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1. 发明申请

US20070054469A1 Pressure-sensitive adhesive sheet and method of processing articles 审中-公开
标题翻译：压敏粘合片和加工制品的方法
公开(公告)号：US20070054469A1
公开(公告)日：2007-03-08
申请号：US11514454
申请日：2006-09-01
申请人： Kohei Yano , Kouji Akazawa , Yoshinori Yoshida , Tomohiro Kontani
发明人： Kohei Yano , Kouji Akazawa , Yoshinori Yoshida , Tomohiro Kontani
IPC分类号： H01L21/30
CPC分类号： C09J7/29 , C09J2201/162 , C09J2203/326 , C09J2433/006
摘要： To provide a pressure-sensitive adhesive sheet, which is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet has a base, an intermediate layer and a pressure-sensitive adhesive layer in this order, wherein the intermediate layer has an elastic modulus in tension at 23° C. of 10 MPa or more and 100 Mpa or less, the intermediate layer includes an acrylic-based polymer obtained by polymerization of a mixture containing 70 to 99 parts by weight of a (meth)acrylate monomer and 1 to 30 parts by weight of an unsaturated carboxylic acid based on 100 parts by weight of total monomers, and the base includes at least one film having an elastic modulus in tension at 23° C. of 0.6 GPa or more.
摘要翻译：为了提供用于加工诸如半导体晶片的物品的压敏粘合片，该压敏粘合片依次具有基底，中间层和压敏粘合剂层，其中中间层在23℃下的拉伸弹性模量为10MPa以上至100Mpa以下，中间层包含通过聚合含有70〜99重量份的（甲基）丙烯酸酯的混合物而得到的丙烯酸系聚合物单体和1〜30重量份的不饱和羧酸，基于100重量份的总单体，并且所述基材包括至少一种在23℃下的拉伸弹性模量为0.6GPa以上的膜。

2. 发明申请

US20060188725A1 Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet 有权
标题翻译：多层片材，其制造方法和使用该多层片材的压敏粘合片材
公开(公告)号：US20060188725A1
公开(公告)日：2006-08-24
申请号：US11358886
申请日：2006-02-21
申请人： Yoshinori Yoshida , Kouji Akazawa , Tomohiro Kontani , Kohei Yano
发明人： Yoshinori Yoshida , Kouji Akazawa , Tomohiro Kontani , Kohei Yano
IPC分类号： B32B37/00
CPC分类号： H01L21/6836 , B32B27/40 , C08G18/6208 , C08L33/06 , C08L2666/04 , C09J7/29 , C09J175/04 , C09J2201/162 , C09J2203/326 , C09J2433/006 , C09J2475/006 , H01L2221/68327 , Y10T428/31504 , Y10T428/31565 , Y10T428/31573
摘要： To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.
摘要翻译：为了提供在加工制品例如半导体晶片和用于这种压敏粘合片的层叠片材中使用的压敏粘合片，其在处理期间不会污染或破坏半导体晶片，并且可以使物品的卷曲最小化对于压敏粘合片的残余应力，多层片材包括含有聚氨酯聚合物和乙烯基类聚合物作为有效成分的复合膜和由与复合膜不同的材料制成的第一膜，其中聚氨酯聚合物由聚烯烃二醇和多异氰酸酯形成。通过在多层片材的至少一面上设置压敏粘合剂层来获得压敏粘合片。

3. 发明申请

US20070059903A1 Pressure-sensitive adhesive sheet and method of processing articles 审中-公开
标题翻译：压敏粘合片和加工制品的方法
公开(公告)号：US20070059903A1
公开(公告)日：2007-03-15
申请号：US11514504
申请日：2006-09-01
申请人： Kohei Yano , Kouji Akazawa , Yoshinori Yoshida , Tomohiro Kontani
发明人： Kohei Yano , Kouji Akazawa , Yoshinori Yoshida , Tomohiro Kontani
IPC分类号： H01L21/30
CPC分类号： H01L21/6835 , B24B37/30 , C09J2203/326 , C09J2205/31 , C09J2433/003 , H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23° C. of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylic polymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23° C. of 0.6 GPa or more.
摘要翻译：为了提供用于加工诸如半导体晶片的物品的压敏粘合剂，压敏粘合片是依次具有基底，中间层和压敏粘合剂层的粘合片，其中中间层在23℃的伸长率下的弹性模量为1MPa以上至100MPa以下，中间层包含通过聚合含有1重量％以上且20重量％以上的（甲基）丙烯酸单体混合物而得到的丙烯酸类聚合物，以下的含氮丙烯酸类单体，所述丙烯酸类聚合物含有20重量％以下的分子量为100,000以下的聚合物成分，所述基材包括至少一层在拉伸下具有弹性模量的膜在23℃下为0.6GPa以上。

4. 发明授权

US07976952B2 Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet 有权
标题翻译：多层片材，其制造方法和使用该多层片材的压敏粘合片材
公开(公告)号：US07976952B2
公开(公告)日：2011-07-12
申请号：US11358886
申请日：2006-02-21
申请人： Yoshinori Yoshida , Kouji Akazawa , Tomohiro Kontani , Kohei Yano
发明人： Yoshinori Yoshida , Kouji Akazawa , Tomohiro Kontani , Kohei Yano
IPC分类号： B32B27/32 , B32B27/36 , B32B27/40
CPC分类号： H01L21/6836 , B32B27/40 , C08G18/6208 , C08L33/06 , C08L2666/04 , C09J7/29 , C09J175/04 , C09J2201/162 , C09J2203/326 , C09J2433/006 , C09J2475/006 , H01L2221/68327 , Y10T428/31504 , Y10T428/31565 , Y10T428/31573
摘要： To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.
摘要翻译：为了提供在加工制品例如半导体晶片和用于这种压敏粘合片的层叠片材中使用的压敏粘合片，其在处理期间不会污染或破坏半导体晶片，并且可以使物品的卷曲最小化对于压敏粘合片的残余应力，多层片材包括含有聚氨酯聚合物和乙烯基类聚合物作为有效成分的复合膜和由与复合膜不同的材料制成的第一膜，其中聚氨酯聚合物由聚烯烃二醇和多异氰酸酯形成。通过在多层片材的至少一面上设置压敏粘合剂层来获得压敏粘合片。

5. 发明申请

US20070071969A1 Pressure-sensitive adhesive sheet, production method thereof and method of processing articles 审中-公开
标题翻译：压敏粘合片，其制造方法和制品的加工方法
公开(公告)号：US20070071969A1
公开(公告)日：2007-03-29
申请号：US11524177
申请日：2006-09-20
申请人： Tomohiro Kontani , Kouji Akazawa , Kohei Yano , Yoshinori Yoshida
发明人： Tomohiro Kontani , Kouji Akazawa , Kohei Yano , Yoshinori Yoshida
IPC分类号： B32B7/12 , B32B15/04
CPC分类号： H01L21/6836 , B32B27/40 , C08G18/4854 , C08G18/6229 , C08G18/7642 , C08G18/8116 , C08G2170/40 , C08L33/08 , C08L2666/04 , C09J7/29 , C09J175/04 , C09J2201/162 , C09J2203/326 , C09J2433/006 , C09J2475/006 , H01L2221/68327 , Y10T428/28 , Y10T428/2848
摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer that causes neither contamination nor breakage of the semiconductor wafer during the processing, the pressure-sensitive adhesive sheet has a base, an intermediate layer, and a pressure-sensitive adhesive layer in order. The intermediate layer includes a composite film that contains an acrylic-based polymer and a vinyl-based polymer as active ingredients. The urethane polymer contains a component having a weight-average molecular weight of 10,000 or less in a differential molecular weight curve in a content of less than 10%.
摘要翻译：为了提供在处理期间用于加工诸如半导体晶片的制品的压敏粘合剂，其不会引起污染或不会破坏半导体晶片，所以压敏粘合片具有基底，中间层和压力敏感粘合剂层。中间层包括含有丙烯酸类聚合物和乙烯基类聚合物作为活性成分的复合膜。氨基甲酸酯聚合物的含量在10％以下的差示分子量曲线中含有重均分子量为10,000以下的成分。

6. 发明申请

US20070036930A1 Pressure-sensitive adhesive sheet, production method thereof and method of processing articles 审中-公开
标题翻译：压敏粘合片，其制造方法和制品的加工方法
公开(公告)号：US20070036930A1
公开(公告)日：2007-02-15
申请号：US11500118
申请日：2006-08-07
申请人： Tomohiro Kontani , Yoshinori Yoshida , Toshio Shintani , Kouji Akazawa
发明人： Tomohiro Kontani , Yoshinori Yoshida , Toshio Shintani , Kouji Akazawa
IPC分类号： B32B33/00
CPC分类号： B32B7/12 , B32B7/06 , B32B27/08 , B32B27/308 , B32B2309/105 , B32B2405/00 , C08L33/08 , C08L2666/04 , C09J7/22 , C09J7/29 , C09J7/38 , C09J133/08 , C09J2201/162 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2433/00 , C09J2433/006 , Y10T428/14
摘要： To provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N/mm2 or less, a loss tangent (tanδ) at 20° C. to 70° C. of 0.4 or more, and a gel fraction of 30% or more
摘要翻译：为了提供用于处理晶片等物品的压敏粘合片，即使当凹凸的高度差大时，也可以产生较少的压敏粘合片的切割污泥，并且可以跟随晶片的不均匀性所述粘合片具有在其一个表面上具有中间层和压敏粘合剂层的基体，其中所述中间层的初始弹性模量为0.5N / mm 2以下，或更少，在20℃至70℃的损耗角正切（tandelta）为0.4或更大，凝胶分数为30％或更多

7. 发明申请

US20080193728A1 PRESSURE-SENSITIVE ADHESIVE SHEET, METHOD FOR PRODUCING THE SAME AND METHOD FOR USING THE SAME AS WELL AS A MULTI-LAYER SHEET FOR USE IN THE PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：压敏粘合片及其制造方法以及使用它们的方法以及用于压敏粘合片中的多层片及其制造方法
公开(公告)号：US20080193728A1
公开(公告)日：2008-08-14
申请号：US12051715
申请日：2008-03-19
申请人： Yoshinori YOSHIDA , Yohei Maeno , Kouji Akazawa , Takeshi Matsumura , Tomokazu Takahashi
发明人： Yoshinori YOSHIDA , Yohei Maeno , Kouji Akazawa , Takeshi Matsumura , Tomokazu Takahashi
IPC分类号： B32B15/095 , B05D3/06 , B32B33/00 , B65B33/00
CPC分类号： B32B27/08 , B32B27/30 , B32B27/40 , C08G2170/40 , C09J7/29 , C09J2201/162 , C09J2203/326 , C09J2433/006 , C09J2475/006 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6839 , Y10T428/2495 , Y10T428/2848 , Y10T428/31551
摘要： Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
摘要翻译：公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片，并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲，压敏粘合剂片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜，包含不同于复合膜的材料的第一膜和压敏粘合剂层。优选的是，压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。

8. 发明申请

US20050153129A1 Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same 审中-公开
标题翻译：压敏粘合片及其制造方法及其使用方法以及用于该压敏粘合片的多层片及其制造方法
公开(公告)号：US20050153129A1
公开(公告)日：2005-07-14
申请号：US11038147
申请日：2005-01-21
申请人： Yoshinori Yoshida , Yohei Maeno , Kouji Akazawa , Takeshi Matsumura , Tomokazu Takahashi
发明人： Yoshinori Yoshida , Yohei Maeno , Kouji Akazawa , Takeshi Matsumura , Tomokazu Takahashi
IPC分类号： B32B27/08 , C09J7/02 , H01L21/68 , B32B9/00 , B32B33/00 , B32B7/12 , B32B15/04
CPC分类号： B32B27/08 , B32B7/12 , B32B2307/748 , B32B2405/00 , C09J7/29 , C09J2201/162 , C09J2433/006 , C09J2475/006 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6839 , Y10T428/28 , Y10T428/2848
摘要： Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
摘要翻译：公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片，并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲，压敏粘合剂片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜，包含不同于复合膜的材料的第一膜和压敏粘合剂层。优选的是，压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。

9. 发明授权

US07951623B2 Process for producing optical semiconductor device 有权
标题翻译：光半导体装置的制造方法
公开(公告)号：US07951623B2
公开(公告)日：2011-05-31
申请号：US12202456
申请日：2008-09-02
申请人： Noriaki Harada , Ryuuichi Kimura , Kouji Akazawa
发明人： Noriaki Harada , Ryuuichi Kimura , Kouji Akazawa
IPC分类号： H01L21/00
CPC分类号： C08G59/24 , C08G59/4215 , C09D163/00 , H01L33/52 , Y10T428/31663
摘要： The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life.
摘要翻译：本发明涉及一种光半导体器件的制造方法，该方法包括：将不连续地嵌入树脂片A中的树脂片A和多个树脂层B的光半导体元件封装用片材配置成多个，以使得所述多个光学半导体元件中的每一个面对所述多个树脂层B中的任一个的方式安装在基板上的光半导体元件; 然后将多个光学半导体元件中的每一个嵌入到多个树脂层B中的任一个中。根据本发明的方法，可以一次嵌入光学半导体元件。结果，可以容易地获得LED元件保护和耐久性优异的光半导体装置。因此，获得的光半导体器件可以具有延长的寿命。

10. 发明授权

US07781794B2 Resin sheet for encapsulating optical semiconductor element and optical semiconductor device 有权
标题翻译：用于封装光学半导体元件和光学半导体器件的树脂片
公开(公告)号：US07781794B2
公开(公告)日：2010-08-24
申请号：US12409782
申请日：2009-03-24
申请人： Ichiro Suehiro , Kouji Akazawa , Hideyuki Usui
发明人： Ichiro Suehiro , Kouji Akazawa , Hideyuki Usui
IPC分类号： H01L33/00
CPC分类号： H01L21/561 , H01L24/97 , H01L33/44 , H01L33/483 , H01L33/52 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/12041 , H01L2924/181 , Y10T428/24851 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.
摘要翻译：本发明提供一种用于封装光学半导体元件的树脂片，含有密封树脂层的树脂片，粘合树脂层，金属层和保护树脂层，其中密封树脂层和金属层粘附到粘合树脂层彼此相邻地设置，保护树脂层层叠在密封树脂层和金属层上以覆盖密封树脂层和金属层两者，并且密封树脂层具有朝向保护树脂层; 以及包含通过使用树脂片封装的光半导体元件的光学半导体器件。本发明的光半导体元件封装树脂片可以适用于液晶屏，交通信号灯，大型室外显示器，广告牌等的背光。

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