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1. 发明授权

US6016947A Non-destructive low melt test for off-composition solder 失效
标题翻译：非组分焊料的非破坏性低熔点试验
公开(公告)号：US6016947A
公开(公告)日：2000-01-25
申请号：US954988
申请日：1997-10-21
申请人： Timothy W. Donahue , Ellyn M. Ingalls , Chon Cheong Lei , Wai Mon Ma , Horatio Quinones , Charles L. Reynolds, Jr. , Peter J. Brofman
发明人： Timothy W. Donahue , Ellyn M. Ingalls , Chon Cheong Lei , Wai Mon Ma , Horatio Quinones , Charles L. Reynolds, Jr. , Peter J. Brofman
IPC分类号： H01L21/66 , H05K1/02 , H05K3/34 , H01L21/00
CPC分类号： H05K3/3457 , H01L22/12 , H05K1/0269 , H05K2203/0113 , H05K2203/0338 , H05K2203/163
摘要： A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.
摘要翻译：用于识别例如陶瓷柱格栅阵列的组合焊料柱的非破坏性方法。该方法在卡组件之前在陶瓷模块级执行，以避免卡片组装后的昂贵损失或返工。衬底上的焊料柱的组装被加热到低于纯组合焊料的熔化温度并高于焊料柱附着到有机板的温度的温度。加热组件产生视觉上可检测到的组成外焊料的特性，其用于鉴定哪些焊料柱由脱组合的焊料组成。

2. 发明授权

US10139840B2 System, device, and method for fluid dispensing control 有权
公开(公告)号：US10139840B2
公开(公告)日：2018-11-27
申请号：US15254896
申请日：2016-09-01
申请人： Horatio Quinones
发明人： Horatio Quinones
IPC分类号： G05D7/06 , G01F25/00 , G01M5/00
摘要： A system for fluid dispensing control includes a fluid dispensing control device, a fluid dispenser, and a fluid flow meter, such that an intelligent parameterization of the dispensing system includes process variables, which characterize system behavior. The parameterization is used in convergence schemes for attaining defined fluid dispensing targets. Further, the parameterization is used to attain a consistent volumetric fluid dispensing by utilizing feedback controls. A fluid dispensing device includes a processor, a non-transitory memory, an input/output, a dispensing controller, a flow monitor, a parameterization manager, and a data bus. Also disclosed is a method for fluid dispensing control, including: a parameter sweep, logging system response data, processing response data, calculating system response function, calculating dispensing parameters, assessing intrinsic variation, determining variation band, controlling fluid dispense process response, and normalizing mass/volume fluid flow.

3. 发明授权

US08690009B2 Automated vacuum assisted valve priming system and methods of use 有权
标题翻译：自动真空辅助阀启动系统及使用方法
公开(公告)号：US08690009B2
公开(公告)日：2014-04-08
申请号：US13063796
申请日：2009-09-18
申请人： Cutler Crowell , Erik Fiske , Horatio Quinones , Brian Sawatzky
发明人： Cutler Crowell , Erik Fiske , Horatio Quinones , Brian Sawatzky
IPC分类号： B67D1/00
CPC分类号： G05D16/20 , B05C5/0225 , B05C11/1005 , B05C11/1034 , Y10T137/0396 , Y10T137/85986
摘要： An automated system (10) and methods (11) for priming a fluid chamber (12) of a fluid dispensing valve (14) with fluid (16) from fluid material source that includes a vacuum source (46), a valve priming station (32), a vacuum switch (54), and a controller (62). The valve priming station (32) has a boot (40), a vacuum chamber (36), and a vacuum channel (42) in the boot (40). The vacuum channel (42) connects with the vacuum source (46) via the vacuum chamber (36). The boot (40) sealingly engages a valve nozzle (28) of the fluid dispensing valve (14) so that the vacuum chamber (36) connects the vacuum source (46) with the fluid chamber (12). The vacuum switch (54) couples with the vacuum channel (42) via the vacuum chamber (36) and has an opened and closed position based upon a vacuum level in the vacuum chamber (36). The controller (62) is electrically connected with the vacuum source (46) and vacuum switch (54) and controls priming of the fluid dispensing valve (14) based upon whether the vacuum switch (54) is opened or closed.
摘要翻译：一种自动化系统（10）和方法（11），用于利用来自流体材料源的流体（16）起动流体分配阀（14）的流体室（12），流体材料源包括真空源（46），阀启动站 32），真空开关（54）和控制器（62）。阀门启动台（32）具有一个罩（40），一个真空室（36）和一个位于靴子（40）中的真空通道（42）。真空通道（42）通过真空室（36）与真空源（46）连接。护罩（40）密封地接合流体分配阀（14）的阀喷嘴（28），使得真空室（36）将真空源（46）与流体室（12）连接。真空开关（54）经由真空室（36）与真空通道（42）联接，并且基于真空室（36）中的真空水平具有打开和关闭位置。基于真空开关（54）是打开还是关闭，控制器（62）与真空源（46）和真空开关（54）电连接并控制流体分配阀（14）的启动。

4. 发明授权

US07785667B2 Method of controlling edge definition of viscous materials 有权
标题翻译：控制粘性材料边缘定义的方法
公开(公告)号：US07785667B2
公开(公告)日：2010-08-31
申请号：US11619871
申请日：2007-01-04
申请人： Horatio Quinones , Tom Chang , Rick Zakrajsek , George Vastola , Brad Perkins , Pat Hogan
发明人： Horatio Quinones , Tom Chang , Rick Zakrajsek , George Vastola , Brad Perkins , Pat Hogan
IPC分类号： B05B17/04 , A62C5/02 , B05D5/00 , B05D3/04 , B05D3/12
CPC分类号： H05K3/0091 , B05B12/16 , B05C11/1034 , B23K3/0638 , B23K2101/36 , H05K3/28 , H05K2203/0126 , H05K2203/1366 , H05K2203/1476
摘要： A method of controlling edge definition of viscous material applied to an application area on a substrate comprises dispensing a row of droplets of the viscous material onto the application area with a dispensing apparatus. While moving relative to the substrate along a path proximate the row of droplets, the dispensing apparatus dispenses a fan spray pattern of the viscous material. At least some of the viscous material dispensed in the fan spray pattern impinges and mixes with the row of droplets to define an edge of the fan spray pattern.
摘要翻译：控制施加到基板上的涂布区域的粘性材料的边缘定义的方法包括用分配装置将一排粘性材料的液滴分配到涂布区域上。当沿着靠近一排液滴的路径相对于基板移动时，分配装置分配粘性材料的风扇喷射图案。分配在风扇喷雾图案中的至少一些粘性材料撞击并与该排液滴混合以限定风扇喷雾图案的边缘。

5. 发明申请

US20090078720A1 METHODS FOR CONTINUOUSLY MOVING A FLUID DISPENSER WHILE DISPENSING AMOUNTS OF A FLUID MATERIAL 有权
标题翻译：流体分配器中流体分配器连续移动的方法
公开(公告)号：US20090078720A1
公开(公告)日：2009-03-26
申请号：US11859176
申请日：2007-09-21
申请人： Ronald N. Abernathy , Phillip P. Maiorca , Horatio Quinones , Thomas Ratledge
发明人： Ronald N. Abernathy , Phillip P. Maiorca , Horatio Quinones , Thomas Ratledge
IPC分类号： G01F11/10
CPC分类号： B05B12/084 , H05K1/0269 , H05K3/0005 , H05K3/0008 , H05K3/125 , H05K13/0465 , H05K2203/0126 , H05K2203/013 , H05K2203/163
摘要： Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.
摘要翻译：在流体分配器连续移动的同时将流体材料施加到诸如电路板的基底上的方法。一些方法通常包括通过执行基板上的预测和实际着陆位置的统计比较，或在每个分配位置处的分配器的预测位置和实际位置来校正每个分配量的流体材料的分配位置。其他方法通常包括在通过针对分配器的运动的伺服循环所指定的校正因子校正的分配位置处引发流体材料的量的分配，或通过由计时器提供的部分伺服循环所指定的校正因子。

6. 发明申请

US20070145164A1 Jetting dispenser with multiple jetting nozzle outlets 审中-公开
标题翻译：喷射分配器具有多个喷嘴出口
公开(公告)号：US20070145164A1
公开(公告)日：2007-06-28
申请号：US11315457
申请日：2005-12-22
申请人： Mani Ahmadi , Alec Babiarz , Robert Ciardella , Liang Fang , Erik Fiske , Horatio Quinones , Thomas Ratledge
发明人： Mani Ahmadi , Alec Babiarz , Robert Ciardella , Liang Fang , Erik Fiske , Horatio Quinones , Thomas Ratledge
IPC分类号： B05B1/30
CPC分类号： B05C5/0275 , B05C5/0225 , B05C11/1034
摘要： A jetting dispenser has a dispenser body with a fluid channel and a fluid channel outlet within the fluid channel. A valve member is movable within the fluid channel for selective contact with a valve seat near the fluid channel outlet. A jetting nozzle is adapted to be coupled to the dispenser body, adjacent the channel outlet, and has a nozzle body with a plurality of nozzle outlets in fluid communication with the channel outlet via a plurality of fluid passages through the nozzle body. The valve member is moved by a valve driver to contact the valve seat and impart momentum to liquid material supplied to the dispenser such that a plurality of droplets of liquid material are simultaneously jetted from the plurality of nozzle outlets.
摘要翻译：喷射分配器具有分配器本体，其具有流体通道和流体通道内的流体通道出口。阀构件可在流体通道内移动，用于与流体通道出口附近的阀座选择性接触。喷射喷嘴适于联接到分配器主体，邻近通道出口，并且具有喷嘴主体，该喷嘴主体具有多个喷嘴出口，其经由多个通过喷嘴体的流体通道与通道出口流体连通。阀构件由阀驱动器移动以接触阀座并且向供给到分配器的液体材料赋予动量，使得多个液体材料液滴从多个喷嘴出口同时喷射。

7. 发明申请

US20050095366A1 Method of conformal coating using noncontact dispensing 审中-公开
标题翻译：使用非接触式分配的保形涂层方法
公开(公告)号：US20050095366A1
公开(公告)日：2005-05-05
申请号：US10698859
申请日：2003-10-31
申请人： Liang Fang , Horatio Quinones
发明人： Liang Fang , Horatio Quinones
IPC分类号： H01L21/56 , H01L23/31 , H05K3/00 , H05K3/28 , B05D1/02
CPC分类号： H05K3/0091 , H01L21/56 , H01L23/3121 , H01L2924/0002 , H05K3/284 , H05K2203/013 , H01L2924/00
摘要： A method of noncontact dispensing is provided for conformal coating applications by jetting a viscous material onto a substrate. Dispensing by a jetting process results in small wetted areas thus providing highly discrete and selective conformal coating capabilities. Enhanced selectivity permits the coating of small areas and geometries and provides excellent edge definition between coated and uncoated areas.
摘要翻译：通过将粘性材料喷射到基底上，提供了非接触式分配方法，用于保形涂层应用。通过喷射过程分配会导致小的湿润区域，从而提供高度离散和选择性的保形涂布能力。增强的选择性允许涂覆小面积和几何形状，并在涂层和未涂覆区域之间提供优异的边缘定义。

8. 发明授权

US06656770B2 Thermal enhancement approach using solder compositions in the liquid state 失效
标题翻译：使用焊料组合物处于液态的热增强方法
公开(公告)号：US06656770B2
公开(公告)日：2003-12-02
申请号：US09874826
申请日：2001-06-05
申请人： Eugene R. Atwood , Joseph A. Benenati , Giulio DiGiacomo , Horatio Quinones
发明人： Eugene R. Atwood , Joseph A. Benenati , Giulio DiGiacomo , Horatio Quinones
IPC分类号： H01L2144
CPC分类号： H01L23/3675 , H01L23/3736 , H01L23/4275 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00013 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/15311 , H01L2924/16251 , H01L2924/00 , H01L2224/29099
摘要： Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. The electronic module cover is a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling. The cap-heat exchanger cover is constructed to be compliant, and to contact both the IC chip and substrate in order to provide, in conjunction with the solder composition, a path of high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air.
摘要翻译：引入焊料组合物到IC芯片与其相关联的热交换器盖之间的界面。焊料组合物具有包含IC芯片工作温度范围的固相线 - 液相线温度范围。焊料组合物具有通过由于与集成电路芯片的热循环相关的温度波动而导致的每个温度升高和降低而改变状态或相位而吸收和排除热能的所需性质。电子模块盖是具有热量的盖交换器形成或附接为单个结构，并且由与基底相同的材料制成，或由具有相容的热膨胀系数的材料制成，以减轻热循环期间垂直位移的影响。盖 - 热交换器盖被构造成柔性，并且与IC芯片和基板接触以便与焊料组合物一起提供从IC芯片到高导热（低热阻）的路径热交换器到周围空气。

9. 发明授权

US06212070B1 Zero force heat sink 失效
标题翻译：零力散热器
公开(公告)号：US06212070B1
公开(公告)日：2001-04-03
申请号：US09071897
申请日：1998-05-05
申请人： Eugene R. Atwood , Joseph A. Benenati , James J. Dankelman , Horatio Quinones , Karl J. Puttlitz , Eric J. Kastberg
发明人： Eugene R. Atwood , Joseph A. Benenati , James J. Dankelman , Horatio Quinones , Karl J. Puttlitz , Eric J. Kastberg
IPC分类号： H05K720
CPC分类号： H01L23/4006 , H01L2224/16225 , H01L2924/09701
摘要： A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which extends through an aperture in the frame is coupled to a surface of the substrate. The heat sink is mechanically decoupled from the substrate. Large heat sinks may be thermally connected to surface mount substrates mounted using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. The heat sink is attached coaxially through the aperture to the substrate. After assembly and lead/tin or other metallic surface mount interconnects are relaxed such that the substrate and is completely supported by the frame and the heat sink imparts zero or nearly zero downward force. Because the heat sink moves freely within the aperture during assembly, the heat sink package is useful for a variety of different substrates. Preferably, the frame is a plate and a plurality of studs. The plate material are selected to match the thermal expansion of the underlying support, and the stud material matched the thermal expansion of the substrate. Thus, the frame construction allows matching expansion and contraction of the assembly to the underlying substrate and support.
摘要翻译：与诸如集成芯片，芯片载体或其它电子封装的衬底的热传递关系的散热器。散热器连接到框架，该框架连接到印刷电路板或其上放置基板的其它合适的支撑件。延伸穿过框架中的孔的散热器耦合到衬底的表面。散热器与基板机械分离。大型散热器可以热连接到使用诸如陶瓷球或列网格阵列，塑料球或列网格阵列或焊球或列的技术安装的表面安装基板。散热器同轴地穿过孔径连接到基板。组装之后，铅/锡或其他金属表面贴装互连件松弛，使得基板并被框架和散热器完全支撑，使零或接近零的向下的力。因为散热器在组装期间在孔内自由移动，所以散热器封装对于各种不同的衬底是有用的。优选地，框架是板和多个螺柱。选择板材以匹配下面的支撑件的热膨胀，并且螺柱材料与基板的热膨胀相匹配。因此，框架结构允许将组件的膨胀和收缩与下面的衬底和支撑件相匹配。

10. 发明授权

US09636701B2 Viscous material noncontact jetting system 有权
公开(公告)号：US09636701B2
公开(公告)日：2017-05-02
申请号：US13568278
申请日：2012-08-07
申请人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
发明人： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
IPC分类号： B05C11/00 , B05C11/10 , B05C5/02 , H05K3/34
CPC分类号： B05C11/1034 , B05C5/001 , B05C5/0225 , B05C11/10 , G05D7/0629 , H05K3/28 , H05K3/3484 , H05K2203/0736
摘要： A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.

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