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1. 发明授权

US06633098B2 Alternator for use in a vehicle 失效
标题翻译：用于车辆的发电机
公开(公告)号：US06633098B2
公开(公告)日：2003-10-14
申请号：US10054879
申请日：2002-01-25
申请人： Toru Inaba , Hideaki Mori , Keizou Kawamura , Susumu Sasaki , Masami Takano , Susumu Tajima , Susumu Terumoto
发明人： Toru Inaba , Hideaki Mori , Keizou Kawamura , Susumu Sasaki , Masami Takano , Susumu Tajima , Susumu Terumoto
IPC分类号： H02K900
CPC分类号： H02K5/20 , H02K5/18 , H02K9/10 , H02K9/19
摘要： An alternator for use in an automobile includes brackets for supporting a rotation shaft at both sides of a rotor, being thermally connected to a stator for supporting the stator, while one side of the rotor is closed by a bracket. A cooling water passage is provided in the bracket, a cooling fan is provided on the closed side of the rotor, and a cooling fin provided opposing to the cooling fan and in vicinity of the cooling water passage, thereby enabling cool down of the stator and the rotor, effectively, with low noises, and thereby obtaining a high power output.
摘要翻译：用于汽车的交流发电机包括用于在转子的两侧支撑旋转轴的支架，与用于支撑定子的定子热连接，同时转子的一侧由支架封闭。在支架上设有冷却水通道，在转子的封闭侧设有冷却风扇，与冷却风扇相对设置在冷却水通道附近设置的冷却风扇，从而能够使定子冷却，转子，有效地，低噪音，从而获得高功率输出

2. 发明授权

US06621186B2 Alternator for vehicles 失效
公开(公告)号：US06621186B2
公开(公告)日：2003-09-16
申请号：US09950795
申请日：2001-09-13
申请人： Keizou Kawamura , Hideaki Mori , Susumu Sasaki , Susumu Tajima , Masami Takano
发明人： Keizou Kawamura , Hideaki Mori , Susumu Sasaki , Susumu Tajima , Masami Takano
IPC分类号： H02K900
CPC分类号： H02K9/06 , H02K9/22
摘要： An alternator for vehicles, provided with a stator, a rotor, a rectifier and a voltage regulator, and comprising turbulent flow generating members 22 provided on heat transfer surfaces, through which heat generated from a field coil is transferred to a side of a bracket from a rotor, to generate convection of an air and turbulence of flow on downstream regions of recesses and projections, whereby a heat transfer performance from the rotor to the bracket is enhanced with a rotational frequency of the rotor.

3. 发明授权

US5345107A Cooling apparatus for electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5345107A
公开(公告)日：1994-09-06
申请号：US839071
申请日：1992-02-20
申请人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
发明人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
IPC分类号： F28F13/00 , H01L23/433 , H01L23/473 , H01L25/065 , F28F7/00 , H01L23/00 , H05K7/20
CPC分类号： H01L24/32 , F28F13/00 , H01L23/4338 , H01L23/473 , H01L25/0655 , F28F2013/005 , H01L2224/16 , H01L2224/32057 , H01L2224/73253 , H01L2224/73257 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/0132 , H01L2924/15312 , H01L2924/16152
摘要： The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.
摘要翻译：本发明涉及一种用于电子设备的冷却装置，其中在其与电子设备接触的一个表面上设置有通过导电流体与电子设备的传热部分紧密接触的冷却固体，与提供与传热部分的外部连通的多个槽，以及用于将该冷却固体本体弹性挤压在电子装置上的弹簧构件，用于迫使冷却固体与电子装置紧密接触，借助于导热流体在第三层。

4. 发明授权

US5705850A Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US5705850A
公开(公告)日：1998-01-06
申请号：US290155
申请日：1994-08-15
申请人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
发明人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H01L21/10 , H01L23/34 , H02B1/00 , H02B1/01
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
摘要翻译：所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。散热器一体地形成在壳体上。利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。

5. 发明授权

US5683790A Multilayer ceramic parts 失效
标题翻译：多层陶瓷件
公开(公告)号：US5683790A
公开(公告)日：1997-11-04
申请号：US514796
申请日：1995-08-14
申请人： Kazuaki Suzuki , Makoto Kobayashi , Taro Miura , Keizou Kawamura
发明人： Kazuaki Suzuki , Makoto Kobayashi , Taro Miura , Keizou Kawamura
IPC分类号： C04B35/64 , C04B37/00 , H01L21/48 , H01P1/203 , H01P7/08 , H01P11/00 , H05K3/46 , B32B3/00 , B32B15/00 , C03C8/22 , C03C27/04
CPC分类号： H01L21/4857 , H01P11/008 , Y10S428/901 , Y10T428/12618 , Y10T428/24917 , Y10T428/24926
摘要： A multilayer ceramic part including dielectric ceramic layers and internal conductor layers is prepared by forming dielectric ceramic layers from an oxide system dielectric ceramic material having a sintering completion temperature between the melting point and the boiling point of the internal conductor. A pattern of internal conductor is formed on dielectric ceramic layers. The dielectric ceramic layers are placed one on another so as to sandwich the internal conductor pattern therebetween. The laminate is fired at or above the melting point of the internal conductor, optionally in an atmosphere having a controlled oxygen partial pressure. Since the dielectric ceramic material has an improved dielectric constant and dielectric loss and the internal conductor is densified and improved in surface property, the part is improved in resonator Q value and other properties. This minimizes the occurrence of defective parts in which the internal conductor is separated from the dielectric ceramic layer and minimizes a failure in the internal conductor layer.
摘要翻译：通过从具有在内部导体的熔点和沸点之间的烧结完成温度的氧化物系介电陶瓷材料形成介电陶瓷层来制备包括电介质陶瓷层和内部导体层的多层陶瓷部件。在介电陶瓷层上形成内部导体的图形。电介质陶瓷层一个接一个地放置在其间夹着内部导体图案。层压体在内部导体的熔点以上或任意地在具有受控氧分压的气氛中烧制。由于介电陶瓷材料具有改善的介电常数和介电损耗，并且内部导体致密化并且表面性能得到改善，所以该部件在谐振器Q值和其它性能方面得到改善。这使得内部导体与介电陶瓷层分离的缺陷部件的发生最小化，并使内部导体层的故障最小化。

6. 发明授权

US5276586A Bonding structure of thermal conductive members for a multi-chip module 失效
标题翻译：用于多芯片模块的导热构件的结合结构
公开(公告)号：US5276586A
公开(公告)日：1994-01-04
申请号：US872178
申请日：1992-04-22
申请人： Toshio Hatsuda , Takahiro Daikoku , Tetsuya Hayashida , Noriyuki Ashiwake , Fumiyuki Kobayashi , Keizou Kawamura , Sohji Sakata
发明人： Toshio Hatsuda , Takahiro Daikoku , Tetsuya Hayashida , Noriyuki Ashiwake , Fumiyuki Kobayashi , Keizou Kawamura , Sohji Sakata
IPC分类号： H01L23/36 , H01L23/433 , H01L25/065 , H05K7/20
CPC分类号： H01L24/33 , H01L23/433 , H01L25/0655 , H01L2224/16225 , H01L2224/27013 , H01L2224/73253 , H01L2224/73257 , H01L2224/83051 , H01L2924/01004 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/16152
摘要： A semiconductor module comprises a substrate, a plurality of semiconductor chips mounted on the substrate, a plurality of heat conduction members mounted on the back surfaces of the plurality of semiconductor chips, respectively, and a cooling jacket, on which the plurality of heat conduction members are bonded with heat conductive bonding agent, sealed with the substrate, wherein, in a surface of each of the plurality of heat conduction members adjacent to the cooling jacket and in a surface of the cooling jacket adjacent to the heat conduction members, around a portion corresponding to the back surface of each of the semiconductor chip is formed a portion which has non-affinity for the heat conductive bonding agent. Further, it is preferred that a reservoir having an affinity for the heat conductive bonding agent and serving to receive an excessive bonding agent is formed around each of the non-affinity portions of the plurality of heat conduction members and the cooling jacket.
摘要翻译：半导体模块包括基板，安装在基板上的多个半导体芯片，分别安装在多个半导体芯片的背面上的多个导热部件和冷却套，多个导热部件与导热接合剂接合，用基板密封，其中，在与冷却套相邻的多个热传导构件的每一个的表面中以及在与热传导构件相邻的冷却套的表面中，对应于每个半导体芯片的背表面形成对于导热粘合剂具有非亲和性的部分。此外，优选在多个导热构件和冷却套中的每个非亲合部分周围形成对导热粘合剂具有亲和力并用于接收过量粘合剂的储存器。

7. 发明授权

US5785879A Multilayer ceramic parts and method for making 失效
标题翻译：多层陶瓷件及其制造方法
公开(公告)号：US5785879A
公开(公告)日：1998-07-28
申请号：US784586
申请日：1997-01-23
申请人： Keizou Kawamura , Makoto Kobayashi , Akira Nakamura , Norikazu Yasuda , Suguru Kondoh , Taro Miura , Shinya Nakai , Tadao Fujii
发明人： Keizou Kawamura , Makoto Kobayashi , Akira Nakamura , Norikazu Yasuda , Suguru Kondoh , Taro Miura , Shinya Nakai , Tadao Fujii
IPC分类号： H01P11/00 , B32B18/00 , H01G4/30 , H01L21/48 , H01L23/498 , H01L23/538 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/46
CPC分类号： B32B18/00 , C04B37/003 , H01G4/30 , H01L21/4857 , H01L21/4867 , H01L23/49805 , H01L23/49883 , H01L23/5383 , H01L23/5384 , H05K3/46 , H05K3/4629 , C04B2237/10 , C04B2237/124 , C04B2237/125 , C04B2237/126 , C04B2237/34 , C04B2237/341 , C04B2237/343 , C04B2237/346 , C04B2237/348 , C04B2237/62 , C04B2237/68 , C04B2237/704 , H01L2924/0002 , H01L2924/09701 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2203/128 , H05K3/403
摘要： An object is to densify an internal conductor of a multilayer ceramic part to thereby reduce a line loss, improve operating properties such as Q value, and reduce a variation thereof. To this end, an internal conductor paste which is composed of conductor powder, preferably silver or copper powder and optionally, a glass frit is stacked with dielectric ceramic material layers and co-fired at or above the melting point of the conductor.
摘要翻译：目的是致密化多层陶瓷部件的内部导体，从而减少线损，改善诸如Q值的操作性能，并减小其变化。为此，由导体粉末，优选银或铜粉末和任选的玻璃料组成的内部导体膏料与电介质陶瓷材料层堆叠并在导体的熔点或以上共烧。

8. 发明授权

US5751062A Cooling device of multi-chip module 失效
标题翻译：多芯片模块冷却装置
公开(公告)号：US5751062A
公开(公告)日：1998-05-12
申请号：US571711
申请日：1995-12-13
申请人： Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
发明人： Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
IPC分类号： H01L23/36 , H01L23/433 , H01L23/367
CPC分类号： H01L23/4338 , H01L2224/73253
摘要： A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.
摘要翻译：多芯片模块的冷却装置具有独立于热变形和易于组装和拆卸的微封装。多芯片模块包括多层基板，其上安装有每个包装LSI芯片的微封装以及与冷却器一体形成的壳体。每个微封装包括第一导热构件，具有用于容纳LSI芯片的盖部分和与其一体形成的与盖部分相同的材料制成的第一鳍片，以及固定到第一热量帽盖部分的基板所述LSI芯片被安装在所述基板上，所述基板被牢固地固定到所述导热部件的盖部，同时在其背面牢固地接合到所述第一导热部件的盖部的内表面。每个包括基部和第二翅片的第二热传导构件设置成与第一翅片接合并且分别通过弹簧压靠在冷却器上。

9. 发明授权

US5431955A High frequency conductive material and resonator and method for making 失效
标题翻译：高频导电材料和谐振器及其制造方法
公开(公告)号：US5431955A
公开(公告)日：1995-07-11
申请号：US269785
申请日：1994-07-01
申请人： Keizou Kawamura , Makoto Kobayashi
发明人： Keizou Kawamura , Makoto Kobayashi
IPC分类号： C03C4/16 , C03C8/14 , C03C8/20 , H01B3/08 , H05K1/03 , B05D5/12 , C03C14/00 , C04B35/46
CPC分类号： C03C8/14 , C03C4/16 , C03C8/20 , H01B3/085 , H05K1/0306
摘要： Glass, an oxide aggregate with a positive .tau..epsilon. and an oxide aggregate with a negative .tau..epsilon. are mixed in a prescribed ratio by volume so as to bring the .tau..epsilon. of a high-frequency dielectric material close to -12 ppm/.degree.C. and bring the resonant frequency temperature coefficient .tau.f of a high-frequency resonator near zero.
摘要翻译：玻璃，具有正tauε的氧化物聚集体和具有负的tau蛋白的氧化物聚集体以规定的体积比混合，以使高频介电材料的τεε接近-12ppm /℃。并使高频谐振器的谐振频率温度系数τf接近零。

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