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    • 9. 发明授权
    • Housing for a portable electronic device
    • 便携式电子设备的外壳
    • US09119307B2
    • 2015-08-25
    • US13621865
    • 2012-09-18
    • Ticona LLC
    • Rong LuoXinyu ZhaoKe Feng
    • C08K3/34H05K5/03C08K5/372C08G75/02C08K7/02
    • H05K5/03C08G75/029C08K5/372C08K7/02C08L81/02
    • An injection molded housing for a portable electronic device is provided. The housing contains a thermoplastic composition that includes a polyarylene sulfide melt processed in the presence of a disulfide compound and a filler. Without intending to be limited by theory, it is believed that the disulfide can undergo a chain scission reaction with the starting polyarylene sulfide to lower its melt viscosity, which can lead to decreased attrition of the filler and thus improved mechanical properties. Due to this ability to reduce viscosity during melt processing, the present inventors have discovered that relatively high molecular weight polyarylene sulfides can be fed to the extruder with little difficulty.
    • 提供了一种用于便携式电子设备的注塑外壳。 壳体包含热塑性组合物,其包含在二硫化物化合物和填料的存在下加工的聚芳硫醚熔体。 不期望受理论的限制,相信二硫化物可以与起始聚芳硫醚发生断链反应以降低其熔体粘度,这可导致填料的磨损减少,从而改善机械性能。 由于这种在熔融加工过程中降低粘度的能力,本发明人已经发现,相对高分子量的聚亚芳基硫化物可以很少地进料到挤出机中。