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1. 发明申请

US20080211750A1 Resistance balance circuit 审中-公开
标题翻译：电阻平衡电路
公开(公告)号：US20080211750A1
公开(公告)日：2008-09-04
申请号：US11976561
申请日：2007-10-25
申请人： Tien-Fu Huang , Kuo-Chang Hu , Shih-Hao Hua
发明人： Tien-Fu Huang , Kuo-Chang Hu , Shih-Hao Hua
IPC分类号： G09G3/32
CPC分类号： H05B33/0803 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： This invention discloses a resistance balance circuit including: at least two electronic components aligned in a row matrix, connected to one another in parallel, thereby forming a row matrix structure; an input end disposed at one end of the row matrix structure and configured for entry of current passing the electronic components in the row matrix structure; and an output end disposed diagonally opposite to the input end in the row matrix structure and configured for exit of the current passing the electronic components in the row matrix structure, wherein routes for the current passing the electronic components from the input end to the output end are equal in length, and thus the same current passes the electronic components in the matrix structure.
摘要翻译：本发明公开了一种电阻平衡电路，包括：至少两个以行矩阵排列的电子部件并联连接，从而形成行矩阵结构; 输入端，设置在所述行矩阵结构的一端，并且被配置为输入通过所述行矩阵结构中的所述电子部件的电流; 以及输出端，其布置成与行矩阵结构中的输入端对角地相对，并且被配置为用于退出通过行矩阵结构中的电子部件的电流，其中电流通过电子部件从输入端到输出端的路线长度相等，因此相同的电流通过矩阵结构中的电子部件。

2. 发明申请

US20080157110A1 LED chip having micro-lens structure 有权
标题翻译： LED芯片具有微透镜结构
公开(公告)号：US20080157110A1
公开(公告)日：2008-07-03
申请号：US11826469
申请日：2007-07-16
申请人： Tien-Fu Huang , Shih-Hao Hua , Kuo-Chang Hu
发明人： Tien-Fu Huang , Shih-Hao Hua , Kuo-Chang Hu
IPC分类号： H01L33/00
CPC分类号： H01L33/20
摘要： A light-emitting diode (LED) chip having a micro-lens structure includes a light-emitting structure and a light guide lens. The light-emitting structure emits a light from a light-emitting surface upon being applied with a current, and the light guide lens is stacked on the light-emitting surface and used for emitting the light from a light guide surface of the light guide lens. The light guide surface has an annular ridge portion and a scatter region, such that the lights close to the central optical axis of the light-emitting surface (the region having the maximum light-emitting intensity) are deflected in a direction away from the central optical axis, and the lights far away from the central optical axis are deflected towards the central optical axis, so as to obtain a light with a uniform overall optical intensity.
摘要翻译：具有微透镜结构的发光二极管（LED）芯片包括发光结构和导光透镜。发光结构在施加电流时从发光面发出光，导光透镜被堆叠在发光面上，用于从导光透镜的导光面发射光。导光面具有环状的脊部和散射区域，使得靠近发光面的中心光轴（具有最大发光强度的区域）的光沿远离中心的方向偏转并且远离中心光轴的光被偏转到中心光轴，以获得具有均匀的整体光强度的光。

3. 发明授权

US08178892B2 LED chip having micro-lens structure 有权
标题翻译： LED芯片具有微透镜结构
公开(公告)号：US08178892B2
公开(公告)日：2012-05-15
申请号：US11826469
申请日：2007-07-16
申请人： Tien-Fu Huang , Shih-Hao Hua , Kuo-Chang Hu , Che-wei Su
发明人： Tien-Fu Huang , Shih-Hao Hua , Kuo-Chang Hu , Che-wei Su
IPC分类号： H01L33/62
CPC分类号： H01L33/20
摘要： A light-emitting diode (LED) chip having a micro-lens structure includes a light-emitting structure and a light guide lens. The light-emitting structure emits a light from a light-emitting surface upon being applied with a current, and the light guide lens is stacked on the light-emitting surface and used for emitting the light from a light guide surface of the light guide lens. The light guide surface has an annular ridge portion and a scatter region, such that the lights close to the central optical axis of the light-emitting surface (the region having the maximum light-emitting intensity) are deflected in a direction away from the central optical axis, and the lights far away from the central optical axis are deflected towards the central optical axis, so as to obtain a light with a uniform overall optical intensity.
摘要翻译：具有微透镜结构的发光二极管（LED）芯片包括发光结构和导光透镜。发光结构在施加电流时从发光面发出光，导光透镜被堆叠在发光面上，用于从导光透镜的导光面发射光。导光面具有环状的脊部和散射区域，使得靠近发光面的中心光轴（具有最大发光强度的区域）的光沿远离中心的方向偏转并且远离中心光轴的光被偏转到中心光轴，以获得具有均匀的整体光强度的光。

4. 发明授权

US07427148B1 Light modules 有权
标题翻译：灯组件
公开(公告)号：US07427148B1
公开(公告)日：2008-09-23
申请号：US11747767
申请日：2007-05-11
申请人： Tien-Fu Huang , Chin-Yin Yu , Kuo-Chang Hu , Shyh-Rong Tzan , Shih-Hao Hua
发明人： Tien-Fu Huang , Chin-Yin Yu , Kuo-Chang Hu , Shyh-Rong Tzan , Shih-Hao Hua
IPC分类号： F21V29/00
CPC分类号： F21V29/71 , F21K9/00 , F21V19/004 , F21V29/70 , F21V29/83 , F21Y2105/10 , F21Y2115/10 , H05K1/0204 , H05K3/0061 , H05K2201/0382 , H05K2201/10106
摘要： Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole communicating a first side and a second side thereof. The lighting element is disposed on the first side of the circuit board and located corresponding to the through hole. The first thermal plate is disposed on the second side of the circuit board, opposite to the first side, and comprises a first protrusion extending through the through hole and connecting the lighting element.
摘要翻译：提供灯模块。光模块包括电路板，电连接到电路板的照明元件和第一热敏板。电路板具有连通第一侧和第二侧的通孔。照明元件设置在电路板的第一侧上并且对应于通孔定位。第一热板设置在电路板的与第一侧相对的第二侧上，并且包括延伸穿过通孔并连接照明元件的第一突起。

5. 发明申请

US20080225533A1 LIGHT MODULES 有权
标题翻译：光模块
公开(公告)号：US20080225533A1
公开(公告)日：2008-09-18
申请号：US11747767
申请日：2007-05-11
申请人： Tien-Fu Huang , Chin-Yin Yu , Kuo-Chang Hu , Shyh-Rong Tzan , Shih-Hao Hua
发明人： Tien-Fu Huang , Chin-Yin Yu , Kuo-Chang Hu , Shyh-Rong Tzan , Shih-Hao Hua
IPC分类号： F21V29/00
CPC分类号： F21V29/71 , F21K9/00 , F21V19/004 , F21V29/70 , F21V29/83 , F21Y2105/10 , F21Y2115/10 , H05K1/0204 , H05K3/0061 , H05K2201/0382 , H05K2201/10106
摘要： Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole communicating a first side and a second side thereof. The lighting element is disposed on the first side of the circuit board and located corresponding to the through hole. The first thermal plate is disposed on the second side of the circuit board, opposite to the first side, and comprises a first protrusion extending through the through hole and connecting the lighting element.
摘要翻译：提供灯模块。光模块包括电路板，电连接到电路板的照明元件和第一热敏板。电路板具有连通第一侧和第二侧的通孔。照明元件设置在电路板的第一侧上并且对应于通孔定位。第一热板设置在电路板的与第一侧相对的第二侧上，并且包括延伸穿过通孔并连接照明元件的第一突起。

6. 发明申请

US20060138437A1 Lens and LED using the lens to achieve homogeneous illumination 有权
公开(公告)号：US20060138437A1
公开(公告)日：2006-06-29
申请号：US11196254
申请日：2005-08-04
申请人： Tien-Fu Huang , Che-Wei Su , Kuo-Chang Hu
发明人： Tien-Fu Huang , Che-Wei Su , Kuo-Chang Hu
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , G02B3/04 , G02B3/08 , G02B19/0009 , G02B19/0014 , G02B19/0061 , G02B27/0955 , G02F1/133603 , G02F1/133606 , G02F2001/133607 , H01L33/58
摘要： A lens and an LED using the lens to achieve homogeneous illumination include a region. The region around the optical axis of a lens is designed to be concave and form a divergent surface. The upper surface of the lens is a continuous curved surface to diverge the high-intensity light emitted by the LED in the vicinity of the optical axis through refractions. Therefore, the LED can homogeneously illuminate a larger area.

7. 发明申请

US20080079019A1 LIGHT EMITTING DIODE PACKAGE STRUCTURE 有权
标题翻译：发光二极管封装结构
公开(公告)号：US20080079019A1
公开(公告)日：2008-04-03
申请号：US11672844
申请日：2007-02-08
申请人： Tien-Fu Huang , Chin-Yin Yu , Kuo-Chang Hu , Shyh-Rong Tzan , Shi-How Hua
发明人： Tien-Fu Huang , Chin-Yin Yu , Kuo-Chang Hu , Shyh-Rong Tzan , Shi-How Hua
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/54 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/48247 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting diode (LED) package structure is disclosed. The LED package structure comprises a lead frame which has a chip carrier part, a pair of extended parts, a first electrode and a second electrode. The chip carrier part has an arc frame, a bulge, a first surface and a second surface. The extended part has a first side, a second side, a first top and a first bottom. The first side connects the arc frame of the chip carrier part. The arc frame electrically connects the first electrode. A heat dissipating material is placed on the second surface.
摘要翻译：公开了一种发光二极管（LED）封装结构。 LED封装结构包括具有芯片载体部分，一对延伸部分，第一电极和第二电极的引线框架。芯片载体部分具有弧形框架，凸起，第一表面和第二表面。延伸部具有第一侧，第二侧，第一顶部和第一底部。第一面连接芯片载体部分的弧形框架。电弧框架电连接第一电极。散热材料放置在第二表面上。

8. 发明授权

US07582913B2 Lens and LED using the lens to achieve homogeneous illumination 有权
标题翻译：透镜和LED使用透镜实现均匀照明
公开(公告)号：US07582913B2
公开(公告)日：2009-09-01
申请号：US11196254
申请日：2005-08-04
申请人： Tien-Fu Huang , Che-Wei Su , Kuo-Chang Hu
发明人： Tien-Fu Huang , Che-Wei Su , Kuo-Chang Hu
IPC分类号： H01L29/06
CPC分类号： H01L33/54 , G02B3/04 , G02B3/08 , G02B19/0009 , G02B19/0014 , G02B19/0061 , G02B27/0955 , G02F1/133603 , G02F1/133606 , G02F2001/133607 , H01L33/58
摘要： A lens and an LED using the lens to achieve homogeneous illumination include a region. The region around the optical axis of a lens is designed to be concave and form a divergent surface. The upper surface of the lens is a continuous curved surface to diverge the high-intensity light emitted by the LED in the vicinity of the optical axis through refractions. Therefore, the LED can homogeneously illuminate a larger area.
摘要翻译：使用透镜实现均匀照明的透镜和LED包括区域。透镜的光轴周围的区域设计为凹形并形成发散表面。透镜的上表面是连续的弯曲表面，以通过折射使由LED发射的高强度光在光轴附近发散。因此，LED可以均匀地照射更大的面积。

9. 发明授权

US07528414B2 Light emitting diode package structure 有权
标题翻译：发光二极管封装结构
公开(公告)号：US07528414B2
公开(公告)日：2009-05-05
申请号：US11672844
申请日：2007-02-08
申请人： Tien-Fu Huang , Chin-Yin Yu , Kuo-Chang Hu , Shyh-Rong Tzan , Shi-How Hua
发明人： Tien-Fu Huang , Chin-Yin Yu , Kuo-Chang Hu , Shyh-Rong Tzan , Shi-How Hua
IPC分类号： H01L31/0224
CPC分类号： H01L33/483 , H01L33/54 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/48247 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting diode (LED) package structure is disclosed. The LED package structure comprises a lead frame which has a chip carrier part, a pair of extended parts, a first electrode and a second electrode. The chip carrier part has an arc frame, a bulge, a first surface and a second surface. The extended part has a first side, a second side, a first top and a first bottom. The first side connects the arc frame of the chip carrier part. The arc frame electrically connects the first electrode. A heat dissipating material is placed on the second surface.
摘要翻译：公开了一种发光二极管（LED）封装结构。 LED封装结构包括具有芯片载体部分，一对延伸部分，第一电极和第二电极的引线框架。芯片载体部分具有弧形框架，凸起，第一表面和第二表面。延伸部具有第一侧，第二侧，第一顶部和第一底部。第一面连接芯片载体部分的弧形框架。电弧框架电连接第一电极。散热材料放置在第二表面上。

10. 发明申请

US20080135993A1 Lead frame of through-hole light emitting diode 审中-公开
标题翻译：通孔发光二极管的引线框架
公开(公告)号：US20080135993A1
公开(公告)日：2008-06-12
申请号：US11716457
申请日：2007-03-09
申请人： Tien-Fu Huang , Shyh-Rong Tzan , Chin-Yin Yu , Kuo-Chang Hu
发明人： Tien-Fu Huang , Shyh-Rong Tzan , Chin-Yin Yu , Kuo-Chang Hu
IPC分类号： H01L23/495
CPC分类号： H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A lead frame of a through-hole light emitting diode (LED) is used to carry an LED chip, and a lens is used to package the chip and a portion of the lead frame. The lead frame includes at least two leads. One lead is used to carry the chip and each of the leads is extended outward from the lens and has a positioning bump. The positioning bumps partially protrude from the lens, such that when the lead frame is disposed on a circuit board, the lead frame is positioned through the positioning bumps and aligns the lens to guide an optical axis of the through-hole LED, thereby achieving the purposes of convenient assembly, thinness, and a reduced thermal-conducting distance.
摘要翻译：通孔发光二极管（LED）的引线框架用于承载LED芯片，并且使用透镜来封装芯片和引线框架的一部分。引线框架包括至少两个引线。一个引线用于承载芯片，并且每个引线从透镜向外延伸并具有定位凸块。定位凸起部分地从透镜突出，使得当引线框架设置在电路板上时，引线框架通过定位凸块定位，并对准透镜以引导通孔LED的光轴，从而实现目的是组装方便，薄度小，导热距离降低。

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