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    • 2. 发明申请
    • METHOD OF CLEANING FILM FORMING APPARATUS AND FILM FORMING APPARATUS
    • 清洗成膜装置和薄膜成膜装置的方法
    • US20140318457A1
    • 2014-10-30
    • US14262334
    • 2014-04-25
    • TOKYO ELECTRON LIMITED
    • Kota UMEZAWAYosuke WATANABE
    • C23C16/44H01L21/02
    • C23C16/4405C23C16/4408C23C16/45523
    • A film forming apparatus includes: a processing chamber configured to accommodate a substrate to be processed, the processing chamber performing a film forming process forming a compound semiconductor film; a heating device configured to heat the substrate to be processed; an exhaust device configured to exhaust an interior of the processing chamber, and a process gas supply mechanism configured to supply a gas to the processing chamber. In addition, a method of cleaning the film forming apparatus includes: performing a process of cleaning the interior of the processing chamber and a member; performing a process of cleaning lower portions of the interior of the processing chamber and the member, respectively; and performing a process of cleaning a gas supply channel, wherein the processes are performed by controlling the pressure and temperature inside the processing chamber and supplying a cleaning gas from the gas supply channel.
    • 一种成膜装置包括:处理室,被配置为容纳待处理的基板,所述处理室执行形成化合物半导体膜的成膜工艺; 加热装置,其构造成加热待加工的基板; 排气装置,其构造成排出处理室的内部;以及处理气体供给机构,其构造成将气体供给到处理室。 另外,清洗成膜装置的方法包括:执行清洁处理室内部和部件的处理; 执行分别清洁处理室和构件的内部的下部的过程; 以及执行清洁气体供应通道的过程,其中通过控制处理室内部的压力和温度并从气体供应通道供应清洁气体来执行处理。