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1. 发明授权

US5345107A Cooling apparatus for electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5345107A
公开(公告)日：1994-09-06
申请号：US839071
申请日：1992-02-20
申请人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
发明人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Keizou Kawamura , Shizuo Zushi , Mitsuo Miyamoto , Atsushi Morihara
IPC分类号： F28F13/00 , H01L23/433 , H01L23/473 , H01L25/065 , F28F7/00 , H01L23/00 , H05K7/20
CPC分类号： H01L24/32 , F28F13/00 , H01L23/4338 , H01L23/473 , H01L25/0655 , F28F2013/005 , H01L2224/16 , H01L2224/32057 , H01L2224/73253 , H01L2224/73257 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/0132 , H01L2924/15312 , H01L2924/16152
摘要： The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.
摘要翻译：本发明涉及一种用于电子设备的冷却装置，其中在其与电子设备接触的一个表面上设置有通过导电流体与电子设备的传热部分紧密接触的冷却固体，与提供与传热部分的外部连通的多个槽，以及用于将该冷却固体本体弹性挤压在电子装置上的弹簧构件，用于迫使冷却固体与电子装置紧密接触，借助于导热流体在第三层。

2. 发明授权

US5126829A Cooling apparatus for electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5126829A
公开(公告)日：1992-06-30
申请号：US412130
申请日：1989-09-25
申请人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Shizuo Zushi
发明人： Takahiro Daikoku , Nobuo Kawasaki , Noriyuki Ashiwake , Shizuo Zushi
IPC分类号： H01L23/433 , H05K7/20
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A cooling apparatus for an electronic device makes a cooling solid body in contact with the electronic device so as to cool the electronic device. The apparatus has a high viscous thermal conductive fluid provided on a heat transfer portion of the electronic device, and a cooling solid body in close contact through the thermal conductive fluid with the heat transfer portion of the electronic device. The close contact portion of at least one of the cooling solid body and the electronic device has multiple grooves open to the outside of the one of the cooling solid body and the electronic device.
摘要翻译：一种用于电子设备的冷却装置使冷却固体与电子设备接触，以冷却电子设备。该设备具有设置在电子设备的传热部分上的高粘性导热流体和通过导电流体与电子设备的传热部分紧密接触的冷却固体。冷却固体和电子装置中的至少一个的紧密接触部分具有向冷却固体和电子装置之一的外部开口的多个凹槽。

3. 发明授权

US5515912A Cooling apparatus of electronic devices 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5515912A
公开(公告)日：1996-05-14
申请号：US664605
申请日：1991-03-04
申请人： Takahiro Daikoku , Noriyuki Ashiwake , Nobuo Kawasaki , Shizuo Zushi
发明人： Takahiro Daikoku , Noriyuki Ashiwake , Nobuo Kawasaki , Shizuo Zushi
IPC分类号： H01L23/36 , H01L23/433 , H01L23/34
CPC分类号： H01L23/4338 , H01L2224/16225
摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.
摘要翻译：一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散并去除电子设备中产生的热量。为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的沟槽宽度更大的宽度，并且还更大比形成在导热构件上的翅片之间的槽宽度大。在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位这个设置空间。

4. 发明授权

US5595240A Cooling apparatus of electronic devices 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5595240A
公开(公告)日：1997-01-21
申请号：US464581
申请日：1995-06-05
申请人： Takahiro Daikoku , Noriyuki Ashiwake , Nobuo Kawasaki , Shizuo Zushi
发明人： Takahiro Daikoku , Noriyuki Ashiwake , Nobuo Kawasaki , Shizuo Zushi
IPC分类号： H01L23/36 , H01L23/433 , H01L23/34
CPC分类号： H01L23/4338 , H01L2224/16225
摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.
摘要翻译：一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散并去除电子设备中产生的热量。为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的凹槽的宽度更大的宽度，并且还更大比形成在导热构件上的翅片之间的槽宽度大。在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位这个设置空间。

5. 发明授权

US5592363A Electronic apparatus 失效
标题翻译：电子仪器
公开(公告)号：US5592363A
公开(公告)日：1997-01-07
申请号：US128227
申请日：1993-09-29
申请人： Takayuki Atarashi , Toshio Hatada , Takahiro Daikoku , Nobuo Kawasaki , Toshiki Iino , Tamotsu Tsukaguchi , Kenichi Kasai , Fumiyuki Kobayashi , Yoshito Hayashi
发明人： Takayuki Atarashi , Toshio Hatada , Takahiro Daikoku , Nobuo Kawasaki , Toshiki Iino , Tamotsu Tsukaguchi , Kenichi Kasai , Fumiyuki Kobayashi , Yoshito Hayashi
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002
摘要： An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.
摘要翻译：在每个半导体器件上设置具有多个半导体器件的电子设备，所述多个半导体器件在操作期间产生热量，散热片具有多个平板状或针状散热片。喷嘴与散热器相关联，以将冷却流体供应到散热器中。散热器布置成使得所有这些散热器沿相同的方向引导和排出冷却流体。在由散热器确定的流体的流动方向（x方向）和冷却流体的排放量上测量的各个喷嘴的宽度小于相关散热器的宽度。在与x方向垂直的方向（y方向）上测量的喷嘴的宽度小于相关联的散热器的宽度。相邻喷嘴之间的空间提供了足够横截面的排放通道，其减小被加热的冷却介质通过其排出所遇到的阻力。

6. 发明授权

US07164481B2 Coefficient of linear expansion measuring apparatus and coefficient of linear expansion measuring method 有权
标题翻译：线性膨胀测量装置的系数和线膨胀系数的测量方法
公开(公告)号：US07164481B2
公开(公告)日：2007-01-16
申请号：US10927057
申请日：2004-08-27
申请人： Nobuo Kawasaki , Toshihide Nakajima , Masahiko Daimon , Osamu Okajima
发明人： Nobuo Kawasaki , Toshihide Nakajima , Masahiko Daimon , Osamu Okajima
IPC分类号： G01B9/02 , G01B11/02 , G01B11/28 , G01B11/06 , G01L1/24 , G02B6/00 , G02B6/12
CPC分类号： G01N25/16
摘要： A coefficient of linear expansion measuring apparatus includes: two reflection plates between which a sample is put, a container to house them, which is filled with a gas having known rate of a refractive index variation, a temperature regulating member to set a temperature in the container variably, a light source to irradiate an irradiating light to reflecting surfaces of the reflection plates, a light receiving element to receive reflected lights in which the lights interferes each other and detecting a light intensity thereof, and a calculating member to calculate a coefficient of linear expansion of the sample, wherein: the calculating member calculates an optical path length variation between the reflecting surfaces from an output variation of the light receiving element, and calculates a length variation of the sample by correcting a part of the optical path length variation derived from the refractive index variation of the gas caused by the temperature variation.
摘要翻译：线性膨胀测量装置的系数包括：两个反射板，其上放置样品，容纳它们的容器，填充有已知的折射率变化率的气体，温度调节构件，用于将温度设定在容器可变的是将照射光照射到反射板的反射面的光源，用于接收光彼此干涉并检测其光强度的反射光的光接收元件，以及计算部件，其中：所述计算部件根据所述受光元件的输出变化来计算所述反射面之间的光路长度变化，并且通过校正所述光路长度变化的一部分来计算样本的长度变化从气体的折射率变化引起的温度变化。

7. 发明申请

US20050046869A1 Coefficient of linear expansion measuring apparatus and coefficient of linear expansion measuring method 有权
标题翻译：线性膨胀测量装置的系数和线膨胀系数的测量方法
公开(公告)号：US20050046869A1
公开(公告)日：2005-03-03
申请号：US10927057
申请日：2004-08-27
申请人： Nobuo Kawasaki , Toshihide Nakajima , Masahiko Daimon , Osamu Okajima
发明人： Nobuo Kawasaki , Toshihide Nakajima , Masahiko Daimon , Osamu Okajima
IPC分类号： G01J9/02 , G01N25/16 , G01J4/00
CPC分类号： G01N25/16
摘要： A coefficient of linear expansion measuring apparatus includes: two reflection plates between which a sample is put, a container to house them, which is filled with a gas having known rate of a refractive index variation, a temperature regulating member to set a temperature in the container variably, a light source to irradiate an irradiating light to reflecting surfaces of the reflection plates, a light receiving element to receive reflected lights in which the lights interferes each other and detecting a light intensity thereof, and a calculating member to calculate a coefficient of linear expansion of the sample, wherein: the calculating member calculates an optical path length variation between the reflecting surfaces from an output variation of the light receiving element, and calculates a length variation of the sample by correcting a part of the optical path length variation derived from the refractive index variation of the gas caused by the temperature variation.
摘要翻译：线性膨胀测量装置的系数包括：两个反射板，其上放置样品，容纳它们的容器，填充有已知的折射率变化率的气体，温度调节构件，用于将温度设定在容器可变的是将照射光照射到反射板的反射面的光源，用于接收光彼此干涉并检测其光强度的反射光的光接收元件，以及计算部件，其中：所述计算部件根据所述受光元件的输出变化来计算所述反射面之间的光路长度变化，并且通过校正所述光路长度变化的一部分来计算样本的长度变化从气体的折射率变化引起的温度变化。

8. 发明授权

US5868953A Method for manufacturing a magnetic disk substrate 失效
标题翻译：磁盘基板的制造方法
公开(公告)号：US5868953A
公开(公告)日：1999-02-09
申请号：US551126
申请日：1995-10-31
申请人： Masashi Maekawa , Nobuo Kawasaki , Yasuyuki Kawashima , Yoshio Karasawa
发明人： Masashi Maekawa , Nobuo Kawasaki , Yasuyuki Kawashima , Yoshio Karasawa
IPC分类号： B24B37/00 , C03C10/00 , C03C10/14 , C03C19/00 , C09K3/14 , G11B5/73 , G11B5/82 , G11B5/84 , B44C1/22
CPC分类号： G11B5/8404 , C03C10/0009 , C03C19/00 , C09K3/1409
摘要： A method for manufacturing a magnetic disk substrate includes a step of polishing a glass-ceramic having a crystal phase consisting of crystal grains having an average diameter of less than 3 .mu.m with a polishing material having a grain diameter smaller than the diameter of the crystal grain. In one aspect of the invention, the glass-ceramic includes lithium disilicate (Li.sub.2 O--2SiO.sub.2) and alpha-quartz (alpha-SiO.sub.2) as predominant crystal phases and grown crystal grains of the alpha-quartz each have a globular grain structure consisting of aggregated particles and have a diameter within a range of 0.3 .mu.m-3.0 .mu.m.
摘要翻译：一种磁盘基板的制造方法，其特征在于，使用具有比晶体直径小的研磨材料研磨具有平均粒径小于3μm的结晶相的结晶相的玻璃陶瓷的工序粮食。在本发明的一个方面，玻璃陶瓷包括二硅酸锂（Li 2 O-2SiO 2）和α-石英（α-SiO 2）作为主要结晶相，并且α-石英的生长晶粒各自具有由聚集的颗粒，直径在0.3μm-3.0μm的范围内。

9. 发明申请

US20080068587A1 Surface defect detection method and surface defect inspection apparatus 审中-公开
标题翻译：表面缺陷检测方法和表面缺陷检查装置
公开(公告)号：US20080068587A1
公开(公告)日：2008-03-20
申请号：US11898760
申请日：2007-09-14
申请人： Nobuo Kawasaki
发明人： Nobuo Kawasaki
IPC分类号： G01N1/00 , G01N21/47
CPC分类号： G01N21/958 , G01N21/552
摘要： A surface defect detection method and a surface defect inspection apparatus are provided having a function of inspecting only the defects and foreign particles on the surface regardless of whether or not there are internal defects, internal foreign particles, or internal light scattering particles, even if the inspection target material is a transparent or translucent material, or a material containing internal crystals such as crystallized glass. A medium layer having a higher refractive index than that of the inspection target material is provided to be in contact with the inspection target surface of the inspection target material. Inspection light is input from the medium layer side with an incident angle that achieves total reflection on the interface between the medium layer and the inspection target surface, and the reflected light of the inspection light, which is reflected by the inspection target surface, is detected, thereby inspecting for surface defects and foreign particles on the inspection target surface.
摘要翻译：提供了表面缺陷检测方法和表面缺陷检查装置，其具有仅检查表面上的缺陷和异物的功能，而不管是否存在内部缺陷，内部杂质颗粒或内部光散射颗粒，即使检查对象材料是透明或半透明的材料，或含有诸如结晶玻璃的内部晶体的材料。提供具有比检查对象材料更高的折射率的介质层与检查对象材料的检查对象表面接触。检测光从介质层侧以入射角输入，该入射角在介质层和检查对象面之间的界面上实现全反射，检测出被检查对象面反射的检查光的反射光从而检查检查对象表面上的表面缺陷和异物。

10. 发明授权

US5739225A Process for preparing olefin polymer, and ethylenic polymer 失效
标题翻译：制备烯烃聚合物和烯属聚合物的方法
公开(公告)号：US5739225A
公开(公告)日：1998-04-14
申请号：US666471
申请日：1996-06-28
申请人： Toshinori Tazaki , Shuji Machida , Nobuo Kawasaki , Nobuhiro Yabunouchi , Yasunori Kadoi , Mizutomo Takeuchi , Kenji Nakacho , Haruo Shikuma , Noriyuki Tani
发明人： Toshinori Tazaki , Shuji Machida , Nobuo Kawasaki , Nobuhiro Yabunouchi , Yasunori Kadoi , Mizutomo Takeuchi , Kenji Nakacho , Haruo Shikuma , Noriyuki Tani
IPC分类号： C08F4/6392 , C08F4/64 , C08F4/642 , C08F4/659 , C08F4/6592 , C08F10/00 , C08F10/02 , C08F110/02 , C08F210/02 , C08F210/16 , C08F210/18
CPC分类号： C08F10/02 , C08F10/00 , C08F110/02 , C08F210/02 , C08F210/16 , C08F210/18 , C08F4/6392 , C08F4/65912 , C08F4/6592 , Y10S526/943
摘要： An olefin polymer is prepared by homopolymerizing an olefin or copolymerizing two different olefins or an olefin and another polymerizable unsaturated compound in the presence of a polymerization catalyst containing (A) a transition metal compound represented by the formula (I): CpML.sub.x-1 (I) wherein M is a metallic element of Groups 3 to 10 of the Periodic Table or a metallic element of the lanthanide series; Cp is a cyclic compound group having a cyclopentadienyl skeleton of 5 to 30 carbon atoms; L is R', OR', SR', SO.sub.3 R'N'R'R", PR'R", wherein R' and R" are each a C.sub.1-20 hydrocarbon group or a silyl group, NO.sub.2, a halogen atom, a 1-pyrrolyl group or a 1-pyrrolidinyl group, with the proviso that at least one of the L groups is OR', SR', N'R'R" or PR'R", wherein R' and R" are each a C.sub.1-20 hydrocarbon group or a silyl group; and x is a valence number of M, and when a plurality of L's are present, the respective L's may be the same or different, and (B) an aluminoxane, wherein the molar ratio of the component (B)/component (A) (in terms of the metallic atoms) is in the range of 2 to 500.
摘要翻译： PCT No.PCT / JP94 / 02251 Sec。 371日期：1996年6月28日 102（e）日期1996年6月28日PCT 1994年12月27日PCT PCT。 WO95 / 18158 PCT出版物日期：1995年7月6日烯烃聚合物通过在含有（A）由式（I）表示的过渡金属化合物的聚合催化剂存在下，使烯烃均聚或共聚两种不同的烯烃或烯烃和另一种可聚合不饱和化合物来制备： CpMLx-1（I）其中M是周期表第3至10族的金属元素或镧系金属元素; Cp是具有5至30个碳原子的环戊二烯基骨架的环状化合物基团; L是R'，OR'，SR'，SO3R'N'R'R“，PR'R”，其中R'和R“各自为C1-20烃基或甲硅烷基，NO2，卤素原子，1-吡咯基或1-吡咯烷基，条件是至少一个L基团是OR'，SR'，N'R'R“或PR'R”，其中R' 和R“各自为C 1-20烃基或甲硅烷基; （B）/成分（A）的摩尔比，X是价数M，当存在多个L s时，各自的L可以相同或不同，（B）铝氧烷，（以金属原子计）在2〜500的范围内。

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