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    • 3. 发明授权
    • Self-releasing spring structures and methods
    • 自释弹簧结构及方法
    • US07456092B2
    • 2008-11-25
    • US10959180
    • 2004-10-07
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • H01L21/4763
    • G01R1/06716G01R3/00Y10T29/49609
    • According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
    • 根据各种示例性实施例,公开了一种弹簧装置,其包括基板,设置在基板上的自放电层和设置在自放电层上的应力金属层,其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外,根据各种示例性实施例的制造弹簧装置的方法包括提供衬底,在衬底上提供自释放层,并在自释放层上方提供应力金属层,其中, 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。
    • 5. 发明申请
    • Self-Releasing Spring Structures And Methods
    • 自我释放弹簧结构与方法
    • US20090077807A1
    • 2009-03-26
    • US12256060
    • 2008-10-22
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • B23P13/00
    • G01R1/06716G01R3/00Y10T29/49609
    • According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
    • 根据各种示例性实施例,公开了一种弹簧装置,其包括基板,设置在基板上的自放电层和设置在自放电层上的应力金属层,其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外,根据各种示例性实施例的制造弹簧装置的方法包括提供衬底,在衬底上提供自释放层,并在自释放层上方提供应力金属层,其中, 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。
    • 6. 发明授权
    • Self-releasing spring structures and methods
    • 自释弹簧结构及方法
    • US07943504B2
    • 2011-05-17
    • US12256060
    • 2008-10-22
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • Thomas HantschelSven KosgalwiesDavid K. ForkEugene M. Chow
    • H01L21/4763
    • G01R1/06716G01R3/00Y10T29/49609
    • According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
    • 根据各种示例性实施例,公开了一种弹簧装置,其包括基板,设置在基板上的自放电层和设置在自放电层上的应力金属层,其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外,根据各种示例性实施例的制造弹簧装置的方法包括提供衬底,在衬底上提供自释放层,并在自释放层上方提供应力金属层,其中, 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。
    • 10. 发明授权
    • Scanning probe system with spring probe and actuation/sensing structure
    • 具有弹簧探头和致动/感应结构的扫描探头系统
    • US06734425B2
    • 2004-05-11
    • US10136258
    • 2002-04-30
    • Thomas HantschelEugene M. ChowDavid K. ForkMichel A. RosaDirk De Bruyker
    • Thomas HantschelEugene M. ChowDavid K. ForkMichel A. RosaDirk De Bruyker
    • G01B528
    • G01Q70/10G01Q70/06G01Q70/16G01R1/06727Y10S977/873
    • Scanning probe systems, which include scanning probe microscopes (SPMs) are disclosed that include cantilevered spring (e.g., stressy metal) probes and actuation/position sensing electrodes formed on a substrate. The actuation electrodes are used to position the spring probe relative to the substrate using electrostatic, magnetic, acoustic, or piezoelectric arrangements. An actuation signal source is switched between full on and off states to facilitate “ON/OFF” probe actuation in which the spring probe is either fully retracted against the substrate or deployed for scan operations. The position sensing electrodes are used to sense the deflected position of the spring probe relative to the substrate using resistive, magnetic, or piezoresistive arrangements. Spring probe arrays are disclosed that include multiple spring probes arranged on a single substrate. Each spring probe of the array includes a separate actuation electrode that is controlled using “ON/OFF” or tapping probe actuation, and may include a separate position sensing electrode.
    • 公开了包括扫描探针显微镜(SPM)的扫描探针系统,其包括形成在基底上的悬臂弹簧(例如,应力金属)探针和致动/位置感测电极。 致动电极用于使用静电,磁,声或压电布置相对于衬底定位弹簧探头。 致动信号源在完全打开和关闭状态之间切换,以便于“ON / OFF”探头致动,其中弹簧探针完全缩回到基板上或部署用于扫描操作。 位置检测电极用于使用电阻,磁阻或压阻布置来感测弹簧探针相对于基底的偏转位置。 公开了包括布置在单个基板上的多个弹簧探针的弹簧探针阵列。 阵列的每个弹簧探针包括使用“ON / OFF”或分接探头致动来控制的单独的致动电极,并且可以包括单独的位置感测电极。