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1. 发明授权

US07517567B2 Transparent touch panel and a method of manufacturing the same 失效
标题翻译：透明触摸屏及其制造方法
公开(公告)号：US07517567B2
公开(公告)日：2009-04-14
申请号：US10392829
申请日：2003-03-21
申请人： Tomoki Masuda , Mitsuru Harada , Kazunori Omoya , Kazuhiko Fujikawa , Toshiharu Fukui , Takuya Yagasaki
发明人： Tomoki Masuda , Mitsuru Harada , Kazunori Omoya , Kazuhiko Fujikawa , Toshiharu Fukui , Takuya Yagasaki
IPC分类号： C09K19/00 , G09G3/36 , G02F1/1335 , G06F3/041
CPC分类号： G06F3/0414 , Y10T428/1059 , Y10T428/1068 , Y10T428/1073
摘要： An optically transparent touch panel includes an upper substrate provided with an upper conductive layer formed on a lower surface thereof, and a lower substrate provided with a lower conductive layer formed on an upper surface thereof in a manner to confront the upper conductive layer with a predetermined space. The upper and lower substrates are bonded together with a spacer having a modulus of elasticity between 104 and 106 Pa. The touch panel has a long usable life with the capability of downsizing the whole body, while maintaining a required effective operating area.
摘要翻译：光学透明触摸面板包括：上基板，其具有形成在其下表面上的上导电层;以及下基板，其具有形成在其上表面上的下导电层，以与预定的上导电层相对的方式空间。上下基板与弹性模量为104〜106Pa的间隔件结合在一起，触摸面板具有使用寿命长，具有小型化的能力，同时保持所需的有效操作面积。

2. 发明授权

US5955198A Transparent touch panel 失效
标题翻译：透明触摸屏
公开(公告)号：US5955198A
公开(公告)日：1999-09-21
申请号：US919267
申请日：1997-08-28
申请人： Koji Hashimoto , Toshiharu Fukui , Akira Nakanishi , Fuminori Umemura , Hideaki Nishida , Mitsuru Harada , Kazunori Omoya , Takashi Obayashi
发明人： Koji Hashimoto , Toshiharu Fukui , Akira Nakanishi , Fuminori Umemura , Hideaki Nishida , Mitsuru Harada , Kazunori Omoya , Takashi Obayashi
IPC分类号： G02F1/133 , G06F3/033 , G06F3/041 , G06F3/045 , H01H13/712 , B32B27/38
CPC分类号： G06F3/045 , Y10T428/254 , Y10T428/31515
摘要： This invention aims to offer a transparent touch panel that functions with a soft touching pressure by a pen or a finger, at the same time assures a long operating life.The transparent touch panel comprises a base plate having a transparent electro conductive layer, a top plate having a transparent electro concuctive layer, and a plurality of dot spacers located in between the base plate and the top plate.By a touch pressure given from the outer surface of the top plate, the transparent electro conductive layer placed in the top plate touches to the transparent electro conductive layer placed in the base plate, and the place touched is detected. What this touch panel specifically features is that it comprises dot spacers made of a composite resin containing a flexible modified epoxy resin. Hardness of the dot spacer is preferably not more than 95 according to JIS-K6301-A.
摘要翻译：本发明旨在提供一种透明的触摸面板，其通过笔或手指具有柔软的触摸压力，同时确保长的使用寿命。透明触摸面板包括具有透明导电层的基板，具有透明电致凹凸层的顶板和位于基板和顶板之间的多个点间隔物。通过从顶板的外表面施加的触摸压力，放置在顶板中的透明导电层与放置在基板中的透明导电层接触，并且检测到触摸的位置。该触摸面板具体特征在于它包括由包含柔性改性环氧树脂的复合树脂制成的点间隔物。根据JIS-K6301-A，点间距的硬度优选为95以下。

3. 发明授权

US07161459B2 Chip-type electronic component and chip resistor 失效
标题翻译：片式电子元器件和片式电阻器
公开(公告)号：US07161459B2
公开(公告)日：2007-01-09
申请号：US11240289
申请日：2005-09-30
申请人： Mitsuru Harada , Kazunori Omoya , Masato Hashimoto , Akio Fukuoka
发明人： Mitsuru Harada , Kazunori Omoya , Masato Hashimoto , Akio Fukuoka
IPC分类号： H01C7/10
CPC分类号： H01C7/003 , H01C1/148 , H01C17/065 , H01C17/283
摘要： In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.
摘要翻译：在芯片电子元件中，制造侧电极的导电浆料的应用状态可以在制造小尺寸芯片电子部件时被光学地区分开。芯片电子部件包括基板和设置在基板的端部的侧电极。侧面电极的整个表面的亮度不超过JIS-Z8721中规定的6。

4. 发明申请

US20060055505A1 Chip-type electronic component and chip resistor 失效
公开(公告)号：US20060055505A1
公开(公告)日：2006-03-16
申请号：US11240289
申请日：2005-09-30
申请人： Mitsuru Harada , Kazunori Omoya , Masato Hashimoto , Akio Fukuoka
发明人： Mitsuru Harada , Kazunori Omoya , Masato Hashimoto , Akio Fukuoka
IPC分类号： H01C1/012
CPC分类号： H01C7/003 , H01C1/148 , H01C17/065 , H01C17/283
摘要： In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.

5. 发明授权

US07084733B2 Chip-type electronic component and chip resistor 失效
标题翻译：片式电子元器件和片式电阻器
公开(公告)号：US07084733B2
公开(公告)日：2006-08-01
申请号：US10239617
申请日：2002-01-24
申请人： Mitsuru Harada , Kazunori Omoya , Masato Hashimoto , Akio Fukuoka
发明人： Mitsuru Harada , Kazunori Omoya , Masato Hashimoto , Akio Fukuoka
IPC分类号： H01C1/012
CPC分类号： H01C1/148 , H01C1/142 , H01C7/001 , H01C7/003 , H01C17/065 , H01C17/283
摘要： In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.
摘要翻译：在芯片电子元件中，制造侧电极的导电浆料的应用状态可以在制造小尺寸芯片电子部件时被光学地区分开。芯片电子部件包括基板和设置在基板的端部的侧电极。侧面电极的整个表面的亮度不超过JIS-Z8721中规定的6。

6. 发明授权

US06628268B1 Transparent touch panel and electronic equipment using the same 有权
标题翻译：透明触摸屏和电子设备使用相同
公开(公告)号：US06628268B1
公开(公告)日：2003-09-30
申请号：US09629220
申请日：2000-07-31
申请人： Mitsuru Harada , Kazunori Omoya , Koji Hashimoto
发明人： Mitsuru Harada , Kazunori Omoya , Koji Hashimoto
IPC分类号： G09G500
CPC分类号： G06F3/045 , G06F1/1626 , G06F1/1637 , G06F1/26 , G06F3/041 , G06F3/0488
摘要： A TTP comprising two substrates each provided with a transparent resistive-layer, and an insulating section formed on at least one of the transparent resistive-layers using an ultra violet curing resin or an electron beam curing resin. The glass transition temperature of the cured resin in the insulating section is not higher than 80° C., and the insulating section contains a methyl ethyl keton soluble component of not less than 5 weight % and not more than 80 weight %. Since the insulating section is cured at a low temperature, it may be formed on a plastic substrate whose heat-withstanding capability is low. The insulating section can be formed in any desired shape and it can be cured within a short curing time, which are quite advantageous properties for the production of TTPs in volume. The insulating section spreads only minimally during the curing operation, therefore the initial shape, if it is a fine pattern, can be well preserved. Since an acid, alkaline solution or organic solvent is not used for forming the insulating section in the present invention, TTPs thus manufactured are free from the safety problems on the production floor as well as the environmental hazards associated with the use of these chemicals. The same applies also to an electronic system that incorporates the TTP.
摘要翻译：一种TTP，其包括两个分别具有透明电阻层的基板和使用紫外线固化树脂或电子束固化树脂形成在至少一个透明电阻层上的绝缘部分。绝缘部中的固化树脂的玻璃化转变温度不高于80℃，绝缘部分含有不小于5重量％且不大于80重量％的甲基乙基酮可溶成分。由于绝缘部分在低温下固化，所以可以形成在耐热能力低的塑料基板上。绝缘部分可以形成任何期望的形状，并且可以在短的固化时间内固化，这对于体积的TTP的生产是非常有利的特性。绝缘部分在固化操作期间仅最小化，因此如果是精细图案，则初始形状可以很好地保持。由于在本发明中不使用酸性，碱性溶液或有机溶剂来形成绝缘部分，因此制造的TTP没有生产地板上的安全问题以及与使用这些化学品相关的环境危害。同样适用于包含TTP的电子系统。

7. 发明授权

US5641996A Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging 失效
标题翻译：半导体单元封装，半导体单元封装方法和用于半导体单元封装的密封剂
公开(公告)号：US5641996A
公开(公告)日：1997-06-24
申请号：US593675
申请日：1996-01-29
申请人： Kazunori Omoya , Takashi Oobayashi , Wataru Sakurai , Mitsuru Harada , Yoshihiro Bessho
发明人： Kazunori Omoya , Takashi Oobayashi , Wataru Sakurai , Mitsuru Harada , Yoshihiro Bessho
IPC分类号： H01L21/56 , H01L21/60 , H01L23/29 , H01L23/485 , H01L23/28
CPC分类号： H01L23/293 , H01L21/563 , H01L24/12 , H01L24/29 , H01L24/83 , H01L2224/1134 , H01L2224/11822 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/8319 , H01L2224/838 , H01L2224/92125 , H01L2224/92225 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/15787 , H01L2924/351
摘要： An improved semiconductor unit package is disclosed. This package is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa.multidot.s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.
摘要翻译：公开了一种改进的半导体单元封装。该封装由具有电极焊盘，具有端子电极的基板，形成在电极焊盘上的突起电极，具有柔软性的导电性粘合层的半导体装置，以及通过使组合物固化而形成的密封层和触变性指数分别低于100个百分点和1.1以下。这种组合物基本上由（A）含有例如聚环氧化物，酸酐和流变改性剂的树脂粘合剂组成，（B）填料。流变改性剂是能够阻碍酸酐中所含的游离酸与填料表面的极性基团之间的相互作用的改性剂。使用具有改善的流动性的密封剂，使得密封剂容易流动和扩散以填充半导体器件和衬底之间的间隙，而没有气泡。这实现了具有高可靠性和生产率的半导体单元封装。

8. 发明授权

US6139777A Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same 有权
标题翻译：用于填充通孔的导电浆料，使用其的双面和多层印刷电路板及其制造方法
公开(公告)号：US6139777A
公开(公告)日：2000-10-31
申请号：US304700
申请日：1999-05-04
申请人： Kazunori Omoya , Takeshi Suzuki , Tatsuo Ogawa , Takashi Oobayashi
发明人： Kazunori Omoya , Takeshi Suzuki , Tatsuo Ogawa , Takashi Oobayashi
IPC分类号： H05K1/09 , H05K3/40 , H05K3/46 , H01B1/22 , B05D5/12 , H05K1/00
CPC分类号： H05K3/462 , H05K1/095 , H05K3/4069 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4623 , H05K3/4652 , Y10S428/901
摘要： A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 .mu.m and whose specific surface area ranges from 0.05 to 1.5 m.sup.2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol % of the epoxy group, and the epoxy equivalent ranges from 100 to 350 g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener and a dispersant if necessary. The paste having low viscosity and low volatility is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foils on both sides to attain a printed circuit board where both sides are electrically connected by inner-via-hole.
摘要翻译：提供了一种用于通孔填充的糊料，并且该糊料至少包含（a）30-70体积％的导电颗粒，其平均直径范围为0.5至20μm，比表面积为0.05至1.5m 2 / g ，和（b）70-30体积％的树脂，其包含每分子至少10重量％的包含至少一个环氧基的环氧树脂，其中羟基，氨基和羧基的总量不多不大于5mol％的环氧基，并且环氧当量为100-350g / eq。用于填充通孔的导电膏和包括其的印刷电路板可以用于在电极层之间提供内通孔连接，而不使用通孔电镀技术。如果需要，导电糊包含金属颗粒如铜，环氧树脂，固化剂和分散剂。使用具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与两侧的铜箔一起加热加压，以获得印刷电路板，其中两侧通过内通孔电连接。

9. 发明授权

US5618617A Magneto-optic disk 失效
标题翻译：磁光盘
公开(公告)号：US5618617A
公开(公告)日：1997-04-08
申请号：US288695
申请日：1994-08-12
申请人： Kiyoshi Uchida , Norio Miyatake , Kazunori Omoya
发明人： Kiyoshi Uchida , Norio Miyatake , Kazunori Omoya
IPC分类号： G11B7/24 , G11B7/254 , G11B11/105 , G11B5/66 , B05D5/12 , B32B5/16
CPC分类号： G11B11/10586 , G11B7/24 , G11B7/254 , Y10S428/90 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259 , Y10T428/265 , Y10T428/29 , Y10T428/2982 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998
摘要： In a magneto-optic disk, a protective coating is applied to the magnetic recording layer made from a composite comprising minute particles of an inorganic compound, a lubricant and a radical-polymerizable resin. The surfaces of the minute particles of the first type are coated with a surface coating agent which has a lyophilic property with the radical-polymerized resin and this surface coating prevents the minute particles from forming aggregates in the protective coating. Then, the surface of the protective coating becomes smooth. In another type of protective coating, two types of the minute particles are included. The surfaces of the minute particles of the first type are coated with a surface coating agent, while those of the second type remain not coated. Thus, the minute particles of the first kind are not liable to form aggregates in the protective coating, whereas those of the other kind may form aggregates. Although the aggregates decrease the smoothness of the protective coating, they can enhance the amount of the lubricant which can be incorporated in the coating.
摘要翻译：在磁光盘中，将保护涂层施加到由包含无机化合物的微粒，润滑剂和自由基聚合性树脂的复合物制成的磁记录层。第一类型的微小颗粒的表面涂覆有与自由基聚合树脂具有亲液性质的表面涂层剂，并且该表面涂层防止微小颗粒在保护涂层中形成聚集体。然后，保护涂层的表面变得光滑。在另一种类型的保护涂层中，包括两种类型的微小颗粒。第一类型的微小颗粒的表面涂覆有表面涂层剂，而第二种颗粒的表面保持不被涂覆。因此，第一种的微小颗粒在保护涂层中不易形成聚集体，而另一种微粒可能形成聚集体。尽管聚集体降低了保护涂层的平滑度，但是它们可以增加可以掺入涂层中的润滑剂的量。

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