会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
    • 用于微电子成像器的封装以及用于微电子成像器的晶片级封装的方法
    • US08092734B2
    • 2012-01-10
    • US10845304
    • 2004-05-13
    • Tongbi JiangJ. Mike Brooks
    • Tongbi JiangJ. Mike Brooks
    • B29C65/00
    • H01L31/0203B33Y80/00H01L27/14618H01L27/14625H01L31/02325H01L2224/48227H04N5/2253H04N5/2254H01L2224/48091H01L2924/00014
    • Methods for forming and attaching covers to microelectronic imaging units, packaging microelectronic imagers at the wafer level, and microelectronic imagers having covers that protect the image sensor are disclosed herein. In one embodiment, a method includes providing a first substrate having a plurality of covers, the covers including windows comprising regions of the first substrate and stand-offs projecting from the windows. The method continues by providing a second substrate having a plurality of microelectronic dies with image sensors, integrated circuits electrically coupled to the image sensors, and terminals electrically coupled to the integrated circuits. The method includes assembling the covers with corresponding dies so that the windows are aligned with corresponding image sensors and stand-offs contact corresponding dies inboard of the terminals and outboard of the image sensors. The first substrate is then cut to singulate the individual covers, after which the second substrate is cut to singulate individual imaging units.
    • 本文公开了用于在微晶电子成像单元上形成和附着盖子,在晶片级封装微电子成像器的方法以及具有保护图像传感器的覆盖物的微电子成像器。 在一个实施例中,一种方法包括提供具有多个盖的第一基板,所述盖包括包括第一基板的区域和从窗口突出的支架的窗口。 该方法继续通过提供具有多个具有图像传感器的多个微电子管芯的第二基板,电耦合到图像传感器的集成电路和电耦合到集成电路的端子。 该方法包括将盖与相应的模具进行组装,使得窗口与对应的图像传感器对准,并且支架将接触端子和图像传感器外侧的对应的模具接触。 然后切割第一衬底以分离单个覆盖物,然后将第二衬底切割成单个成像单元。