专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08207505B2 Radiation detector using gas amplication and method for manufacturing the same 有权
标题翻译：使用气体放大的放射检测器及其制造方法
公开(公告)号：US08207505B2
公开(公告)日：2012-06-26
申请号：US12489235
申请日：2009-06-22
申请人： Tomohisa Motomura , Osamu Shimada
发明人： Tomohisa Motomura , Osamu Shimada
IPC分类号： G01T1/18
CPC分类号： G01T1/185 , Y10T29/49156
摘要： A radiation detector using gas amplification includes: a first electrode pattern which is formed on a first surface of an insulating member and has a plurality of circular openings; and a second electrode pattern which is formed on a second surface of the insulating member opposite to the first surface thereof and has convex portions of which respective forefronts are exposed to centers of the openings of the first electrode pattern; wherein a predetermined electric potential is set between the first electrode pattern and the second electrode pattern; wherein edges of the first electrode pattern exposing to the openings are shaped in respective continuous first curved surfaces by covering the edges thereof with a first solder material.
摘要翻译：使用气体放大的放射线检测器包括：第一电极图案，其形成在绝缘构件的第一表面上并且具有多个圆形开口; 以及第二电极图案，其形成在与所述绝缘构件的与所述第一表面相反的第二表面上，并且其前表面的凸部暴露于所述第一电极图案的所述开口的中心; 其中在所述第一电极图案和所述第二电极图案之间设置预定电位; 其中暴露于开口的第一电极图案的边缘通过用第一焊料材料覆盖其边缘而在相应的连续的第一弯曲表面中成形。

2. 发明授权

US5915753A Method of producing a high-density printed wiring board for mounting 失效
标题翻译：制造用于安装的高密度印刷线路板的方法
公开(公告)号：US5915753A
公开(公告)日：1999-06-29
申请号：US8494
申请日：1998-01-16
申请人： Tomohisa Motomura , Osamu Shimada , Yoshitaka Fukuoka
发明人： Tomohisa Motomura , Osamu Shimada , Yoshitaka Fukuoka
IPC分类号： H01L21/48 , H01L21/60 , H01L23/12 , H05K1/11 , H05K1/18 , H05K3/06 , H05K3/24 , H05K3/34 , H05K3/40 , H05K3/42 , H05K3/46 , H05K3/36
CPC分类号： H05K3/4617 , H01L21/4857 , H01L21/486 , H05K1/113 , H05K3/4007 , H05K3/4647 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/0394 , H05K2201/10674 , H05K2203/0733 , H05K2203/1189 , H05K3/243 , H05K3/423 , Y10T29/49126 , Y10T29/49153
摘要： A method of producing a high-density wiring board for mounting comprises the steps of providing an electroconductive metallic film on the main surface thereof with a photosensitive resist layer, subjecting the photosensitive resist layer to selective exposure to light and development thereby forming holes for selectively exposing the surface of the electroconductive metallic foil in the photosensitive resist layer, depositing an electroconductive metal by plating on the exposed surface of the electroconductive metallic foil thereby forming electroconductive bumps thereon, peeling off the remainder of the photosensitive resist layer, superposing an insulating polymer sheet on the electroconductive bump forming surface, pressing the resultant superposed layers so that the electroconductive bumps to pierce the polymer sheet in the direction of thickness thereof and allowing the leading end parts of the electroconductive bumps to emerge from the polymer sheet and give rise to connecting terminal parts, and selectively etching off the electroconductive metallic foil thereby forming a wiring pattern.
摘要翻译：一种制造用于安装的高密度布线板的方法包括以下步骤：在其主表面上提供导电金属膜，其具有光敏抗蚀剂层，使光敏抗蚀剂层选择性地曝光和显影，从而形成用于选择性曝光的孔在感光性抗蚀剂层中的导电金属箔的表面，通过电镀在导电金属箔的暴露表面上沉积导电金属，从而在其上形成导电凸起，剥离光敏抗蚀剂层的其余部分，将绝缘聚合物片叠加在导电凸块形成表面，压制所得到的叠置层，使得导电凸块在其厚度方向上刺穿聚合物片材，并允许导电凸起的前端部分从聚合物片材出射并产生连接并且选择性地蚀刻掉导电金属箔，从而形成布线图案。

3. 发明授权

US08304742B2 Radiation detector using gas amplification and method for manufacturing the same 有权
标题翻译：使用气体放大的放射检测器及其制造方法
公开(公告)号：US08304742B2
公开(公告)日：2012-11-06
申请号：US13480504
申请日：2012-05-25
申请人： Tomohisa Motomura , Osamu Shimada
发明人： Tomohisa Motomura , Osamu Shimada
IPC分类号： H01L21/00 , G01T1/24
CPC分类号： G01T1/185 , Y10T29/49156
摘要： A radiation detector using gas amplification includes: a first electrode pattern which is formed on a first surface of an insulating member and has a plurality of circular openings; and a second electrode pattern which is formed on a second surface of the insulating member opposite to the first surface thereof and has convex portions of which respective forefronts are exposed to centers of the openings of the first electrode pattern; wherein a predetermined electric potential is set between the first electrode pattern and the second electrode pattern; wherein edges of the first electrode pattern exposing to the openings are shaped in respective continuous first curved surfaces by covering the edges thereof with a first solder material.
摘要翻译：使用气体放大的放射线检测器包括：第一电极图案，其形成在绝缘构件的第一表面上并且具有多个圆形开口; 以及第二电极图案，其形成在与所述绝缘构件的与所述第一表面相反的第二表面上，并且其前表面的凸部暴露于所述第一电极图案的所述开口的中心; 其中在所述第一电极图案和所述第二电极图案之间设置预定电位; 其中暴露于开口的第一电极图案的边缘通过用第一焊料材料覆盖其边缘而在相应的连续的第一弯曲表面中成形。

4. 发明授权

US5737833A Method of producing a high-density printed wiring board for mounting 失效
公开(公告)号：US5737833A
公开(公告)日：1998-04-14
申请号：US539655
申请日：1995-10-05
申请人： Tomohisa Motomura , Osamu Shimada , Yoshitaka Fukuoka
发明人： Tomohisa Motomura , Osamu Shimada , Yoshitaka Fukuoka
IPC分类号： H01L21/48 , H01L21/60 , H01L23/12 , H05K1/11 , H05K1/18 , H05K3/06 , H05K3/24 , H05K3/34 , H05K3/40 , H05K3/42 , H05K3/46 , H05K3/36
CPC分类号： H05K3/4617 , H01L21/4857 , H01L21/486 , H05K1/113 , H05K3/4007 , H05K3/4647 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/0394 , H05K2201/10674 , H05K2203/0733 , H05K2203/1189 , H05K3/243 , H05K3/423 , Y10T29/49126 , Y10T29/49153
摘要： A method of producing a high-density wiring board for mounting comprises the steps of providing an electroconductive metallic film on the main surface thereof with a photosensitive resist layer, subjecting the photosensitive resist layer to selective exposure to light and development thereby forming holes for selectively exposing the surface of the electroconductive metallic foil in the photosensitive resist layer, depositing an electroconductive metal by plating on the exposed surface of the electroconductive metallic foil thereby forming electroconductive bumps thereon, peeling off the remainder of the photosensitive resist layer, superposing an insulating polymer sheet on the electroconductive bump forming surface, pressing the resultant superposed layers so that the electroconductive bumps to pierce the polymer sheet in the direction of thickness thereof and allowing the leading end parts of the electroconductive bumps to emerge from the polymer sheet and give rise to connecting terminal parts, and selectively etching off the electroconductive metallic foil thereby forming a wiring pattern.

5. 发明申请

US20120281379A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20120281379A1
公开(公告)日：2012-11-08
申请号：US13520980
申请日：2011-01-04
申请人： Osamu Shimada
发明人： Osamu Shimada
IPC分类号： H05K7/06
CPC分类号： H05K1/023 , H01L21/486 , H01L23/3121 , H01L23/49827 , H01L23/5383 , H01L23/5389 , H01L24/48 , H01L2224/04105 , H01L2224/24195 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01079 , H01L2924/14 , H01L2924/15313 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K1/0224 , H05K1/186 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/10636 , H05K2203/061 , H05K2203/063 , Y02P70/611 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： In an electronic component in which a semiconductor chip (semiconductor element) and a passive component are integrated on a multilayer wiring board and the semiconductor chip and the passive component constitute a feedback circuit, an input end and an output end of the semiconductor chip (semiconductor element) are electrically separated from each other. The electronic component includes the multilayer wiring board, the semiconductor chip disposed on the main surface of or inside the multilayer wiring board, and the passive component having a first terminal and a second terminal connected to the input end and the output end of the semiconductor chip respectively, and is configured such that a conductive member constituting the multilayer wiring board is located at a position where a distance from at least one of the first terminal and the second terminal is smaller than a distance between the first terminal and the second terminal.
摘要翻译：在其中将半导体芯片（半导体元件）和无源部件集成在多层布线板上并且半导体芯片和无源部件构成反馈电路的电子部件中，半导体芯片（半导体）的输入端和输出端元件）彼此电分离。电子部件包括多层布线基板，设置在多层布线基板的主表面或内侧的半导体芯片，无源部件具有与半导体芯片的输入端和输出端连接的第一端子和第二端子并且被构造为使得构成多层布线板的导电构件位于距离第一端子和第二端子中的至少一个的距离小于第一端子和第二端子之间的距离的位置处。

6. 发明授权

US08082156B2 Audio encoding device, audio encoding method, and audio encoding program for encoding a wide-band audio signal 有权
标题翻译：音频编码装置，音频编码方法和用于编码宽带音频信号的音频编码程序
公开(公告)号：US08082156B2
公开(公告)日：2011-12-20
申请号：US11794984
申请日：2006-01-06
申请人： Osamu Shimada
发明人： Osamu Shimada
IPC分类号： G01L19/00
CPC分类号： G10L19/20 , G10L19/0208 , G10L21/038
摘要： By using a high-range sub-band signal, a correction coefficient corresponding to importance of auditory sense is calculated to correct a noise level and generate additional signal information, thereby accurately reflecting the noise level of the sub-band important in the auditory sense. Thus, it is possible to calculate additional signal information reflecting the noise level of the sub-band important in the auditory sense according to importance with a small calculation amount. The calculation amount can further be reduced by using a correction coefficient based on the characteristic of an ordinary audio signal.
摘要翻译：通过使用高范围子带信号，计算与听觉的重要性相对应的校正系数，以校正噪声电平并生成附加信号信息，从而准确地反映听觉中重要的子带的噪声电平。因此，可以以小的计算量根据重要性计算反映听觉中重要的子带的噪声水平的附加信号信息。通过使用基于普通音频信号的特性的校正系数可以进一步减少计算量。

7. 发明申请

US20100198990A1 MULTI-POINT CONNECTION DEVICE, SIGNAL ANALYSIS AND DEVICE, METHOD, AND PROGRAM 有权
标题翻译：多点连接设备，信号分析和设备，方法和程序
公开(公告)号：US20100198990A1
公开(公告)日：2010-08-05
申请号：US12666827
申请日：2008-06-26
申请人： Osamu Shimada , Toshiyuki Nomura , Akihiko Sugiyama , Osamu Houshuyama
发明人： Osamu Shimada , Toshiyuki Nomura , Akihiko Sugiyama , Osamu Houshuyama
IPC分类号： G06F15/16
CPC分类号： H04N7/152 , G10L19/008 , H04M3/56
摘要： Provided is a multi-point connection device including: a first signal receiving unit which receives a first signal containing a plurality of constituent elements and first analysis information expressing the relationship between the constituent elements contained in the first signal; a second signal receiving unit which receives a second signal containing a plurality of constituent elements and second analysis information expressing the relationship between the constituent elements contained in the second signal; a signal mixing unit which mixes the first signal and the second signal; and an analysis information mixing unit which mixes the first analysis information and the second analysis information.
摘要翻译：提供一种多点连接装置，包括：第一信号接收单元，其接收包含多个构成要素的第一信号和表示包含在第一信号中的构成要素之间的关系的第一分析信息; 第二信号接收单元，其接收包含多个构成要素的第二信号和表示包含在第二信号中的构成要素之间的关系的第二分析信息; 混合第一信号和第二信号的信号混合单元; 以及混合第一分析信息和第二分析信息的分析信息混合单元。

8. 发明申请

US20100189280A1 SIGNAL ANALYSIS DEVICE, SIGNAL CONTROL DEVICE, ITS SYSTEM, METHOD, AND PROGRAM 有权
标题翻译：信号分析装置，信号控制装置，其系统，方法和程序
公开(公告)号：US20100189280A1
公开(公告)日：2010-07-29
申请号：US12666941
申请日：2008-06-26
申请人： Osamu Shimada , Toshiyuki Nomura , Akihiko Sugiyama , Osamu Houshuyama
发明人： Osamu Shimada , Toshiyuki Nomura , Akihiko Sugiyama , Osamu Houshuyama
IPC分类号： H04B15/00
CPC分类号： G10L21/0208 , H03G3/32 , H04S2400/13
摘要： A signal analysis device includes: a signal reception unit which receives an input signal containing a plurality of constituent elements; and a signal analysis unit which generates analysis information indicating the relationship between the constituent elements from the input signal.
摘要翻译：信号分析装置包括：信号接收单元，其接收包含多个构成要素的输入信号; 以及信号分析单元，其从输入信号生成表示构成要素之间的关系的分析信息。

9. 发明授权

US07644497B2 Component built-in wiring board and manufacturing method of component built-in wiring board 失效
标题翻译：组件内置线路板及组件内置线路板的制造方法
公开(公告)号：US07644497B2
公开(公告)日：2010-01-12
申请号：US12007924
申请日：2008-01-17
申请人： Tatsuro Imamura , Yuji Yamaguchi , Kazuhiro Shinozaki , Satoshi Shibazaki , Yoshitaka Fukuoka , Hiroyuki Hirai , Osamu Shimada , Kenji Sasaoka , Kenichi Matsumura
发明人： Tatsuro Imamura , Yuji Yamaguchi , Kazuhiro Shinozaki , Satoshi Shibazaki , Yoshitaka Fukuoka , Hiroyuki Hirai , Osamu Shimada , Kenji Sasaoka , Kenichi Matsumura
IPC分类号： H05K3/30 , H05K3/36
CPC分类号： H05K1/184 , H05K1/023 , H05K1/186 , H05K3/3442 , H05K3/4602 , H05K2201/10636 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165 , Y10T29/49789 , Y10T29/49798
摘要： To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer (34, 35) extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component (33) having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member (36, 37) provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers (11, 15) which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.
摘要翻译：提供一种组件内置布线板及其制造方法，其能够进一步提高部件安装密度而不劣化可靠性。所述部件内置布线板包括：导电层（34,35），其在所述板的厚度方向上延伸并埋设在所述板中而不暴露于所述板的上表面和下表面; 一个电子/电子部件（33），具有一个终端并埋设在该电路板中，该端子面向该掩埋的导电层; 设置在掩埋电气/电子部件的端子与导电层之间的间隙中的电连接/机械连接端子和导电层的连接件（36,37）; 以及两个覆盖所述埋入的电气/电子部件的外表面的绝缘层（11,15），除了连接到所述连接构件的部分之外，所述外部表面与所述电气/电子部件的板厚方向上的顶部和底部紧密接触电气/电子部件。

10. 发明申请

US20090326963A1 AUDIO ENCODING DEVICE, AUDIO ENCODING METHOD, AND PROGRAM THEREOF 有权
标题翻译：音频编码设备，音频编码方法及其程序
公开(公告)号：US20090326963A1
公开(公告)日：2009-12-31
申请号：US12307897
申请日：2007-07-06
申请人： Osamu Shimada
发明人： Osamu Shimada
IPC分类号： G10L21/04
CPC分类号： G10L21/04 , G10L19/0208 , H04B1/665 , H04N21/2368
摘要： [Problems] To provide a high-quality audio signal encoding technique by controlling the number of time/frequency groups in a frame.[Means for Solving Problems] An audio encoding device includes: a time group boundary candidate position extraction unit (101) for analyzing a sub-band signal (2001) obtained by frequency-changing an input signal and calculating a candidate position of the time group boundary; a time group quantity generation unit (103) for outputting a maximum value of the time group quantity; a time group selection unit (102) for generating a time group quantity not greater than the maximum time group quantity by using the candidate position; and a frequency group generation unit (104) for generating a frequency group by using the generated time group information. The device generates a time/frequency group accurately reflecting a change of the input signal and performs operations while controlling the number of time/frequency groups in the frame.
摘要翻译： [问题]通过控制帧中的时间/频率组的数量来提供高质量的音频信号编码技术。解决问题的手段音频编码装置包括：时间组边界候补位置提取单元，用于分析通过对输入信号进行频率变换而获得的子带信号（2001），并计算时间组的候选位置边界; 时间组数量生成单元，用于输出时间组数量的最大值; 时间组选择单元，用于通过使用候选位置生成不大于最大时间组数量的时间组数量; 以及用于通过使用所生成的时间组信息来生成频率组的频率组生成单元（104）。该装置产生准确地反映输入信号的变化的时间/频率组，并且在控制帧中的时间/频率组的数量的同时进行操作。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式