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1. 发明授权

US06993836B2 Circuit board and method of manufacturing same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US06993836B2
公开(公告)日：2006-02-07
申请号：US10648187
申请日：2003-08-27
申请人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
发明人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
IPC分类号： H01K3/10
CPC分类号： H05K3/462 , H05K1/0268 , H05K3/386 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/066 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.
摘要翻译：可以获得具有稳定的连接电阻的电路板。多层电路板包括以下步骤：在不可压缩的基板上形成通孔，该基板在其任一侧经由接合层具有膜; 将导电膏填充到通孔中; 从基板去除膜; 将金属箔层叠到基板的任一侧并在压力下加热相同以使粘合层硬化，将金属箔粘合到基板上并将基板的侧面彼此电连接; 并通过加工金属箔形成电路图案。

2. 发明授权

US06700071B2 Multi-layer circuit board having at least two or more circuit patterns connected 失效
标题翻译：具有连接至少两个或更多个电路图案的多层电路板
公开(公告)号：US06700071B2
公开(公告)日：2004-03-02
申请号：US09928966
申请日：2001-08-14
申请人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
发明人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
IPC分类号： H05K103
CPC分类号： H05K3/462 , H05K1/0268 , H05K3/386 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/066 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board having stable connection resistance can be obtained . The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.
摘要翻译：可以获得具有稳定的连接电阻的电路板。多层电路板包括以下步骤：在不可压缩的基板上形成通孔，该基板在其任一侧经由接合层具有膜; 将导电膏填充到通孔中; 从基板去除膜; 将金属箔层叠到基板的任一侧并在压力下加热相同以使粘合层硬化，将金属箔粘合到基板上并将基板的侧面彼此电连接; 并通过加工金属箔形成电路图案。

3. 发明授权

US06528733B2 Multi-layer circuit board and method of manufacturing same 失效
公开(公告)号：US06528733B2
公开(公告)日：2003-03-04
申请号：US09902800
申请日：2001-07-12
申请人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
发明人： Toshiaki Takenaka , Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hideaki Komoda , Kunio Kishimoto
IPC分类号： H05K103
CPC分类号： H05K3/4614 , H05K3/4069 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155
摘要： An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.

4. 发明授权

US07105277B2 Printing plate, circuit board and method of printing circuit board 有权
标题翻译：印版，电路板和印刷电路板的方法
公开(公告)号：US07105277B2
公开(公告)日：2006-09-12
申请号：US10490482
申请日：2003-09-19
申请人： Toshiaki Takenaka , Toshihiro Nishii , Hideaki Komoda , Toshikazu Kondo , Shinji Nakamura
发明人： Toshiaki Takenaka , Toshihiro Nishii , Hideaki Komoda , Toshikazu Kondo , Shinji Nakamura
IPC分类号： G03F7/00 , G03F7/20
CPC分类号： H05K3/1225 , B41F15/36 , B41F35/003 , B41M1/12 , B41N1/24 , B41N1/248 , H05K3/0052 , H05K3/4053 , H05K3/4069 , H05K2201/09063 , H05K2201/09709 , H05K2203/0191
摘要： The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.
摘要翻译：本发明的目的在于提供一种印版，其能够防止粘贴在刮板的边缘上的高粘度浆料通过刮板方法被填充时被转移到印刷电路板的通孔上并留在印刷电路板的通孔上。印版具有设置有形成在其上的刮板清洁部（7）的金属板（3），并固定在安装在板框架（1）上的掩模（2）的倾斜区域（5）的背面。印刷电路板的通孔只有在通过刮板清洁部分（7）除去粘附到刮板的边缘的高粘度的浆料之后才能填充糊料，以防止糊料留在通孔上，从而实现印刷电路板质量优良。

5. 发明授权

US07018672B2 Circuit board producing method and circuit board producing device 失效
公开(公告)号：US07018672B2
公开(公告)日：2006-03-28
申请号：US10182632
申请日：2001-12-04
申请人： Toshiaki Takenaka , Toshihiro Nishii , Yuichiro Sugita , Shinji Nakamura , Hideaki Komoda , Toshikazu Kondo
发明人： Toshiaki Takenaka , Toshihiro Nishii , Yuichiro Sugita , Shinji Nakamura , Hideaki Komoda , Toshikazu Kondo
IPC分类号： B05D5/12 , B05D3/12 , B41M1/12 , B41F9/10
CPC分类号： H05K3/4069 , H05K1/095 , H05K3/1233 , H05K3/247 , H05K2201/035 , H05K2201/0355 , H05K2203/1461 , H05K2203/1476 , Y10T29/49155 , Y10T29/49165
摘要： A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.

6. 发明授权

US06820331B2 Method of manufacturing a circuit board and its manufacturing apparatus 失效
标题翻译：制造电路板及其制造装置的方法
公开(公告)号：US06820331B2
公开(公告)日：2004-11-23
申请号：US09736499
申请日：2000-12-15
申请人： Kunio Kishimoto , Toshihiro Nishii , Toshiaki Takenaka , Shinji Nakamura , Akihiro Miura
发明人： Kunio Kishimoto , Toshihiro Nishii , Toshiaki Takenaka , Shinji Nakamura , Akihiro Miura
IPC分类号： H01K310
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/0055 , H05K3/0088 , H05K2201/0355 , H05K2203/0191 , H05K2203/0257 , H05K2203/0285 , H05K2203/0786 , H05K2203/081 , H05K2203/1461 , Y10S134/902 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , Y10T428/13
摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.
摘要翻译：通过去除受影响的材料和形成孔时产生的异物，可以获得清洁的高质量电路板。电路基板的制造方法包括：（a）通过将作为掩模的膜材料粘合到基板材料上来制备薄膜基板材料，（b）通过向其施加激光而在薄膜基板材料上形成孔，（c）通过超声波清洗，不从膜材剥离薄膜材料，从薄膜基板材料上选择性除去粘附在薄膜基板材料上的不必要的材料。当形成孔时产生诸如异物等不必要的材料，并且不需要的材料粘附到基板材料上。在去除这种不必要的材料之后，使用膜材料作为掩模将导电材料设置在孔中，并且膜材料随后从基板材料中去除。

7. 发明授权

US07143772B2 Method of manufacturing a circuit board and its manufacturing apparatus 有权
标题翻译：制造电路板及其制造装置的方法
公开(公告)号：US07143772B2
公开(公告)日：2006-12-05
申请号：US10733283
申请日：2003-12-12
申请人： Kunio Kishimoto , Toshihiro Nishii , Toshiaki Takenaka , Shinji Nakamura , Akihiro Miura
发明人： Kunio Kishimoto , Toshihiro Nishii , Toshiaki Takenaka , Shinji Nakamura , Akihiro Miura
IPC分类号： B08B3/12
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/0055 , H05K3/0088 , H05K2201/0355 , H05K2203/0191 , H05K2203/0257 , H05K2203/0285 , H05K2203/0786 , H05K2203/081 , H05K2203/1461 , Y10S134/902 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , Y10T428/13
摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.
摘要翻译：通过去除受影响的材料和形成孔时产生的异物，可以获得清洁的高质量电路板。电路基板的制造方法包括：（a）通过将作为掩模的膜材料粘合到基板材料上来制备薄膜基板材料，（b）通过向其施加激光而在薄膜基板材料上形成孔，（c）通过超声波清洗，不从膜材剥离薄膜材料，从薄膜基板材料上选择性除去粘附在薄膜基板材料上的不必要的材料。当形成孔时产生诸如异物等不必要的材料，并且不需要的材料粘附到基板材料上。在去除这种不必要的材料之后，使用膜材料作为掩模将导电材料设置在孔中，并且膜材料随后从基板材料中去除。

8. 发明授权

US06893530B2 Method and system of drying materials and method of manufacturing circuit boards using the same 失效
标题翻译：干燥材料的方法和系统以及使用其制造电路板的方法
公开(公告)号：US06893530B2
公开(公告)日：2005-05-17
申请号：US10068025
申请日：2002-02-08
申请人： Kunio Kishimoto , Toshihiro Nishii , Toshiaki Takenaka , Shinji Nakamura , Akihiro Miura
发明人： Kunio Kishimoto , Toshihiro Nishii , Toshiaki Takenaka , Shinji Nakamura , Akihiro Miura
IPC分类号： F26B5/04 , H05K3/00 , H05K3/22 , H05K3/40 , F26B3/00
CPC分类号： H05K3/4069 , F26B5/04 , H05K3/0032 , H05K3/0055 , H05K3/227 , H05K2201/0355 , H05K2203/0191 , H05K2203/081 , H05K2203/085 , H05K2203/1461
摘要： A method and system of cleaning to remove cutting dust and the like generated and adhering to a board material (1a) during drilling for electrical connection, and drying the board material, in a process of manufacturing a circuit board for small electronic equipment and the like. A large amount of board materials can be treated without receiving thermal damage by performing the steps of: placing sheets of the board material that have absorbed moisture resulting from cleaning, like a stack in a vacuum chamber (11); and drying the board material by repeating evacuation and pressurization under predetermined conditions while heating the board material.
摘要翻译：在制造小型电子设备的电路板的过程中，清洁以除去在钻孔期间产生并附着在板材料（1a）上的电气连接和干燥板材的切割灰尘等的方法和系统，喜欢。可以通过执行以下步骤来处理大量的板材料：不会在真空室（11）中将堆积的吸收湿气的板材的片材放置在真空室（11）中; 并在加热基板材料的同时在预定条件下重复抽真空并干燥板材。

9. 发明授权

US06890449B2 Method for manufacturing printed-circuit board 失效
标题翻译：印刷电路板制造方法
公开(公告)号：US06890449B2
公开(公告)日：2005-05-10
申请号：US10048927
申请日：2001-06-05
申请人： Eiji Kawamoto , Shigeru Yamane , Toshiaki Takenaka , Toshihiro Nishii
发明人： Eiji Kawamoto , Shigeru Yamane , Toshiaki Takenaka , Toshihiro Nishii
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40 , H01K13/00 , H05K3/36
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2201/09827 , H05K2201/09845 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126
摘要： A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes; removing the releasing layers and disposing metal foil on both faces of the substrate; and heat pressing them. A diameter of the through-holes is larger than that of corresponding holes formed on the releasing layers. According to the present invention, when the conductive paste is compressed, conductive paste protruding from the surface of the substrate is trapped at the edges of the through-holes. This configuration prevents short circuits with undesirable wiring patterns. So, an enough amount of the conductive paste can protrude from the surface of the substrate. Therefore, after the compression, stable electric connections inside the conductive paste and between the conductive paste and the metal foils are ensured, thus PCBs with superior reliability can be produced.
摘要翻译：一种制造PCB的方法，包括以下步骤：在前面和背面上形成具有释放层的衬底中的通孔; 在通孔中填充导电膏; 去除释放层并在金属箔的两个面上设置金属箔; 并热压它们。通孔的直径大于形成在释放层上的相应孔的直径。根据本发明，当导电膏被压缩时，从基板的表面突出的导电糊被截留在通孔的边缘。这种配置可以防止出现不良布线图形的短路。因此，足够量的导电膏可以从基板的表面突出。因此，在压缩之后，确保导电浆料内部和导电性糊料与金属箔之间的稳定的电连接，从而可以制造出具有高可靠性的PCB。

10. 发明授权

US07066344B2 Mask film, its manufacturing method, and manufacturing method of circuit board using the same 失效
公开(公告)号：US07066344B2
公开(公告)日：2006-06-27
申请号：US10338642
申请日：2003-01-09
申请人： Toshiaki Takenaka , Toshikazu Kondo , Kunio Kishimoto , Shinji Nakamura , Fumio Echigo
发明人： Toshiaki Takenaka , Toshikazu Kondo , Kunio Kishimoto , Shinji Nakamura , Fumio Echigo
IPC分类号： H01B13/00
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2203/0191 , H05K2203/0522 , H05K2203/1461 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.

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