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1. 发明授权

US5345107A Cooling apparatus for electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5345107A
公开(公告)日：1994-09-06
申请号：US839071
申请日：1992-02-20
申请人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
发明人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
IPC分类号： F28F13/00 , H01L23/433 , H01L23/473 , H01L25/065 , F28F7/00 , H01L23/00 , H05K7/20
CPC分类号： H01L24/32 , F28F13/00 , H01L23/4338 , H01L23/473 , H01L25/0655 , F28F2013/005 , H01L2224/16 , H01L2224/32057 , H01L2224/73253 , H01L2224/73257 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/0132 , H01L2924/15312 , H01L2924/16152
摘要： The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.
摘要翻译：本发明涉及一种用于电子设备的冷却装置，其中在其与电子设备接触的一个表面上设置有通过导电流体与电子设备的传热部分紧密接触的冷却固体，与提供与传热部分的外部连通的多个槽，以及用于将该冷却固体本体弹性挤压在电子装置上的弹簧构件，用于迫使冷却固体与电子装置紧密接触，借助于导热流体在第三层。

2. 发明授权

US5595240A Cooling apparatus of electronic devices 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5595240A
公开(公告)日：1997-01-21
申请号：US464581
申请日：1995-06-05
申请人： Takahiro Daikoku , Noriyuki Ashiwake , Nobuo Kawasaki , Shizuo Zushi
发明人： Takahiro Daikoku , Noriyuki Ashiwake , Nobuo Kawasaki , Shizuo Zushi
IPC分类号： H01L23/36 , H01L23/433 , H01L23/34
CPC分类号： H01L23/4338 , H01L2224/16225
摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.
摘要翻译：一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散并去除电子设备中产生的热量。为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的凹槽的宽度更大的宽度，并且还更大比形成在导热构件上的翅片之间的槽宽度大。在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位这个设置空间。

3. 发明授权

US5126829A Cooling apparatus for electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5126829A
公开(公告)日：1992-06-30
申请号：US412130
申请日：1989-09-25
申请人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Shizuo Zushi
发明人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Shizuo Zushi
IPC分类号： H01L23/433 , H05K7/20
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A cooling apparatus for an electronic device makes a cooling solid body in contact with the electronic device so as to cool the electronic device. The apparatus has a high viscous thermal conductive fluid provided on a heat transfer portion of the electronic device, and a cooling solid body in close contact through the thermal conductive fluid with the heat transfer portion of the electronic device. The close contact portion of at least one of the cooling solid body and the electronic device has multiple grooves open to the outside of the one of the cooling solid body and the electronic device.
摘要翻译：一种用于电子设备的冷却装置使冷却固体与电子设备接触，以冷却电子设备。该设备具有设置在电子设备的传热部分上的高粘性导热流体和通过导电流体与电子设备的传热部分紧密接触的冷却固体。冷却固体和电子装置中的至少一个的紧密接触部分具有向冷却固体和电子装置之一的外部开口的多个凹槽。

4. 发明授权

US5515912A Cooling apparatus of electronic devices 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5515912A
公开(公告)日：1996-05-14
申请号：US664605
申请日：1991-03-04
申请人： Takahiro Daikoku , Noriyuki Ashiwake , Nobuo Kawasaki , Shizuo Zushi
发明人： Takahiro Daikoku , Noriyuki Ashiwake , Nobuo Kawasaki , Shizuo Zushi
IPC分类号： H01L23/36 , H01L23/433 , H01L23/34
CPC分类号： H01L23/4338 , H01L2224/16225
摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.
摘要翻译：一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散并去除电子设备中产生的热量。为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的沟槽宽度更大的宽度，并且还更大比形成在导热构件上的翅片之间的槽宽度大。在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位这个设置空间。

5. 发明授权

US5365400A Heat sinks and semiconductor cooling device using the heat sinks 失效
标题翻译：散热片和使用散热片的半导体冷却装置
公开(公告)号：US5365400A
公开(公告)日：1994-11-15
申请号：US771777
申请日：1991-10-04
申请人： Noriyuki Ashiwake , Takahiro Daikoku , Toshio Hatsuda , Shizuo Zushi , Satomi Kobayashi
发明人： Noriyuki Ashiwake , Takahiro Daikoku , Toshio Hatsuda , Shizuo Zushi , Satomi Kobayashi
IPC分类号： H01L23/433 , H01L23/473 , H01L25/065 , H05K7/20
CPC分类号： H01L23/433 , H01L23/4735 , H01L25/0655 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/15312 , H01L2924/16152 , Y10S165/908
摘要： Disclosed are heat sinks particularly effective in cooling semiconductors of a high heat dissipating density and including a multiplicity of tabular fins laminated via spacers and having through-holes pierced in their central parts, the holes admitting introduction of cooling fluids which radially flow in between the fins. The cooling fluids are supplied to the respective heat sinks attached to the multiplicity of semiconductors mounted on a board. In a specific form of the invention, the semiconductor cooling device has a heat sink provided with parallel tabular internal fins and a cooling fluid nozzle having an elongated opening substantially orthogonal to the fins, the nozzle being disposed to span over the parallel tabular fins substantially at longitudinal mid portions of these fins, so that the cooling fluid is evenly distributed from the mid portions of the fins to both longitudinal ends of the fins.
摘要翻译：公开了散热器在散热密度高的冷却半导体中特别有效，并且包括通过间隔件层叠的多个片状翅片，并且在其中心部分中穿透通孔，允许在散热片之间径向流动的冷却流体的引入。冷却流体被供应到附接到安装在板上的多个半导体的各个散热器。在本发明的具体形式中，半导体冷却装置具有设置有平行的片状内部散热片的散热器和具有与散热片基本正交的细长开口的冷却流体喷嘴，该喷嘴设置成跨越平行板状翅片，这些翅片的纵向中间部分，使得冷却流体从翼片的中部均匀地分布到翅片的两个纵向端部。

6. 发明授权

US5751062A Cooling device of multi-chip module 失效
标题翻译：多芯片模块冷却装置
公开(公告)号：US5751062A
公开(公告)日：1998-05-12
申请号：US571711
申请日：1995-12-13
申请人： Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
发明人： Takahiro Daikoku , Fumiyuki Kobayashi , Noriyuki Ashiwake , Kenichi Kasai , Keizou Kawamura , Akio Idei
IPC分类号： H01L23/36 , H01L23/433 , H01L23/367
CPC分类号： H01L23/4338 , H01L2224/73253
摘要： A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.
摘要翻译：多芯片模块的冷却装置具有独立于热变形和易于组装和拆卸的微封装。多芯片模块包括多层基板，其上安装有每个包装LSI芯片的微封装以及与冷却器一体形成的壳体。每个微封装包括第一导热构件，具有用于容纳LSI芯片的盖部分和与其一体形成的与盖部分相同的材料制成的第一鳍片，以及固定到第一热量帽盖部分的基板所述LSI芯片被安装在所述基板上，所述基板被牢固地固定到所述导热部件的盖部，同时在其背面牢固地接合到所述第一导热部件的盖部的内表面。每个包括基部和第二翅片的第二热传导构件设置成与第一翅片接合并且分别通过弹簧压靠在冷却器上。

7. 发明授权

US5276586A Bonding structure of thermal conductive members for a multi-chip module 失效
标题翻译：用于多芯片模块的导热构件的结合结构
公开(公告)号：US5276586A
公开(公告)日：1994-01-04
申请号：US872178
申请日：1992-04-22
申请人： Toshio Hatsuda , Takahiro Daikoku , Tetsuya Hayashida , Noriyuki Ashiwake , Fumiyuki Kobayashi , Keizou Kawamura , Sohji Sakata
发明人： Toshio Hatsuda , Takahiro Daikoku , Tetsuya Hayashida , Noriyuki Ashiwake , Fumiyuki Kobayashi , Keizou Kawamura , Sohji Sakata
IPC分类号： H01L23/36 , H01L23/433 , H01L25/065 , H05K7/20
CPC分类号： H01L24/33 , H01L23/433 , H01L25/0655 , H01L2224/16225 , H01L2224/27013 , H01L2224/73253 , H01L2224/73257 , H01L2224/83051 , H01L2924/01004 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/16152
摘要： A semiconductor module comprises a substrate, a plurality of semiconductor chips mounted on the substrate, a plurality of heat conduction members mounted on the back surfaces of the plurality of semiconductor chips, respectively, and a cooling jacket, on which the plurality of heat conduction members are bonded with heat conductive bonding agent, sealed with the substrate, wherein, in a surface of each of the plurality of heat conduction members adjacent to the cooling jacket and in a surface of the cooling jacket adjacent to the heat conduction members, around a portion corresponding to the back surface of each of the semiconductor chip is formed a portion which has non-affinity for the heat conductive bonding agent. Further, it is preferred that a reservoir having an affinity for the heat conductive bonding agent and serving to receive an excessive bonding agent is formed around each of the non-affinity portions of the plurality of heat conduction members and the cooling jacket.
摘要翻译：半导体模块包括基板，安装在基板上的多个半导体芯片，分别安装在多个半导体芯片的背面上的多个导热部件和冷却套，多个导热部件与导热接合剂接合，用基板密封，其中，在与冷却套相邻的多个热传导构件的每一个的表面中以及在与热传导构件相邻的冷却套的表面中，对应于每个半导体芯片的背表面形成对于导热粘合剂具有非亲和性的部分。此外，优选在多个导热构件和冷却套中的每个非亲合部分周围形成对导热粘合剂具有亲和力并用于接收过量粘合剂的储存器。

8. 发明授权

US5705850A Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US5705850A
公开(公告)日：1998-01-06
申请号：US290155
申请日：1994-08-15
申请人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
发明人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H01L21/10 , H01L23/34 , H02B1/00 , H02B1/01
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
摘要翻译：所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。散热器一体地形成在壳体上。利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。

9. 发明授权

US4770242A Cooling device of semiconductor chips 失效
标题翻译：半导体芯片的冷却装置
公开(公告)号：US4770242A
公开(公告)日：1988-09-13
申请号：US873304
申请日：1986-06-09
申请人： Takahiro Daikoku , Tadakatsu Nakajima , Noriyuki Ashiwake , Keizo Kawamura , Motohiro Sato , Fumiyuki Kobayashi , Wataru Nakayama
发明人： Takahiro Daikoku , Tadakatsu Nakajima , Noriyuki Ashiwake , Keizo Kawamura , Motohiro Sato , Fumiyuki Kobayashi , Wataru Nakayama
IPC分类号： H01L23/40 , H01L23/433 , F28F7/00
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.
摘要翻译：用于提供集成电路半导体芯片的冷却的冷却装置被布置成通过彼此以小间隙配合的薄翅片构件传递热量。与翅片构件一体设置的导热构件中的一个的底面的表面积比半导体芯片的后平面更大，导热构件和半导体芯片始终保持平面接触从而提高冷却性能。

10. 发明授权

US5774334A Low thermal resistant, fluid-cooled semiconductor module 失效
标题翻译：低耐热，流体冷却的半导体模块
公开(公告)号：US5774334A
公开(公告)日：1998-06-30
申请号：US520338
申请日：1995-08-28
申请人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
发明人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
IPC分类号： H01L23/433 , H05K7/20
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.
摘要翻译：半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。作为导热介质的液体封装在半导体模块中。半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。

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