会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Process for production of coumarin dimer compound
    • 生产香豆素二聚体化合物的方法
    • US08258318B2
    • 2012-09-04
    • US12451213
    • 2008-04-28
    • Hideo SuzukiTakayuki Tamura
    • Hideo SuzukiTakayuki Tamura
    • C07D311/00
    • C07D493/04
    • There is provided a one-step process for producing a dihydroxy-substituted coumarin dimer compound by a photodimerization reaction of a hydroxy-substituted coumarin compound. The process comprises subjecting a hydroxy-substituted coumarin compound to a photodimerization reaction in a solvent selected from aliphatic ketones having 3 to 10 carbon atoms, aliphatic carboxylic acid esters having 2 to 10 carbon atoms, aliphatic alcohols having 1 to 10 carbon atoms, aliphatic nitriles having 2 to 10 carbon atoms, ethers having 4 to 10 carbon atoms, amides having 3 to 10 carbon atoms, and a mixture thereof to obtain a dihydroxy-substituted coumarin dimer compound.
    • 提供了通过羟基取代的香豆素化合物的光二聚反应制备二羟基取代的香豆素二聚体化合物的一步法。 该方法包括使羟基取代的香豆素化合物在选自具有3至10个碳原子的脂族酮,2至10个碳原子的脂肪族羧酸酯,1至10个碳原子的脂族醇,脂族醇,脂族腈 具有2至10个碳原子,具有4至10个碳原子的醚,具有3至10个碳原子的酰胺及其混合物,以获得二羟基取代的香豆素二聚体化合物。
    • 6. 发明申请
    • POLYAMIC ACID AND POLYIMIDE
    • 聚氨酯和聚酰亚胺
    • US20090182115A1
    • 2009-07-16
    • US12295705
    • 2007-02-28
    • Hideo SuzukiTakayuki TamuraKentaro Ohmori
    • Hideo SuzukiTakayuki TamuraKentaro Ohmori
    • C08G73/10C08G69/26
    • C08G73/10
    • Disclosed are a polyamic acid containing not less than 10 mol % of a repeating unit represented by the formula [1] below, and a polyimide represented by the formula [2] below which is obtained from such a polyamic acid. The polyamic acid and polyimide have high heat resistance as shown by a thermal decomposition temperature of not less than 300° C. In addition, the polyamic acid and polyimide have good workability because of their high solubility in solvents, while exhibiting good light transmission. (In the formulae, R1 and R2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 and R4 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms or a phenyl group, or alternatively R3 and R4 on adjacent carbon atoms may combine together to form a cycloalkyl group having 3 to 8 carbon atoms or a phenyl group; R5 represents a divalent organic group; and n represents an integer of not less than 2.)
    • 公开了含有不少于10摩尔%的由下式[1]表示的重复单元的聚酰胺酸和由这种聚酰胺酸获得的由下式[2]表示的聚酰亚胺。 聚酰胺酸和聚酰亚胺具有如热分解温度不低于300℃所示的高耐热性。另外,由于聚酰胺酸和聚酰亚胺在溶剂中的溶解性高,同时具有良好的透光性,因此具有良好的加工性。 (式中,R 1和R 2分别表示氢原子或碳原子数1〜10的烷基,R 3和R 4分别表示氢原子,卤素原子,碳原子数1〜10的烷基或苯基 或者相邻碳原子上的R3和R4可以结合在一起形成具有3〜8个碳原子的环烷基或苯基; R 5表示二价有机基团,n表示不小于2的整数)
    • 7. 发明授权
    • Polyamic acid and polyimide
    • 聚酰胺酸和聚酰亚胺
    • US07906611B2
    • 2011-03-15
    • US12295705
    • 2007-02-28
    • Hideo SuzukiTakayuki TamuraKentaro Ohmori
    • Hideo SuzukiTakayuki TamuraKentaro Ohmori
    • C08G73/10
    • C08G73/10
    • Disclosed are a polyamic acid containing not less than 10 mol % of a repeating unit represented by the formula [1] below, and a polyimide represented by the formula [2] below which is obtained from such a polyamic acid. The polyamic acid and polyimide have high heat resistance as shown by a thermal decomposition temperature of not less than 300° C. In addition, the polyamic acid and polyimide have good workability because of their high solubility in solvents, while exhibiting good light transmission. (In the formula, R1 and R2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 and R4 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms or a phenyl group, or alternatively R3 and R4 on adjacent carbon atoms may combine together to form a cycloalkyl group having 3 to 8 carbon atoms or a phenyl group; R5 represents a divalent organic group; and n represents an integer of not less than 2.)
    • 公开了含有不少于10摩尔%的由下式[1]表示的重复单元的聚酰胺酸和由这种聚酰胺酸获得的由下式[2]表示的聚酰亚胺。 聚酰胺酸和聚酰亚胺具有如热分解温度不低于300℃所示的高耐热性。另外,由于聚酰胺酸和聚酰亚胺在溶剂中的溶解性高,同时具有良好的透光性,因此具有良好的加工性。 (式中,R 1和R 2分别表示氢原子或碳原子数1〜10的烷基,R 3和R 4分别表示氢原子,卤素原子,碳原子数1〜10的烷基或苯基 或者相邻碳原子上的R3和R4可以结合在一起形成具有3〜8个碳原子的环烷基或苯基; R 5表示二价有机基团,n表示不小于2的整数)
    • 8. 发明申请
    • POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND DPOLYHYDROXYAMIDE RESIN
    • 阳性光敏树脂组合物和DPOLYHYDROXYAMIDE树脂
    • US20100119969A1
    • 2010-05-13
    • US12451906
    • 2008-05-27
    • Kazuya EbaraHideo SuzukiTakayuki Tamura
    • Kazuya EbaraHideo SuzukiTakayuki Tamura
    • G03F7/004C08G63/00
    • C08G69/28C08G69/26C08G69/265C08G69/40C08G69/42G03F7/0045G03F7/0233G03F7/0387G03F7/0757G03F7/40
    • There is provided a positive photosensitive resin composition that is excellent in electric insulating properties, heat resistance, mechanical strength and electrical characteristics, and capable of forming a high-resolution circuit pattern. The positive photosensitive resin composition comprises at least one type of a polyhydroxyamide resin containing a repeating unit represented by Formula (1) and having a weight average molecular weight of 3,000 to 100,000, and a compound generating an acid by light irradiation. (where X represents a tetravalent aliphatic group or an aromatic group; R1 and R2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atom(s); Ar1 and Ar2 independently represent an aromatic group; Y represents an organic group containing an aromatic group substituted with at least one OH group; n represents an integer of 1 or more; and l and m independently represent an integer of 0 or 1 or more and satisfy l+m≦2).
    • 提供了具有优异的电绝缘性,耐热性,机械强度和电特性并且能够形成高分辨率电路图案的正型感光性树脂组合物。 正型感光性树脂组合物包含至少一种含有式(1)表示的重均单元,重均分子量为3,000〜100,000的聚羟基酰胺树脂和通过光照射产生酸的化合物。 (其中X表示四价脂肪族基团或芳香族基团; R 1和R 2分别表示氢原子或碳原子数1〜10的烷基,Ar 1和Ar 2独立地表示芳香族基,Y表示含有 被至少一个OH基团取代的芳基; n表示1以上的整数,l和m分别表示0或1以上的整数,满足l + m< 1lE; 2)。
    • 9. 发明申请
    • POLYAMIC ACIDS, POLYIMIDES, AND PROCESSES FOR THE PRODUCTION THEREOF
    • 聚氨酯,聚酰亚胺和其生产方法
    • US20100063243A1
    • 2010-03-11
    • US11909896
    • 2006-03-24
    • Hideo SuzukiTakayuki Tamura
    • Hideo SuzukiTakayuki Tamura
    • C08G73/10C08G69/08
    • C08G73/10
    • To provide polyamic acids and polyimides, which have high light transmittance and heat resistance such that their thermal decomposition temperatures are at least 300° C. and which are excellent in their solubility in solvents and have their processability improved.A polyamic acid comprising repeating units represented by the following formula (1), characterized in that at least 10 mol % of A has a structure represented by the formula (2), or a polyimide obtainable by cyclodehydration of such a polyamic acid. wherein A is a tetravalent organic group, B is a bivalent organic group, and n is a positive integer; and wherein each of R1 and R2 which are independent of each other, is a hydrogen atom, a halogen atom, a C1-10 alkyl group, a C1-10 halogenated alkyl group, a C3-8 cycloalkyl group, a phenyl group or a cyano group, and a1 to a4 represent binding sites in the formula (1), provided that a1 and a3 are not simultaneously bonded to the carboxyl groups, and a2 and a4 are not simultaneously bonded to the carboxyl groups.
    • 提供具有高透光性和耐热性的聚酰胺酸和聚酰亚胺,使得其热分解温度为至少300℃,并且其在溶剂中的溶解性优异并且其加工性能得到改善。 包含由下式(1)表示的重复单元的聚酰胺酸,其特征在于至少10摩尔%的A具有由式(2)表示的结构,或通过这种聚酰胺酸的环化脱水得到的聚酰亚胺。 其中A为四价有机基团,B为二价有机基团,n为正整数; 并且其中彼此独立的R 1和R 2各自为氢原子,卤素原子,C 1-10烷基,C 1-10卤代烷基,C 3-8环烷基,苯基或 氰基,a1〜a4表示式(1)中的结合位置,条件是a1和a3不同时键合到羧基上,a2和a4不同时键合到羧基上。