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1. 发明申请

US20170314995A1 METHOD TO MODULATE THE SENSITIVITY OF A BOLOMETER VIA NEGATIVE INTERFERENCE 有权
公开(公告)号：US20170314995A1
公开(公告)日：2017-11-02
申请号：US15516821
申请日：2015-10-09
申请人： Thomas ROCZNIK , Fabian PURKL , Gary O'BRIEN , Ando FEYH , Bongsang KIM , Ashwin SAMARAO , Gary YAMA , Robert Bosch GmbH
发明人： Thomas Rocznik , Fabian Purkl , Gary O'Brien , Ando Feyh , Bongsang Kim , Ashwin Samarao , Gary Yama
IPC分类号： G01J5/06 , G01J5/08 , G01J5/24
CPC分类号： G01J5/06 , G01J5/0809 , G01J5/0853 , G01J5/20 , G01J5/24 , G01J2005/066 , G01J2005/067
摘要： A semiconductor sensor system, in particular a bolometer, includes a substrate, an electrode supported by the substrate, an absorber spaced apart from the substrate, a voltage source, and a current source. The electrode can include a mirror, or the system may include a mirror separate from the electrode. Radiation absorption efficiency of the absorber is based on a minimum gap distance between the absorber and mirror. The current source applies a DC current across the absorber structure to produce a signal indicative of radiation absorbed by the absorber structure. The voltage source powers the electrode to produce a modulated electrostatic field acting on the absorber to modulate the minimum gap distance. The electrostatic field includes a DC component to adjust the absorption efficiency, and an AC component that cyclically drives the absorber to negatively interfere with noise in the signal.

2. 发明申请

US20170367172A1 Modular Deformable Platform 审中-公开
公开(公告)号：US20170367172A1
公开(公告)日：2017-12-21
申请号：US15535293
申请日：2015-12-14
申请人： Seow Yuen YEE , Gary YAMA , Bongsang KIM , Ashwin SAMARAO , Robert Bosch GmbH
发明人： Seow Yuen Yee , Gary Yama , Bongsang Kim , Ashwin Samarao
IPC分类号： H05K1/02 , A61B5/11 , A61B5/00 , A61B5/01 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/28 , H05K3/30 , H05K1/03 , H05K1/11 , H05K3/12
CPC分类号： H05K1/028 , A61B5/0022 , A61B5/01 , A61B5/11 , A61B5/4519 , A61B5/4528 , A61B5/4542 , A61B5/6833 , A61B2560/0242 , A61B2560/0412 , A61B2562/0204 , A61B2562/0247 , A61B2562/0271 , A61B2562/028 , A61B2562/029 , A61B2562/066 , A61B2562/12 , A61B2562/164 , H01L2924/0002 , H05K1/0278 , H05K1/0281 , H05K1/0393 , H05K1/118 , H05K1/148 , H05K1/189 , H05K3/005 , H05K3/0052 , H05K3/0058 , H05K3/0097 , H05K3/1216 , H05K3/281 , H05K3/285 , H05K3/30 , H05K2201/053 , H05K2201/09063 , H05K2201/10037 , H05K2201/10121 , H05K2201/10151 , H05K2203/1453 , H05K2203/1545 , H01L2924/0001
摘要： A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.

3. 发明授权

US10317211B2 Robust inertial sensors 有权
公开(公告)号：US10317211B2
公开(公告)日：2019-06-11
申请号：US15108414
申请日：2014-12-30
申请人： Robert Bosch GmbH , Bongsang Kim , Ando Feyh , Andrew Graham , Gary O'Brien , Michael Baus , Ralf Maier , Mariusz Koc
发明人： Bongsang Kim , Ando Feyh , Andrew Graham , Gary O'Brien , Michael Baus , Ralf Maier , Mariusz Koc
IPC分类号： G01P1/02 , G01C19/5769 , G01P15/08 , G01D5/241 , G01P1/00 , G01P15/18
摘要： In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.

4. 发明授权

US10060888B2 MEMS gas chromatograph and method of forming a separator column for a MEMS gas chromatograph 有权
公开(公告)号：US10060888B2
公开(公告)日：2018-08-28
申请号：US15535522
申请日：2015-12-16
申请人： ROBERT BOSCH GMBH , Ando Feyh , Gary O'Brien , Bongsang Kim , Jochen Stehle
发明人： Ando Feyh , Gary O'Brien , Bongsang Kim , Jochen Stehle
IPC分类号： G01N30/60 , G01N30/02 , B81C1/00 , B81B1/00
CPC分类号： G01N30/6095 , B81B1/002 , B81C1/00119 , G01N30/60 , G01N2030/025
摘要： A micro gas chromatograph includes one or more separator columns formed within a device layer. The separator columns have small channel cross sections and long channel lengths with atomic-smooth channel sidewalls enabling a high channel packaging density, multiple channels positioned on top of each other, and channel segments that are thermally decoupled from the substrates. The micro gas-chromatograph also enables electrostatic and thermal actuators to be positioned in close proximity to the separator columns such that the material passing through the columns is one or more of locally heated, locally cooled, and electrically biased.

5. 发明申请

US20170363588A1 A MEMS Gas Chromatograph and Method of Forming a Separator Column for a MEMS Gas Chromatograph 审中-公开
公开(公告)号：US20170363588A1
公开(公告)日：2017-12-21
申请号：US15535522
申请日：2015-12-16
申请人： Ando FEYN , Gary O'BRIEN , Bongsang KIM , Jochen STEHLE , Robert Bosch GmbH
发明人： Ando Feyh , Gary O'Brien , Bongsang Kim , Jochen Stehle
IPC分类号： G01N30/60 , B81B1/00 , B81C1/00 , G01N30/02
CPC分类号： G01N30/6095 , B81B1/002 , B81B7/00 , B81C1/00 , B81C1/00023 , B81C1/00119 , G01N30/60 , G01N2030/025
摘要： A micro gas chromatograph includes one or more separator columns formed within a device layer. The separator columns have small channel cross sections and long channel lengths with atomic-smooth channel sidewalls enabling a high channel packaging density, multiple channels positioned on top of each other, and channel segments that are thermally decoupled from the substrates. The micro gas-chromatograph also enables electrostatic and thermal actuators to be positioned in close proximity to the separator columns such that the material passing through the columns is one or more of locally heated, locally cooled, and electrically biased.

6. 发明授权

US08669823B1 Ovenized microelectromechanical system (MEMS) resonator 有权
标题翻译：烤箱微机电系统（MEMS）谐振器
公开(公告)号：US08669823B1
公开(公告)日：2014-03-11
申请号：US13442689
申请日：2012-04-09
申请人： Roy H. Olsson , Kenneth Wojciechowski , Bongsang Kim
发明人： Roy H. Olsson , Kenneth Wojciechowski , Bongsang Kim
IPC分类号： H03B5/30
CPC分类号： H03B5/30 , H03H9/02062 , H03H9/02102 , H03H9/173
摘要： An ovenized micro-electro-mechanical system (MEMS) resonator including: a substantially thermally isolated mechanical resonator cavity; a mechanical oscillator coupled to the mechanical resonator cavity; and a heating element formed on the mechanical resonator cavity.
摘要翻译：一种加热微电子机械系统（MEMS）谐振器，包括：基本上热隔离的机械谐振腔; 耦合到所述机械谐振腔的机械振荡器; 以及形成在所述机械谐振腔上的加热元件。

7. 发明授权

US07824098B2 Composite mechanical transducers and approaches therefor 有权
标题翻译：复合机械传感器及其方法
公开(公告)号：US07824098B2
公开(公告)日：2010-11-02
申请号：US12017228
申请日：2008-01-21
申请人： Renata Melamud , Bongsang Kim , Matthew Hopcroft , Saurabh Chandorkar , Manu Agarwal , Thomas W. Kenny
发明人： Renata Melamud , Bongsang Kim , Matthew Hopcroft , Saurabh Chandorkar , Manu Agarwal , Thomas W. Kenny
IPC分类号： G01P15/08 , G01R3/00 , G01K11/22
CPC分类号： G01L9/0022 , G01L19/04 , H03H9/02338 , H03H9/2473 , Y10T29/49007
摘要： Mechanical transducers such as pressure sensors, resonators or other frequency-reference devices are implemented under conditions characterized by different temperatures. According to an example embodiment of the present invention, a combination of materials is implemented for mechanical transducer applications to mitigate temperature-related changes at or near a selected turnover temperature. In one application, a material property mismatch is used to facilitate single-anchor transducer applications, such as for resonators. Another application is directed to a Silicon-Silicon dioxide combination of materials.
摘要翻译：诸如压力传感器，谐振器或其他频率参考装置之类的机械传感器在不同温度的特征的条件下实现。根据本发明的示例性实施例，为机械传感器应用实施材料的组合以减轻或接近所选周转温度的温度相关变化。在一个应用中，材料性质失配用于促进单锚传感器应用，例如用于谐振器。另一种应用是针对硅 - 二氧化硅的材料组合。

8. 发明申请

US20070277620A1 Composite mechanical transducers and approaches therefor 有权
标题翻译：复合机械传感器及其方法
公开(公告)号：US20070277620A1
公开(公告)日：2007-12-06
申请号：US11446568
申请日：2006-06-02
申请人： Renata Melamud , Bongsang Kim , Matt Hopcroft , Saurabh Chandorkar , Manu Agarwal , Thomas W. Kenny
发明人： Renata Melamud , Bongsang Kim , Matt Hopcroft , Saurabh Chandorkar , Manu Agarwal , Thomas W. Kenny
IPC分类号： G01L1/00
CPC分类号： G01L9/0022 , G01L19/04 , H03H9/2473
摘要： Mechanical transducers such as pressure sensors, resonators or other frequency-reference devices are implemented under conditions characterized by different temperatures. According to an example embodiment of the present invention, a combination of materials is implemented for mechanical transducer applications to mitigate temperature-related changes. In one application, a material property mismatch is used to facilitate single-anchor transducer applications, such as for resonators. Another application is directed to a Silicon-Silicon dioxide combination of materials.
摘要翻译：诸如压力传感器，谐振器或其他频率参考装置之类的机械传感器在不同温度的特征的条件下实现。根据本发明的示例性实施例，为机械传感器应用实现材料的组合以减轻温度相关的变化。在一个应用中，材料性质失配用于促进单锚传感器应用，例如用于谐振器。另一种应用是针对硅 - 二氧化硅的材料组合。

9. 发明授权

US07806586B2 Composite mechanical transducers and approaches therefor 有权
标题翻译：复合机械传感器及其方法
公开(公告)号：US07806586B2
公开(公告)日：2010-10-05
申请号：US11446568
申请日：2006-06-02
申请人： Renata Melamud , Bongsang Kim , Matt Hopcroft , Saurabh Chandorkar , Manu Agarwal , Thomas W. Kenny
发明人： Renata Melamud , Bongsang Kim , Matt Hopcroft , Saurabh Chandorkar , Manu Agarwal , Thomas W. Kenny
IPC分类号： G01K11/22
CPC分类号： G01L9/0022 , G01L19/04 , H03H9/2473
摘要： Mechanical transducers such as pressure sensors, resonators or other frequency-reference devices are implemented under conditions characterized by different temperatures. According to an example embodiment of the present invention, a combination of materials is implemented for mechanical transducer applications to mitigate temperature-related changes. In one application, a material property mismatch is used to facilitate single-anchor transducer applications, such as for resonators. Another application is directed to a Silicon-Silicon dioxide combination of materials.
摘要翻译：诸如压力传感器，谐振器或其他频率参考装置之类的机械传感器在不同温度的特征的条件下实现。根据本发明的示例性实施例，为机械传感器应用实现材料的组合以减轻温度相关的变化。在一个应用中，材料性质失配用于促进单锚传感器应用，例如用于谐振器。另一种应用是针对硅 - 二氧化硅的材料组合。

10. 发明申请

US20110067984A1 MICROELECTROMECHANICAL SYSTEM (MEMS) RESONANT SWITCHES AND APPLICATIONS FOR POWER CONVERTERS AND AMPLIFIERS 有权
标题翻译：微电子机电系统（MEMS）谐振开关和功率转换器和放大器的应用
公开(公告)号：US20110067984A1
公开(公告)日：2011-03-24
申请号：US12878237
申请日：2010-09-09
申请人： Clark Tu-Cuong Nguyen , Yang Lin , Wei-Chang Li , Bongsang Kim
发明人： Clark Tu-Cuong Nguyen , Yang Lin , Wei-Chang Li , Bongsang Kim
IPC分类号： H01H57/00
CPC分类号： H01P1/127 , H01H1/0036 , H01H50/005
摘要： A modally driven oscillating element periodically contacts one of more electrical contacts, thereby acting as a switch, otherwise known as a resonant switch, or “resoswitch”, with very high Q's, typically above 10000 in air, and higher in vacuum. Due to periodic constrained contacting of the contacts, the bandwidth of the switch is greatly improved. One or more oscillating elements may be vibrationally interconnected with conductive or nonconductive coupling elements, whereby increased bandwidths of such an overall switching system may be achieved. Using the resoswitch, power amplifiers and converters more closely approaching ideal may be implemented. Integrated circuit fabrication techniques may construct the resoswitch with other integrated CMOS elements for highly compact switching devices. Through introduction of specific geometries within the oscillating elements, displacement gains may be made where modal deflections are greatly increased, thereby reducing device drive voltages to 2.5 V or lower.
摘要翻译：模态驱动的振荡元件周期性地接触一个更多的电触点，从而充当开关，或称为谐振开关或“再开关”，具有非常高的Q值，通常在空气中高于10000，而在真空中更高。由于触点的周期性约束接触，开关的带宽大大提高。一个或多个振荡元件可以与导电或非导电耦合元件振动地互连，由此可以实现这种整体开关系统的增加的带宽。可以实现使用resoswitch，功率放大器和更接近理想的转换器。集成电路制造技术可以使用其他集成CMOS元件构建重新开关，用于高度紧凑的开关器件。通过在振荡元件中引入特定的几何形状，可以在模态偏转大大增加的情况下进行位移增益，从而将器件驱动电压降低到2.5V或更低。

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