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    • 5. 发明授权
    • MWT architecture for thin SI solar cells
    • 薄SI太阳能电池的MWT架构
    • US08883552B2
    • 2014-11-11
    • US13208302
    • 2011-08-11
    • Ashish AsthanaTirunelveli S. RaviKramadhati V. RaviSomnath Nag
    • Ashish AsthanaTirunelveli S. RaviKramadhati V. RaviSomnath Nag
    • H01L21/00H01L31/18H01L31/068H01L31/0224
    • H01L31/02245H01L31/02168H01L31/03921H01L31/068H01L31/1804H01L31/1892Y02E10/547Y02P70/521
    • Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell. The solar cells may comprise epitaxially deposited silicon and may include an epitaxially deposited back surface field.
    • 描述了通过太阳能电池制造金属封套的方法和用于薄硅太阳能电池的模块,包括外延硅太阳能电池。 这些金属包裹太阳能电池具有用于基极和发射极触点的平面后接触几何形状。 通过太阳能电池制造金属卷可以包括:通过密封剂将装置的发射极侧附接到太阳能玻璃上的光伏器件,该器件包括器件发射极上的母线; 通过设备基座和发射器形成通孔,终端在母线中的通孔; 在通孔的表面和基底的后表面上沉积保形电介质膜; 从所述通孔的端部去除所述共形绝缘膜的部分,以暴露所述母线和所述基座的场区域; 并且形成与母线和太阳能电池背面上的场区分开的电接触。 太阳能电池可以包括外延沉积的硅并且可以包括外延沉积的背表面场。
    • 9. 发明申请
    • MWT ARCHITECTURE FOR THIN SI SOLAR CELLS
    • 微型太阳能电池的MWT结构
    • US20120040487A1
    • 2012-02-16
    • US13208302
    • 2011-08-11
    • Ashish AsthanaTirunelveli S. RaviKramadhati V. RaviSomnath Nag
    • Ashish AsthanaTirunelveli S. RaviKramadhati V. RaviSomnath Nag
    • H01L31/18
    • H01L31/02245H01L31/02168H01L31/03921H01L31/068H01L31/1804H01L31/1892Y02E10/547Y02P70/521
    • Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell. The solar cells may comprise epitaxially deposited silicon and may include an epitaxially deposited back surface field.
    • 描述了通过太阳能电池制造金属封套的方法和用于薄硅太阳能电池的模块,包括外延硅太阳能电池。 这些金属包裹太阳能电池具有用于基极和发射极触点的平面后接触几何形状。 通过太阳能电池制造金属卷可以包括:通过密封剂将装置的发射极侧附接到太阳能玻璃上的光伏器件,该器件包括器件发射极上的母线; 通过设备基座和发射器形成通孔,终端在母线中的通孔; 在通孔的表面和基底的后表面上沉积保形电介质膜; 从所述通孔的端部去除所述共形绝缘膜的部分,以暴露所述母线和所述基座的场区域; 并且形成与母线和太阳能电池背面上的场区分开的电接触。 太阳能电池可以包括外延沉积的硅并且可以包括外延沉积的背表面场。