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    • 1. 发明申请
    • ERROR DETECTION AND CORRECTION IN SEMICONDUCTOR STRUCTURES
    • 半导体结构中的错误检测和校正
    • US20070241398A1
    • 2007-10-18
    • US11277306
    • 2006-03-23
    • Timothy DaltonMarc FaucherPaul KartschokePeter Sandon
    • Timothy DaltonMarc FaucherPaul KartschokePeter Sandon
    • H01L27/12H01L27/01H01L31/0392
    • H01L25/0657G01R31/318513H01L2225/06513H01L2225/06596H01L2924/0002H01L2924/00
    • A semiconductor structure and a method for operating the same. The semiconductor structure includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip is on top of and bonded to the second semiconductor chip. The first and second semiconductor chips include a first and a second electric nodes. The second semiconductor chip further includes a first comparing circuit. The semiconductor structure further includes a first coupling via electrically connecting the first electric node of the first semiconductor chip to the first comparing circuit of the second semiconductor chip. The first comparing circuit is capable of (i) receiving an input signal from the second electric node directly, (ii) receiving an input signal from the first electric node indirectly through the first coupling via, and (iii) asserting a first mismatch signal in response to the input signals from the first and second electric nodes being different.
    • 半导体结构及其操作方法。 半导体结构包括第一半导体芯片和第二半导体芯片。 第一半导体芯片位于第二半导体芯片的顶部并结合到第二半导体芯片上。 第一和第二半导体芯片包括第一和第二电节点。 第二半导体芯片还包括第一比较电路。 半导体结构还包括通过将第一半导体芯片的第一电节点电连接到第二半导体芯片的第一比较电路的第一耦合。 第一比较电路能够(i)直接从第二电节点接收输入信号,(ii)通过第一耦合通路间接接收来自第一电节点的输入信号,以及(iii)将第一不匹配信号置于 对来自第一和第二电节点的输入信号的响应是不同的。