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1. 发明授权

US5773198A Method of forming high resolution circuitry by depositing a polyvinyl alcohol layer beneath a photosensitive polymer layer 失效
标题翻译：通过在感光聚合物层下沉积聚乙烯醇层形成高分辨率电路的方法
公开(公告)号：US5773198A
公开(公告)日：1998-06-30
申请号：US660384
申请日：1996-06-07
申请人： Thomas J. Swirbel , Anthony B. Suppelsa , Joaquin Barreto
发明人： Thomas J. Swirbel , Anthony B. Suppelsa , Joaquin Barreto
IPC分类号： G03F7/09 , H05K3/10 , G03C5/56
CPC分类号： H05K3/108 , G03F7/092 , H05K2203/0577 , H05K2203/0789 , Y10S438/95 , Y10S438/951
摘要： A method of forming a high resolution metal pattern on a substrate. A temporary polyvinyl alcohol (10) layer underneath the photoresist layer (20) aids in removing the photoresist layer after plating. The photoresist is photodelineated in conventional manner to form a pattern (40). During photodelineation, the developing process for the resist does not completely remove the PVA (45) that lies directly under the removed resist, but instead reveals those portions of the polyvinyl alcohol layer. The substrate is then rinsed in a hot aqueous solution to effect removal of the revealed PVA portions, now exposing portions (40) of the substrate (15). Metal (50) is then electroplated to build up a metal circuitry pattern. The remaining portions of the photoresist and the PVA are then removed by a hot aqueous solution.
摘要翻译：在基板上形成高分辨率金属图案的方法。在光致抗蚀剂层（20）下面的临时聚乙烯醇（10）层有助于在电镀后去除光致抗蚀剂层。光致抗蚀剂以常规方式光线照射以形成图案（40）。在光线照射期间，抗蚀剂的显影过程不能完全去除位于去除的抗蚀剂正下方的PVA（45），而是透露聚乙烯醇层的那些部分。然后将衬底在热水溶液中漂洗以实现所揭露的PVA部分的去除，现在暴露衬底（15）的部分（40）。然后电镀金属（50）以建立金属电路图案。然后通过热水溶液除去光致抗蚀剂和PVA的剩余部分。

2. 发明授权

US06990734B2 Methods for shielding one or more circuit of a printed circuit board 有权
标题翻译：屏蔽印刷电路板的一个或多个电路的方法
公开(公告)号：US06990734B2
公开(公告)日：2006-01-31
申请号：US10263006
申请日：2002-10-02
申请人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
发明人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
IPC分类号： H05K3/34
CPC分类号： H05K1/0218 , H01L2223/6622 , H05K1/0221 , H05K1/0222 , H05K1/113 , H05K3/4644 , H05K9/0039 , H05K2201/0715 , H05K2201/09036 , H05K2201/09509 , H05K2201/09809 , H05K2201/09972 , H05K2201/09981 , H05K2201/10553 , H05K2201/10969 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156
摘要： Methods for forming a metal shield on a printed circuit board (10) include depositing a first layer of metal (41) on a substrate (22) of the printed circuit board (10), depositing a first layer of dielectric material (42) on the first layer of metal (41), printing one or more circuits (21, 21′) on the first dielectric layer (42), depositing a second layer of dielectric material (43) over the one or more printed circuits (21, 21′), forming a trench-like opening (44) in the two layers of dielectric material (42, 43) surrounding the one or more printed circuits (21, 21′) so that the metal of the first layer (41) is exposed by the trench-like opening (44), depositing a second layer of metal (27) on the second layer of dielectric material (43) such that the second layer of metal (27) plates the trench-like opening (44) and makes electrical contact with the first metal layer (41).
摘要翻译：在印刷电路板（10）上形成金属屏蔽的方法包括在印刷电路板（10）的基板（22）上沉积第一金属层（41），将第一层介电材料（42）沉积在所述第一金属层（41），在所述第一介电层（42）上印刷一个或多个电路（21,21'），在所述一个或多个印刷电路（21,21）上沉积第二介电材料层 '），在围绕所述一个或多个印刷电路（21,21'）的两层介电材料（42,43）中形成沟槽状开口（44），使得第一层（41）的金属暴露通过所述沟槽状开口（44），在所述第二介电材料层（43）上沉积第二金属层（27），使得所述第二金属层（27）平坦化所述沟槽状开口（44）并使与第一金属层（41）电接触。

3. 发明授权

US5576052A Method of metallizing high aspect ratio apertures 失效
标题翻译：金属化高纵横比孔径的方法
公开(公告)号：US5576052A
公开(公告)日：1996-11-19
申请号：US635822
申请日：1996-04-22
申请人： John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
发明人： John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
IPC分类号： C23C18/16 , C23C28/02 , H05K3/40 , H05K3/42 , B05D5/12
CPC分类号： H05K3/4076 , C23C18/165 , C23C18/405 , C23C28/023 , H05K3/422 , C23C18/1603 , C23C18/1653 , C23C18/1689 , H05K3/427
摘要： A method of manufacturing high aspect ratio plated through holes in a circuit carrying substrate. High aspect ratio apertures or holes (16) are formed in a substrate (10). A thin film of copper (20) is sputtered onto the substrate and in the apertures that a macroscopically discontinuous copper film (26) is formed on part of the aperture walls. The macroscopically discontinuous copper film is substantially thinner than the copper film that is deposited on the surface. A catalytic copper coating (30) is plated directly on the vacuum deposited thin film of copper by electroless copper plating in a manner sufficient to form a macroscopically continuous copper layer on the aperture walls.
摘要翻译：一种在电路承载衬底中制造高纵横比电镀通孔的方法。在衬底（10）中形成高纵横比孔或孔（16）。将铜（20）的薄膜溅射到基板上和孔中，在孔壁的一部分上形成宏观不连续的铜膜（26）。宏观不连续的铜膜比沉积在表面上的铜膜薄得多。催化铜涂层（30）通过化学镀铜直接镀在真空沉积的铜薄膜上，以足以在孔壁上形成宏观连续的铜层。

4. 发明授权

US06653915B1 Coaxial transmission lines having grounding troughs on a printed circuit board 有权
标题翻译：同轴传输线在印刷电路板上具有接地槽
公开(公告)号：US06653915B1
公开(公告)日：2003-11-25
申请号：US09378351
申请日：1999-08-20
申请人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
发明人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
IPC分类号： H01P308
CPC分类号： H05K1/0221 , H01P11/005 , H05K3/0023 , H05K3/4644 , H05K2201/09036 , H05K2201/09809 , H05K2201/09981 , Y10T29/49016 , Y10T29/49117
摘要： A method of forming a coaxial transmission line on a high density PCB. A metal layer (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal deposit (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.
摘要翻译：一种在高密度PCB上形成同轴传输线的方法。 PCB（104）上的金属层（102）形成屏蔽的底部并被第一电介质（112）覆盖。在第一电介质中形成两个平行的沟槽（122），以露出金属条的部分（123）。信号导体（132）然后形成在第一电介质上。第二电介质（142）覆盖信号导体和第一电介质。第二组两个平行的沟槽（172）形成在紧邻第一两个沟槽上方的第二电介质中。金属沉积物（182）被电镀在平行的沟槽中以接触金属条，并且还覆盖位于沟槽之间的第二电介质的一部分以形成屏蔽。所得到的同轴传输线具有通过电介质与屏蔽层绝缘的中心导体。

5. 发明授权

US06388202B1 Multi layer printed circuit board 失效
标题翻译：多层印刷电路板
公开(公告)号：US06388202B1
公开(公告)日：2002-05-14
申请号：US08944192
申请日：1997-10-06
申请人： Thomas J. Swirbel , John K. Arledge , Joaquin Barreto
发明人： Thomas J. Swirbel , John K. Arledge , Joaquin Barreto
IPC分类号： H01R909
CPC分类号： H05K3/4644 , H05K3/0023 , H05K3/0035 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K3/4688 , H05K2201/0358
摘要： A high density multi-layer printed circuit board (100) is formed by building additional dielectric and metallization layers over a central core (110) of conventional PCB laminate construction. The central core has a metallization pattern (113, 114) on at least one surface. A photoimaged dielectric layer (130) is deposited on one side of the central core and overlies the metallization pattern. Vias (136) are formed in this dielectric layer by a photoimaging process, and an additional metallization pattern (133) on this layer is electrically connected to the underlying metallization pattern through these vias. A non-photoimageable dielectric layer (120) is deposited on the other side of the central core. Vias (126) are formed in this dielectric layer by a laser drilling process, and an additional metallization pattern (123) on this layer is electrically connected to an underlying metallization pattern through these laser drilled vias.
摘要翻译：通过在常规PCB叠层结构的中心芯（110）上建立附加的电介质和金属化层来形成高密度多层印刷电路板（100）。中心芯在至少一个表面上具有金属化图案（113,114）。光电介质层（130）沉积在中心芯的一侧上并覆盖金属化图案。通过光成像工艺在该电介质层中形成通孔（136），并且通过这些通孔将该层上的附加金属化图案（133）电连接到下面的金属化图案。不可光成像的介电层（120）沉积在中心芯的另一侧上。通过激光钻孔工艺在该电介质层中形成通孔（126），并且在该层上的另外的金属化图案（123）通过这些激光钻孔通孔电连接到下面的金属化图案。

6. 发明授权

US6000120A Method of making coaxial transmission lines on a printed circuit board 失效
标题翻译：在印刷电路板上制造同轴传输线的方法
公开(公告)号：US6000120A
公开(公告)日：1999-12-14
申请号：US61112
申请日：1998-04-16
申请人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
发明人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
IPC分类号： H01P11/00 , H05K1/02 , H05K3/00 , H05K3/46
CPC分类号： H05K1/0221 , H01P11/005 , H05K2201/09036 , H05K2201/09809 , H05K2201/09981 , H05K3/0023 , H05K3/4644 , Y10T29/49016 , Y10T29/49117
摘要： A method of forming a coaxial transmission line on a high density PCB. A metal strip (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.
摘要翻译：一种在高密度PCB上形成同轴传输线的方法。 PCB（104）上的金属条（102）形成屏蔽的底部，并被第一电介质（112）覆盖。在第一电介质中形成两个平行的沟槽（122），以露出金属条的部分（123）。信号导体（132）然后形成在第一电介质上。第二电介质（142）覆盖信号导体和第一电介质。第二组两个平行的沟槽（172）形成在紧邻第一两个沟槽上方的第二电介质中。金属（182）电镀在平行的沟槽中以接触金属条，并且还覆盖位于沟槽之间的第二电介质的一部分，以形成屏蔽。所得到的同轴传输线具有通过电介质与屏蔽层绝缘的中心导体。

7. 发明授权

US07132357B2 Method for shielding printed circuit board circuits 有权
公开(公告)号：US07132357B2
公开(公告)日：2006-11-07
申请号：US11238894
申请日：2005-09-29
申请人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
发明人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
IPC分类号： H01L21/44
CPC分类号： H05K1/0218 , H01L2223/6622 , H05K1/0221 , H05K1/0222 , H05K1/113 , H05K3/4644 , H05K9/0039 , H05K2201/0715 , H05K2201/09036 , H05K2201/09509 , H05K2201/09809 , H05K2201/09972 , H05K2201/09981 , H05K2201/10553 , H05K2201/10969 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156
摘要： A method for shielding one or more circuits (21, 21′) of a printed circuit board includes depositing a layer of dielectric material (43) over a printed circuit board substrate (22) and the printed circuits (21, 21′), creating a trench-like opening (44) in the dielectric layer (43) such that the trench-like opening (44) surrounds the one or more circuits (21, 21′) to be shielded, depositing a layer of metal (27) over the layer of dielectric material (43) and within the trench-like openings (44), creating a solder pad (24) at each location where an electrical connection is to be made to the printed circuits (21, 21′) by removing a border of the metal layer (27) surrounding each connection location, and providing a microvia (25) through each solder pad (24) penetrating the dielectric layer (43) and terminating at the metal of the printed circuit (21, 21′).

8. 发明授权

US06515222B2 Printed circuit board arrangement 有权
标题翻译：印刷电路板布置
公开(公告)号：US06515222B2
公开(公告)日：2003-02-04
申请号：US09775460
申请日：2001-02-05
申请人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
发明人： Jeffrey A. Underwood , John K. Arledge , Thomas J. Swirbel , Joaquin Barreto
IPC分类号： H05K900
CPC分类号： H05K1/0218 , H01L2223/6622 , H05K1/0221 , H05K1/0222 , H05K1/113 , H05K3/4644 , H05K9/0039 , H05K2201/0715 , H05K2201/09036 , H05K2201/09509 , H05K2201/09809 , H05K2201/09972 , H05K2201/09981 , H05K2201/10553 , H05K2201/10969 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156
摘要： Methods and apparatus for forming a metal shield on a printed circuit board (10) include a layer of dielectric material (23) one or more printed circuits (21) on the layer of dielectric material (23), a layer of metal (27) on the layer of dielectric material (23), a metal-clad trench or opening surrounding the printed circuit (44) and electrically connected to the layer of metal(27), a solder pad (24) on the layer of dielectric material (23), a microvia (25) through the solder pad (24) and the layer of dielectric material (23), and electrical components (11) soldered to the solder pads (24) and to the printed circuit (21).
摘要翻译：在印刷电路板（10）上形成金属屏蔽的方法和装置包括介电材料层（23），介电材料层（23）上的一个或多个印刷电路（21），金属层（27）在电介质材料层（23）上，围绕印刷电路（44）并电连接到金属层（27）的金属包覆沟槽或开口，介电材料层（23）上的焊盘（24）），通过焊盘（24）和电介质材料层（23）的微孔（25）以及焊接到焊盘（24）和印刷电路（21）的电气部件（11）。

9. 发明授权

US5695690A Color filter for a liquid crystal display 失效
标题翻译：彩色滤光片用于液晶显示
公开(公告)号：US5695690A
公开(公告)日：1997-12-09
申请号：US709887
申请日：1996-09-09
申请人： Thomas J. Swirbel , Patrick M. Dunn , Joaquin Barreto
发明人： Thomas J. Swirbel , Patrick M. Dunn , Joaquin Barreto
IPC分类号： G02F1/1333 , G02F1/1335 , F21V9/00
CPC分类号： G02F1/133516 , G02F1/133512 , G02F2001/133357
摘要： A color filter for a liquid crystal display is made by depositing a layer (22) of colored dye in a pattern on a transparent substrate (20). The pattern is in pixel format, covering most of the substrate surface and leaving portions (23) of the surface between the pixels uncovered. A layer of silver halide (25) covers both the colored dye pixels and the exposed portions of the substrate surface. The silver halide layer is treated by exposing it to light so that those portions of the silver halide layer that lie directly over the colored dye pattern become transparent and those portions of the silver halide layer that lie between the pixels become black, blocking any transmitted light.
摘要翻译：用于液晶显示器的滤色器是通过在透明基板（20）上以图案沉积着色染料层（22）而制成的。该图案是像素格式，覆盖基片表面的大部分并且留下未被覆盖的像素之间的表面的部分（23）。一层卤化银（25）覆盖着色染料像素和衬底表面的暴露部分。卤化银层通过将其曝光来处理，使得位于着色染料图案之上的卤化银层的那些部分变得透明，并且位于像素之间的卤化银层的部分变成黑色，阻挡任何透射光。

10. 发明授权

US5220489A Multicomponent integrated circuit package 失效
标题翻译：多组件集成电路封装
公开(公告)号：US5220489A
公开(公告)日：1993-06-15
申请号：US774921
申请日：1991-10-11
申请人： Joaquin Barreto , Juan O. Alfonso , Frank J. Juskey
发明人： Joaquin Barreto , Juan O. Alfonso , Frank J. Juskey
IPC分类号： H01L23/31 , H01L23/64 , H05K1/02
CPC分类号： H05K1/0231 , H01L23/3121 , H01L23/642 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/30107 , H05K2201/1053 , H05K2201/10689
摘要： An electronic package, comprising a circuit carrying substrate (30) and a semiconductor device (35). The substrate (30) has two opposing surfaces, the first or bottom surface having a plurality of solder pads (31) and the second or top surface having a circuitry pattern defined on it. A semiconductor device (35) is attached to the top surface of the circuit carrying substrate (30). A molded body (33) is formed completely around the semiconductor device (35) in order to encapsulate it, the molded body also substantially covering the top surface of the circuit carrying substrate (30). A layer of metal deposited directly on the molded body and the top surface of the circuit carrying substrate is delineated into another conductive circuitry pattern (38), with part of the pattern (36) connected to the circuitry pattern on the circuit carrying substrate. An electronic component (32) is mounted on the molded body (33) and electrically connected to the conductive circuitry pattern (38).
摘要翻译：一种电子封装，包括电路承载衬底（30）和半导体器件（35）。衬底（30）具有两个相对的表面，第一或下表面具有多个焊盘（31），并且第二或顶部表面具有限定在其上的电路图案。半导体器件（35）附接到电路承载衬底（30）的顶表面。模制体（33）完全围绕半导体器件（35）形成以封装，成型体也基本覆盖电路承载衬底（30）的顶表面。将直接沉积在成型体上的金属层和电路承载衬底的顶表面描绘成另一个导电电路图案（38），其中一部分图案（36）连接到电路承载衬底上的电路图案。电子部件（32）安装在成型体（33）上并电连接到导电电路图案（38）。

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