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    • 1. 发明授权
    • Multilayer wiring board
    • 多层接线板
    • US08022310B2
    • 2011-09-20
    • US12193311
    • 2008-08-18
    • Toru OkazakiHideo Suzuki
    • Toru OkazakiHideo Suzuki
    • H05K1/03
    • H05K3/4688H05K1/0271H05K1/0366H05K2201/029Y10T29/49124Y10T29/49155
    • The present invention provides a multilayer wiring board in which warpage during reflow soldering can be reduced even if there is no sufficient space for disposing a dummy pattern or if a dummy pattern cannot be disposed. A difference between the ratios of copper remaining in wiring layers causes a difference between the amounts of thermal expansion of the wiring layers. The fiber bundle content of at least one resin base material layer is made different from that of the other resin base material layers, to cause a difference between the amounts of thermal expansion of the resin base material layers. This difference between the amounts of thermal expansion of the resin base material layers is used to cancel the difference between the amounts of thermal expansion of the wiring layers. Thus, warpage of the board during reflow soldering is reduced.
    • 本发明提供一种多层布线基板,其中即使没有足够的空间来设置虚设图案,或者如果不能设置虚设图案,则可以降低回流焊接期间的翘曲。 布线层中残留的铜的比例之间的差异导致布线层的热膨胀量之间的差异。 使至少一个树脂基材层的纤维束含量与其它树脂基材层的纤维束含量不同,导致树脂基材层的热膨胀量之间的差异。 使用树脂基材层的热膨胀量之间的这种差异来消除布线层的热膨胀量之差。 因此,在回流焊接期间板的翘曲减小。
    • 2. 发明申请
    • MULTILAYER WIRING BOARD
    • 多层接线板
    • US20090052835A1
    • 2009-02-26
    • US12193311
    • 2008-08-18
    • Toru OkazakiHideo Suzuki
    • Toru OkazakiHideo Suzuki
    • G02B6/00
    • H05K3/4688H05K1/0271H05K1/0366H05K2201/029Y10T29/49124Y10T29/49155
    • The present invention provides a multilayer wiring board in which warpage during reflow soldering can be reduced even if there is no sufficient space for disposing a dummy pattern or if a dummy pattern cannot be disposed. A difference between the ratios of copper remaining in wiring layers causes a difference between the amounts of thermal expansion of the wiring layers. The fiber bundle content of at least one resin base material layer is made different from that of the other resin base material layers, to cause a difference between the amounts of thermal expansion of the resin base material layers. This difference between the amounts of thermal expansion of the resin base material layers is used to cancel the difference between the amounts of thermal expansion of the wiring layers. Thus, warpage of the board during reflow soldering is reduced.
    • 本发明提供一种多层布线基板,其中即使没有足够的空间来设置虚设图案,或者如果不能设置虚设图案,则可以降低回流焊接期间的翘曲。 布线层中残留的铜的比例之间的差异导致布线层的热膨胀量之间的差异。 使至少一个树脂基材层的纤维束含量与其它树脂基材层的纤维束含量不同,导致树脂基材层的热膨胀量之间的差异。 使用树脂基材层的热膨胀量之间的这种差异来消除布线层的热膨胀量之差。 因此,在回流焊接期间板的翘曲减小。
    • 4. 发明授权
    • Biomass hydrothermal decomposition apparatus, temperature control method thereof, and organic raw material production system using biomass material
    • 生物质水热分解装置及其温度控制方法以及使用生物质材料的有机原料生产系统
    • US09102956B2
    • 2015-08-11
    • US13132040
    • 2010-03-10
    • Minoru GentaRyosuke UeharaHideo SuzukiSeiichi Terakura
    • Minoru GentaRyosuke UeharaHideo SuzukiSeiichi Terakura
    • C12M1/40B01J19/00C08B15/00C12P7/10C10L1/02
    • C12P7/10C10G2300/1014C10G2300/805C10L1/02Y02E50/16Y02P30/20
    • A biomass hydrothermal decomposition apparatus that feeds a solid biomass material 11 from one side of an apparatus body 42, feeds hot water 15 from the other side, to hydrothermally decompose the biomass material 11 while bringing the biomass material 11 into counter contact with the hot water 15, dissolves hot-water soluble fractions in hot water, discharges the hot water to outside from the one side of the apparatus body 42 as a hot-water effluent 16, and discharges a biomass solid (a hot water insoluble) 17 to outside from the other side. The biomass hydrothermal decomposition apparatus includes an effective reaction region A formed from the other side to the one side of the apparatus body 42, in which a feeding temperature of the hot water 15 (for example, 200° C.) is maintained for a predetermined period of time to cause hydrothermal decomposition, and a temperature drop region B in which a temperature is rapidly dropped to a temperature (for example, 140° C.) at which the hot-water soluble fractions are not excessively decomposed (for example, from 200° C. to 140° C.), immediately after it is out of the effective reaction region A.
    • 从装置本体42的一侧供给固体生物质材料11的生物质热液分解装置从另一侧供给热水15,使生物质材料11热水分解,同时使生物质材料11与热水反接触 15,将热水溶性部分溶解在热水中,将热水从装置主体42的一侧作为热水流出物16排出到外部,将生物质固体(不溶于热水)17排出到外部 另一边。 生物质热液分解装置包括从设备主体42的另一侧形成的有效反应区域A,其中将热水15的供给温度(例如200℃)保持在预定的温度 引起水热分解的时间段,以及温度迅速下降到热水可溶级分未过分分解的温度(例如140℃)的温度下降区域B(例如, 200℃至140℃),刚刚离开有效反应区域A.
    • 8. 发明授权
    • Process for production of coumarin dimer compound
    • 生产香豆素二聚体化合物的方法
    • US08258318B2
    • 2012-09-04
    • US12451213
    • 2008-04-28
    • Hideo SuzukiTakayuki Tamura
    • Hideo SuzukiTakayuki Tamura
    • C07D311/00
    • C07D493/04
    • There is provided a one-step process for producing a dihydroxy-substituted coumarin dimer compound by a photodimerization reaction of a hydroxy-substituted coumarin compound. The process comprises subjecting a hydroxy-substituted coumarin compound to a photodimerization reaction in a solvent selected from aliphatic ketones having 3 to 10 carbon atoms, aliphatic carboxylic acid esters having 2 to 10 carbon atoms, aliphatic alcohols having 1 to 10 carbon atoms, aliphatic nitriles having 2 to 10 carbon atoms, ethers having 4 to 10 carbon atoms, amides having 3 to 10 carbon atoms, and a mixture thereof to obtain a dihydroxy-substituted coumarin dimer compound.
    • 提供了通过羟基取代的香豆素化合物的光二聚反应制备二羟基取代的香豆素二聚体化合物的一步法。 该方法包括使羟基取代的香豆素化合物在选自具有3至10个碳原子的脂族酮,2至10个碳原子的脂肪族羧酸酯,1至10个碳原子的脂族醇,脂族醇,脂族腈 具有2至10个碳原子,具有4至10个碳原子的醚,具有3至10个碳原子的酰胺及其混合物,以获得二羟基取代的香豆素二聚体化合物。