Makabe
IPC分类号： G03C300
CPC分类号： H01L24/12 , C08G73/22 , C09D179/04 , G03F7/0233 , H01L23/5329 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/11 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15787 , H01L2924/19042 , H01L2924/00 , H01L2924/00014
摘要： The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising: (a) a polybenzoxazole resin film for chip protection, obtained by coating, on a circuit-formed chip, a positive photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 100 parts by weight of a photosensitive diazoquinone compound, and subjecting the coated composition to patterning and curing, and (b) a bump electrode.
摘要翻译：本发明减轻了倒装芯片生产中的操作问题，并且提供了在各种可靠性方面优异的半导体器件。本发明的目的在于一种封装半导体装置，其特征在于，包括：（a）通过在电路形成的芯片上涂布由100重量份聚酰胺和1〜100重量份的正型感光性树脂组合物而得到的用于芯片保护的聚苯并恶唑树脂膜重量份的光敏重氮醌化合物，并对涂覆的组合物进行图案化和固化，和（b）凸块电极。

9. 发明申请

US20100062273A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME 审中-公开
标题翻译：光敏树脂组合物，固化膜，保护膜，绝缘膜，半导体器件和使用其的显示器件
公开(公告)号：US20100062273A1
公开(公告)日：2010-03-11
申请号：US12525309
申请日：2008-02-18
申请人： Hiroaki Makabe , Koji Terakawa
发明人： Hiroaki Makabe , Koji Terakawa
IPC分类号： B32B27/06 , C08J3/28 , B32B9/04
CPC分类号： H01L21/02118 , C08G73/10 , C08G73/22 , C08L79/04 , C08L79/08 , G03F7/022 , G03F7/0233 , H01L21/02282 , H01L21/312 , Y10T428/31721
摘要： A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250° C. to a cyclization rate [B] (%) at 300° C. of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided.
摘要翻译：光敏树脂组合物包括具有聚苯并恶唑前体结构的碱溶性树脂或聚酰亚胺前体结构，或二者均为光敏剂，所述碱溶性树脂的环化速率[（A] / [B]）为[ A]（％）在300℃下的环化速率[B]（％）为0.70以上。根据本发明，在半导体器件，固化膜，保护膜，绝缘膜和半导体器件的制造中具有高灵敏度和高生产率的感光性树脂组合物以及使用该固化膜的显示装置提供。

10. 发明授权

US06235436B1 Semiconductor device using positive photosensitive resin composition and process for preparation thereof 有权
标题翻译：使用正型感光性树脂组合物的半导体装置及其制备方法
公开(公告)号：US06235436B1
公开(公告)日：2001-05-22
申请号：US09442277
申请日：1999-11-17
申请人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
发明人： Takashi Hirano , Toshio Banba , Hiroaki Makabe , Naoshige Takeda , Toshiro Takeda
IPC分类号： G03F730
CPC分类号： G03F7/0226 , G03F7/0755 , G03F7/0757 , Y10S430/107
摘要： A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 &mgr;m on a semiconductor element.
摘要翻译：一种正型感光性树脂组合物，其包含（A）100重量份由通式（1）表示的聚酰胺：其中X表示四价芳族基团; Y表示二价芳基; Z表示由下式表示的二价基团：其中R 1和R 2表示二价有机基团，并且R 3和R 4表示一价有机基团; a和b表示摩尔分数; a + b = 100摩尔％ a = 60.0-100.0摩尔％ b = 0-40.0摩尔％ n表示2〜500的整数，（B）1〜100重量份感光性重氮醌化合物和（C）1〜50重量份由特定结构式表示的酚化合物和/或（D） 0.1〜20重量份的由具体结构式表示的有机硅化合物; 以及半导体装置，其中通过使用上述感光性树脂组合物得到的聚苯并恶唑树脂的图案在半导体元件上形成为0.1〜20μm的厚度。

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