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    • 1. 发明授权
    • Apparatus for mounting electronic component
    • 电子部件安装装置
    • US09089086B2
    • 2015-07-21
    • US13225902
    • 2011-09-06
    • Tohru HaradaMitsuo TakeuchiHirokazu YamanishiYoshiaki YanagidaToru Okada
    • Tohru HaradaMitsuo TakeuchiHirokazu YamanishiYoshiaki YanagidaToru Okada
    • B23P19/00H05K13/04H01L23/00
    • H05K13/0486H01L24/75H01L24/81Y10T29/49004Y10T29/53022
    • An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.
    • 一种用于安装电子部件的装置包括:相对于放置在印刷电路板上的电子部件移动的加热头,根据电子部件的倾斜倾斜与电子部件接触,并加热连接到电子部件的接合材料 印刷电路板和电子元器件; 测量加热头的位置和倾斜度的第一传感器; 测量印刷板的位置和倾斜度的第二传感器; 以及控制单元,其基于在所述加热头与所述电子部件接触的状态下的所述第一传感器的测量结果来计算所述电子部件的位置和倾斜度,并且基于所述接合材料的熔融状态来确定 关于第二传感器的测量结果以及电子部件的位置和倾斜度。
    • 2. 发明申请
    • APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
    • 用于安装电子元件的装置和方法
    • US20120060356A1
    • 2012-03-15
    • US13225902
    • 2011-09-06
    • Tohru HaradaMitsuo TakeuchiHirokazu YamanishiYoshiaki YanagidaToru Okada
    • Tohru HaradaMitsuo TakeuchiHirokazu YamanishiYoshiaki YanagidaToru Okada
    • G01R31/28B23P21/00
    • H05K13/0486H01L24/75H01L24/81Y10T29/49004Y10T29/53022
    • An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.
    • 一种用于安装电子部件的装置包括:相对于放置在印刷电路板上的电子部件移动的加热头,根据电子部件的倾斜倾斜与电子部件接触,并加热连接到电子部件的接合材料 印刷电路板和电子元器件; 测量加热头的位置和倾斜度的第一传感器; 测量印刷板的位置和倾斜度的第二传感器; 以及控制单元,其基于在所述加热头与所述电子部件接触的状态下的所述第一传感器的测量结果来计算所述电子部件的位置和倾斜度,并且基于所述接合材料的熔融状态来确定 关于第二传感器的测量结果以及电子部件的位置和倾斜度。