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1. 发明授权

US06617514B1 Ceramics joint structure and method of producing the same 失效
标题翻译：陶瓷接头结构及其制造方法
公开(公告)号：US06617514B1
公开(公告)日：2003-09-09
申请号：US09095157
申请日：1998-06-10
申请人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
发明人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
IPC分类号： H01R400
CPC分类号： H01L21/6833
摘要： The disclosed ceramics joint structure, in which a ceramics member having an oxidation resistance property and a metal member are joined via a joint layer, has a structure such that a part of the embedded member is exposed to a joint surface of the ceramics member, which is contacted with the joint layer to form a metal exposing portion, and the ceramics member and the metal exposing portion are joined via the joint layer to the metal member respectively. Moreover, the joint layer is mainly made of one or more metal selected from the group consisting of gold, platinum and palladium.
摘要翻译：所公开的具有耐氧化性的陶瓷构件和金属构件的陶瓷接头结构通过接合层接合，具有使嵌入构件的一部分暴露于陶瓷构件的接合面的结构，与接合层接触以形成金属暴露部分，并且陶瓷构件和金属暴露部分分别经由接合层接合到金属构件。此外，接合层主要由选自金，铂和钯的一种或多种金属制成。

2. 发明授权

US6057513A Joint structure of metal member and ceramic member and method of producing the same 失效
标题翻译：金属构件和陶瓷构件的接合结构及其制造方法
公开(公告)号：US6057513A
公开(公告)日：2000-05-02
申请号：US13199
申请日：1998-01-26
申请人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
发明人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
IPC分类号： C04B37/02 , H01L21/683 , H05K1/16
CPC分类号： H01L21/6833 , Y10T279/23 , Y10T29/49149
摘要： A joint structure having a metal member and a ceramic member having a housing hole for accommodating at least a part of the metal member therein, in which an electrically conductive joint layer is formed between a bottom face of the metal member and a bottom face of the housing hole, and a film having a given wettability by the electrically conductive joint layer is formed on at least a part of the side wall face of the metal member.
摘要翻译：一种具有金属构件和陶瓷构件的接合结构，其具有用于容纳至少一部分金属构件的容纳孔，其中在金属构件的底面和底面之间形成导电接合层在金属构件的侧壁面的至少一部分上形成有由导电性接合层赋予润湿性的膜的容纳孔和膜。

3. 发明授权

US5995357A Ceramic member-electric power supply connector coupling structure 失效
标题翻译：陶瓷构件 - 电源连接器耦合结构
公开(公告)号：US5995357A
公开(公告)日：1999-11-30
申请号：US13045
申请日：1998-01-26
申请人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
发明人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
IPC分类号： H01L21/683 , H01R13/24 , H02N13/00
CPC分类号： H01J37/32577 , H01R13/24
摘要： A ceramic member-electric power supply connector coupling structure includes a ceramic member with a hole and is provided with a metallic member therein so as to be partially exposed to the hole. An electric power supply connector and a tubular atmosphere-shielding member are provided in the hole. Further, a stress-mitigating, low heat expansion conductor is provided inside the atmosphere-shielding member and the power supply connector is partially positioned therein. The atmosphere-shielding member is gas-tightly joined to the power supply connector, and the expansion conductor and the tubular atmosphere-shielding member are joined to the metallic member. The coupling structure has high heat and corrosion resistance, high joining strength, and remains highly conductive even at high temperature conditions in an oxidative or corrosive environment.
摘要翻译：陶瓷构件 - 电源连接器联接结构包括具有孔的陶瓷构件，并且在其中设置有金属构件以部分地暴露于孔。电源连接器和管状气氛屏蔽部件设置在孔中。此外，在气氛屏蔽部件内部设置有减轻应力的低热膨胀导体，电源连接器部分地位于其中。气密屏蔽构件气密地接合到电源连接器，并且膨胀导体和管状气氛屏蔽构件接合到金属构件。连接结构具有高耐热腐蚀性，接合强度高，即使在氧化或腐蚀性环境的高温条件下也能保持高导电性。

4. 发明授权

US6106960A Joined articles, corrosion-resistant joining materials and process for producing joined articles 失效
标题翻译：接合制品，耐腐蚀接合材料和生产连接制品的方法
公开(公告)号：US6106960A
公开(公告)日：2000-08-22
申请号：US594655
申请日：1996-02-02
申请人： Tomoyuki Fujii , Ryusuke Ushikoshi
发明人： Tomoyuki Fujii , Ryusuke Ushikoshi
IPC分类号： B23K1/19 , B23K35/24 , B23K35/28 , B23K35/30 , C04B37/00 , C04B37/02 , B32B15/04
CPC分类号： B23K35/30 , C04B37/006 , C04B37/026 , B23K35/286 , B23K35/302 , B23K35/3033 , C04B2237/121 , C04B2237/123 , C04B2237/124 , C04B2237/126 , C04B2237/127 , C04B2237/366 , C04B2237/402 , C04B2237/405 , C04B2237/407 , C04B2237/595 , C04B2237/704 , C04B2237/708 , C04B2237/765 , C04B2237/78 , C04B2237/80 , Y10T428/12535 , Y10T428/12576 , Y10T428/1275
摘要： A joined article is constituted by a first member made of aluminum nitride joined to each other through a joining layer, wherein a second member is made of a material selected from a ceramic material or a metal, and the joining layer involves a continuous phase made of a metal selected from the group consisting of copper, aluminum and nickel as a main component and 10% by weight of at least one active metal selected from the group consisting of magnesium, titanium, zirconium and hafnium relative to the joining layer.
摘要翻译：接合制品由通过接合层彼此接合的由氮化铝制成的第一构件构成，其中第二构件由选自陶瓷材料或金属的材料制成，并且接合层包括由选自由铜，铝和镍为主要成分的金属和相对于接合层选自镁，钛，锆和铪的10重量％的至少一种活性金属。

5. 发明授权

US6020076A Joined ceramic structures and a process for the production thereof 失效
标题翻译：结合的陶瓷结构及其制造方法
公开(公告)号：US6020076A
公开(公告)日：2000-02-01
申请号：US590026
申请日：1996-02-02
申请人： Tomoyuki Fujii , Ryusuke Ushikoshi
发明人： Tomoyuki Fujii , Ryusuke Ushikoshi
IPC分类号： B23K1/19 , B23K1/20 , B23K35/24 , C04B37/02 , B21D39/00 , B32B15/00 , B32B15/10
CPC分类号： C04B37/026 , C04B2237/121 , C04B2237/123 , C04B2237/124 , C04B2237/126 , C04B2237/127 , C04B2237/366 , C04B2237/402 , C04B2237/405 , C04B2237/407 , C04B2237/595 , C04B2237/62 , C04B2237/704 , C04B2237/708 , C04B2237/765 , C04B2237/80 , C04B2237/84 , Y10S228/903 , Y10T428/12535 , Y10T428/12576 , Y10T428/12583 , Y10T428/12743 , Y10T428/1275 , Y10T428/12764 , Y10T428/12826 , Y10T428/1284 , Y10T428/12944
摘要： A joined ceramic structure including a ceramic member and a metallic joining member joined to each other through a joining layer made of a brazing material wherein a metallic member is buried in the ceramic member in the state that a metal-exposed portion is formed through partial exposure of the metallic member from such a joining surface of the ceramic member as contacting said joining layer, and the ceramic member and the metal-exposed portion are also joined to the joining layer along the joining surface of the ceramic member.
摘要翻译：一种接合陶瓷结构体，包括陶瓷构件和金属接合构件，所述金属接合构件通过由钎焊材料制成的接合层彼此接合，其中金属构件以通过部分暴露形成金属暴露部分的状态而被掩埋在陶瓷构件中所述金属构件从所述陶瓷构件的与所述接合层接触的接合面接合，并且所述陶瓷构件和所述金属暴露部分也沿着所述陶瓷构件的接合面接合到所述接合层。

6. 发明授权

US5817406A Ceramic susceptor with embedded metal electrode and brazing material connection 失效
标题翻译：陶瓷感受器带有嵌入式金属电极和钎焊材料连接
公开(公告)号：US5817406A
公开(公告)日：1998-10-06
申请号：US591333
申请日：1996-01-24
申请人： David W. Cheung , Mark A. Fodor , Christopher Lane , Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
发明人： David W. Cheung , Mark A. Fodor , Christopher Lane , Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
IPC分类号： C23C16/458 , H01L21/683 , H05B6/10 , B32B3/00
CPC分类号： C23C16/4586 , H01L21/6831 , Y10T428/24926
摘要： A ceramic susceptor with an embedded metal electrode. The metal electrode has multiple apertures, and the ceramic material is cross-linked through the apertures. An electrical connection to the electrode protects the electrode from the environment in the processing chamber. The ceramic may be aluminum nitride, and the metal electrode may be a mesh of molybdenum wires. To form the electrical connection, the susceptor may be heated until an eutectic forms between a conductive connector and the metal electrode. Alternately, a brazing material may be placed between the metal layer and a conductive connector.
摘要翻译：具有嵌入式金属电极的陶瓷感受体。金属电极具有多个孔，陶瓷材料通过孔交联。与电极的电连接保护电极免受处理室中的环境的影响。陶瓷可以是氮化铝，金属电极可以是钼丝网。为了形成电连接，基座可以被加热直到在导电连接器和金属电极之间形成共晶体。或者，钎焊材料可以放置在金属层和导电连接器之间。

7. 发明授权

US5794838A Ceramics joined body and method of joining ceramics 失效
标题翻译：陶瓷加入陶瓷的机体和方法
公开(公告)号：US5794838A
公开(公告)日：1998-08-18
申请号：US679286
申请日：1996-07-12
申请人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
发明人： Ryusuke Ushikoshi , Hideyoshi Tsuruta , Tomoyuki Fujii
IPC分类号： C04B37/00 , C04B37/02 , B23K31/02 , B23K103/16
CPC分类号： C04B37/006 , C04B37/026 , C04B2237/08 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/126 , C04B2237/127 , C04B2237/343 , C04B2237/366 , C04B2237/402 , C04B2237/403 , C04B2237/405 , C04B2237/592 , C04B2237/62 , C04B2237/72 , C04B2237/76 , C04B2237/80 , C04B2237/84 , C04B2237/86
摘要： Novel method of joining ceramics containing aluminum nitride and another member made of a metal or a ceramic is provided having an improved joining strength and a corrosion-resistant property by joining a first member made of a ceramics consisting of an aluminum compound. The second member is made of a ceramics or a metal, forming a metal film directly on a surface to be joined of the first member interposing a metallic joining material which is made of a different material from the metal film. The metallic joining material is between the metal film and the second member, and by heating at least the metallic joining material and the metal film in such an interposed state to form a joining layer made of the metallic joining material and an intermetallic compound between the first and second members, so as to join the two members.
摘要翻译：通过将由铝化合物构成的陶瓷构成的第一构件接合，提供了接合含有氮化铝的陶瓷和由金属或陶瓷制成的另一构件的新型方法，其具有改善的接合强度和耐腐蚀性。第二构件由陶瓷或金属制成，在第一构件的待接合表面上直接形成金属膜，该金属接合材料由与金属膜不同的材料制成。金属接合材料在金属膜和第二构件之间，并且通过在这种插入状态下至少加热金属接合材料和金属膜，以形成由金属接合材料制成的接合层和金属间化合物和第二名成员，以加入两个成员。

8. 发明授权

US06975497B2 Method for reducing particles from an electrostatic chuck and an equipment for manufacturing a semiconductor 失效
标题翻译：用于从静电卡盘减少颗粒的方法和用于制造半导体的设备
公开(公告)号：US06975497B2
公开(公告)日：2005-12-13
申请号：US09769519
申请日：2001-01-26
申请人： Mie Nagao , Ryusuke Ushikoshi , Masashi Ohno
发明人： Mie Nagao , Ryusuke Ushikoshi , Masashi Ohno
IPC分类号： B23Q3/15 , G03F7/20 , H01L21/027 , H01L21/68 , H01L21/683 , H02N13/00
CPC分类号： G03F7/70691 , H01L21/6833 , H02N13/00 , Y10T279/23
摘要： A method for reducing particles from an electrostatic chuck, having the steps of: setting a wafer onto an attracting face of an electrostatic chuck, attracting the wafer onto the attracting face by applying a voltage to the electrostatic chuck, releasing stress due to a difference in heat expansion between the wafer and the electrostatic chuck by sliding the wafer relative to the attracting face before the wafer's temperature arrives at a saturated temperature, and increasing the wafer's temperature to a saturated temperature from its lower temperature than that of the attracting face.
摘要翻译：一种用于从静电卡盘减少颗粒的方法，具有以下步骤：将晶片设置在静电卡盘的吸附面上，通过向静电卡盘施加电压而将晶片吸引到吸引面上，释放由于差异引起的应力在晶片温度达到饱和温度之前，通过相对于吸引面滑动晶片，使晶片和静电卡盘之间的热膨胀，并将晶片的温度从比吸引面的温度降低到饱和温度。

9. 发明授权

US5683606A Ceramic heaters and heating devices using such ceramic heaters 失效
标题翻译：陶瓷加热器和使用这种陶瓷加热器的加热装置
公开(公告)号：US5683606A
公开(公告)日：1997-11-04
申请号：US359742
申请日：1994-12-20
申请人： Ryusuke Ushikoshi , Atsushi Sakon , Koichi Umemoto , Yusuke Niiori
发明人： Ryusuke Ushikoshi , Atsushi Sakon , Koichi Umemoto , Yusuke Niiori
IPC分类号： H05B3/20 , C23C16/46 , H05B3/14 , H05B3/18 , H05B3/44 , F27D11/00
CPC分类号： C23C16/46 , H05B3/141
摘要： A ceramic heater includes a substrate made of aluminum nitride, a resistive heating element buried in the substrate and made of a metal having a high melting point, and terminals electrically connected to the resistive heating element and buried in said substrate. The terminals are made of a metal having a high melting point and a coefficient of thermal expansion not smaller than that of the substrate. The metal of the resistive heating element has a coefficient of thermal expansion not smaller than that of the substrate. The coefficient of thermal expansion of each of the terminals and the resistive heating element is in a range from 5.0.times.10.sup.-6 /.degree.C. to 8.3.times.10.sup.-6 /.degree.C.
摘要翻译：陶瓷加热器包括由氮化铝制成的基板，埋在基板中的由具有高熔点的金属制成的电阻加热元件，以及电连接到电阻加热元件并埋入所述基板中的端子。端子由具有高熔点和不小于基板的热膨胀系数的金属制成。电阻加热元件的金属的热膨胀系数不小于基板的热膨胀系数。端子和电阻加热元件的热膨胀系数在5.0×10 -6 /℃至8.3×10 -6 /℃的范围内。

10. 发明授权

US5616024A Apparatuses for heating semiconductor wafers, ceramic heaters and a process for manufacturing the same, a process for manufacturing ceramic articles 失效
公开(公告)号：US5616024A
公开(公告)日：1997-04-01
申请号：US380190
申请日：1995-01-27
申请人： Kazuhiro Nobori , Ryusuke Ushikoshi , Koichi Umemoto , Atsushi Sakon , Yusuke Niiori , Masahiro Murasato
发明人： Kazuhiro Nobori , Ryusuke Ushikoshi , Koichi Umemoto , Atsushi Sakon , Yusuke Niiori , Masahiro Murasato
IPC分类号： H05B3/20 , B21F99/00 , C23C16/46 , C30B25/10 , C30B31/12 , F27D1/16 , F27D99/00 , H05B3/14 , F27D3/12
CPC分类号： F27D99/0006 , C23C16/46 , C30B25/10 , C30B31/12 , F27D1/16 , H05B3/143 , F27D2099/0008
摘要： A ceramic heater composed of a ceramic substrate and a resistant heating element embedded within the ceramic substrate along a predetermined planar pattern is obtained by holding a convolution of a spiral-coiled high melting metallic filament in the above predetermined planar pattern and heat-treating the convolution at a temperature not higher than a primary recrystallization commencement temperature of the high melting metal under a non-oxidative atmosphere to provide the resistant heating element, embedding the resulting resistant heating element within a ceramic shaped body, and then, sintering the ceramic shaped body. In a preferred embodiment, the resistant heating element is a convolution of a spiral coil, the number of coils per a unit length of said convolution is set at a predetermined value in each of defined domains of the ceramic heater, and when the number of coils per a unit length of the convolution is determined, the relation of the maximal value, the minimal value and the mean value, of all the determined numbers of coils in the above domains, satisfies the formula:(maximal value-minimal value)/mean value.ltoreq.0.1.Another preferred embodiment comprising a disc-shaped ceramic substrate and a resistant heating element embedded within the substrate is adapted for application in semiconductor wafer heating, wherein a resistant heating element having a planar shape composed of a plurality of concentric loops differing in diameters from each other and connecting portions which connect inner loops in sequence with outer loops to form a series of resistant heating element. In a process for manufacturing ceramic articles composed of a ceramic substrate, an electroconducting body embedded within the ceramic substrate and a conduit or pit bored avoiding the above electroconducting body in the ceramic substrate, an X-ray transmission photograph of the ceramic substrate is taken and then the conduit or pit is formed based on the X-ray transmission photograph.

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