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1. 发明授权

US10340248B2 Bonding systems 有权
公开(公告)号：US10340248B2
公开(公告)日：2019-07-02
申请号：US15644292
申请日：2017-07-07
申请人： TOKYO ELECTRON LIMITED
发明人： Masataka Matsunaga , Takashi Koga , Takeshi Tamura , Takahiro Masunaga , Yuji Mimura , Masaru Honda , Toshifumi Inamasu , Satoshi Nishimura
IPC分类号： H01L21/18 , H01L21/67 , H01L23/00 , H05K13/00 , H01L21/677
摘要： A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

2. 发明授权

US10071544B2 Separation apparatus, separation system, and separation method 有权
公开(公告)号：US10071544B2
公开(公告)日：2018-09-11
申请号：US13693151
申请日：2012-12-04
申请人： Tokyo Electron Limited , INTEL CORPORATION
发明人： Osamu Hirakawa , Masaru Honda , Akira Fukutomi , Takeshi Tamura , Jiro Harada , Kazutaka Noda , Xavier Francois Brun
IPC分类号： B32B38/10 , H01L21/67 , B32B43/00
CPC分类号： B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/67051 , H01L21/67092 , H01L21/67288 , Y10T156/11 , Y10T156/1189 , Y10T156/19 , Y10T156/1972
摘要： A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.

3. 发明授权

US09162435B2 Peel-off apparatus, peel-off system, peel-off method and computer storage medium 有权
标题翻译：剥离装置，剥离系统，剥离方法和计算机存储介质
公开(公告)号：US09162435B2
公开(公告)日：2015-10-20
申请号：US14492364
申请日：2014-09-22
申请人： Tokyo Electron Limited
发明人： Masaru Honda , Ryoichi Sakamoto
IPC分类号： B32B38/10 , B32B38/18 , H01L21/67 , B32B43/00
CPC分类号： B32B38/18 , B32B38/10 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , Y10T156/1132 , Y10T156/1168 , Y10T156/1944 , Y10T156/1967 , Y10T156/1994
摘要： Disclosed is a peel-off apparatus comprising: a first holding unit configured to hold a first substrate of a superimposed substrate; a second holding unit configured to hold a second substrate of the superimposed substrate; and a moving unit configured to move a part of outer periphery of the first holding unit to be separated from the second holding unit. The first holding unit includes: a plate type elastic member connected to the moving unit; and a plurality of adsorbing units provided in the elastic member to adsorb the first substrate. An outer periphery adsorbing unit which becomes a peel-off beginning point includes: a pad member whose adsorbing surface of the first substrate is open to form a hollow portion; and a support member fitted into the hollow portion of the pad member having a hardness higher than that of the pad member.
摘要翻译：公开了一种剥离装置，包括：第一保持单元，被配置为保持叠加的基板的第一基板; 第二保持单元，被配置为保持叠加的基板的第二基板; 以及移动单元，其构造成使得所述第一保持单元的外周的一部分与所述第二保持单元分离。第一保持单元包括：连接到移动单元的板状弹性构件; 以及多个吸附单元，设置在弹性部件中以吸附第一基板。成为剥离开始点的外周吸附单元包括：第一基板的吸附面打开以形成中空部的垫部件; 以及安装在所述垫构件的所述中空部分中的硬度高于所述衬垫构件的硬度的支撑构件。

4. 发明申请

US20140150981A1 PEELING APPARATUS, PEELING SYSTEM AND PEELING METHOD 审中-公开
标题翻译：沾染设备，沾染系统和剥离方法
公开(公告)号：US20140150981A1
公开(公告)日：2014-06-05
申请号：US14083790
申请日：2013-11-19
申请人： Tokyo Electron Limited
发明人： Masanori Itou , Masaru Honda , Takayuki Chinju
IPC分类号： B32B43/00
CPC分类号： B32B43/006 , B32B38/1858 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/6838 , Y10T156/1168 , Y10T156/19
摘要： Provided is a peeling apparatus includes a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The second holding unit includes a first suction and moving unit and a second suction and moving unit. The first suction moving unit sucks and moves a circumferential edge portion of the second corresponding to the area formed by the peeling inducing unit, in a direction of separating the circumferential edge portion from the surface of the first substrate. The a second suction and moving unit sucks and moves a region which is closer to a central portion of the second substrate than to the circumferential edge portion of the second substrate, in a direction of separating the region from the surface of the first substrate.
摘要翻译：提供一种剥离装置，包括第一保持单元，第二保持单元和剥离诱导单元。第一保持单元保持第一基板和第二基板接合的叠加基板的第一基板。第二保持单元保持重叠基板的第二基板，并且使第二基板沿着从第一基板的表面分离第二基板的方向移动。剥离诱导单元形成第二基板在叠加基板的侧表面上开始从第一基板剥离的区域。第二保持单元包括第一吸入和移动单元和第二吸入和移动单元。第一抽吸移动单元沿与从第一基板的表面分离圆周边缘部分的方向吸引和移动与由剥离诱导单元形成的区域相对应的第二边缘部分。第二吸引移动单元在与第一基板的表面分离的方向上吸引并移动比第二基板的周缘部靠近第二基板的中央部的区域。

5. 发明申请

US20220384386A1 BONDING SYSTEM AND SURFACE MODIFICATION METHOD 有权
公开(公告)号：US20220384386A1
公开(公告)日：2022-12-01
申请号：US17804163
申请日：2022-05-26
申请人： Tokyo Electron Limited
发明人： Yuji Mimura , Hiroshi Maeda , Takashi Terada , Masaru Honda , Ryoichi Sakamoto , Yutaka Yamasaki
IPC分类号： H01L23/00 , H01J37/32
摘要： A bonding system includes a surface modifying apparatus and a bonding apparatus. The surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate with plasma of a processing gas. The bonding apparatus is configured to bond two substrates modified by the surface modifying apparatus by an intermolecular force. The surface modifying apparatus includes: a processing chamber configured to accommodate therein the substrate; a processing gas supply configured to supply a processing gas containing moisture into the processing chamber; and a plasma forming unit configured to form the plasma of the processing gas containing the moisture.

6. 发明授权

US09211691B2 Delamination device 有权
标题翻译：分层装置
公开(公告)号：US09211691B2
公开(公告)日：2015-12-15
申请号：US14029442
申请日：2013-09-17
申请人： TOKYO ELECTRON LIMITED
发明人： Masaru Honda , Masanori Itou
IPC分类号： B32B38/10 , B32B43/00 , H01L21/67 , H01L21/683
CPC分类号： B32B43/006 , B32B38/10 , B32B2457/14 , H01L21/67092 , H01L21/6838 , Y10T156/1168 , Y10T156/19 , Y10T156/1978
摘要： Provided is a delamination device of delaminating a laminated substrate obtained by bonding a first substrate and a second substrate, the laminated substrate being disposed in an opening of a frame, the opening having a diameter larger than that of the laminated substrate, and the laminated substrate being held by the frame with a non-bonding surface of the first substrate attached to a tape provided in the opening. The delamination device includes: a first holding unit configured to hold the second substrate of the laminated substrate from above; a second holding unit configured to hold the first substrate of the laminated substrate from below through the tape; and a moving mechanism configured to move the first holding unit in a direction away from the second holding unit.
摘要翻译：本发明提供一种分层装置，其通过将第一基板和第二基板接合而获得的层压基板的剥离，所述层叠基板设置在框架的开口部中，所述开口的直径大于所述层叠基板的直径，所述层叠基板被框架保持，其中第一基板的非接合表面附接到设置在开口中的带。分层装置包括：第一保持单元，被配置为从上方保持层叠基板的第二基板; 第二保持单元，被配置为通过所述带从下方保持所述层叠基板的所述第一基板; 以及移动机构，其构造成沿着远离所述第二保持单元的方向移动所述第一保持单元。

7. 发明申请

US20140150980A1 PEELING APPARATUS, PEELING SYSTEM AND PEELING METHOD 审中-公开
标题翻译：沾染设备，沾染系统和剥离方法
公开(公告)号：US20140150980A1
公开(公告)日：2014-06-05
申请号：US14083721
申请日：2013-11-19
申请人： Tokyo Electron Limited
发明人： Masanori Itou , Masaru Honda , Takayuki Chinju
IPC分类号： B32B43/00
CPC分类号： B32B43/006 , B32B38/1858 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/6715 , Y10T156/1168 , Y10T156/1961
摘要： Provided is a peeling apparatus including a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The peeling inducing unit includes a sharp member, and a moving mechanism that moves the sharp member toward a side surface portion of the second substrate adjacent to a bonding portion of the first substrate and the second substrate in the side surface of the superimposed substrate.
摘要翻译：提供一种剥离装置，包括第一保持单元，第二保持单元和剥离诱导单元。第一保持单元保持第一基板和第二基板接合的叠加基板的第一基板。第二保持单元保持重叠基板的第二基板，并且使第二基板沿着从第一基板的表面分离第二基板的方向移动。剥离诱导单元形成第二基板在叠加基板的侧表面上开始从第一基板剥离的区域。剥离诱导单元包括锋利构件，以及移动机构，其将尖锐构件朝向与第一基板和第二基板的接合部分相邻的第二基板的侧表面部分邻近叠加基板的侧表面移动。

8. 发明申请

US20230055853A1 SEPARATING METHOD, SEPARATING APPARATUS, AND SEPARATING SYSTEM 有权
公开(公告)号：US20230055853A1
公开(公告)日：2023-02-23
申请号：US17820299
申请日：2022-08-17
申请人： Tokyo Electron Limited
发明人： Takashi Terada , Yuji Mimura , Hiroshi Maeda , Kazutaka Noda , Masaru Honda , Ryoichi Sakamoto , Yutaka Yamasaki , Tatsuya Kitayama , Akira Fukutomi
IPC分类号： B32B43/00
摘要： A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.

9. 发明授权

US09643396B2 Peeling device, peeling system and peeling method 有权
公开(公告)号：US09643396B2
公开(公告)日：2017-05-09
申请号：US14723778
申请日：2015-05-28
申请人： TOKYO ELECTRON LIMITED
发明人： Masaru Honda , Ryoichi Sakamoto , Katsuhiro Ikeda
IPC分类号： B32B43/00
CPC分类号： B32B43/006 , B32B2309/16 , B32B2457/14 , Y10T156/1132 , Y10T156/1168 , Y10T156/19 , Y10T156/1944 , Y10T156/1967 , Y10T156/1978 , Y10T156/1989
摘要： A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate.

10. 发明授权

US09601365B2 Peeling device, peeling system, and peeling method 有权
公开(公告)号：US09601365B2
公开(公告)日：2017-03-21
申请号：US14263471
申请日：2014-04-28
申请人： TOKYO ELECTRON LIMITED
发明人： Masaru Honda , Ryoichi Sakamoto
IPC分类号： B32B38/10 , H01L21/683 , H01L21/67 , B32B43/00 , B32B38/18
CPC分类号： H01L21/6838 , B32B38/10 , B32B38/1858 , B32B43/006 , B32B2309/62 , B32B2457/14 , H01L21/67092 , Y10T156/1137 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1961 , Y10T156/1983
摘要： A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.

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