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    • 1. 发明申请
    • Methods of hyperdoping semiconductor materials and hyperdoped semiconductor materials and devices
    • 超掺杂半导体材料和超掺杂半导体材料和器件的方法
    • US20090064922A1
    • 2009-03-12
    • US11708652
    • 2007-02-20
    • Thomas D. BooneEric S. HarmonRobert D. KoudelkaDavid B. SalzmanJerry M. Woodall
    • Thomas D. BooneEric S. HarmonRobert D. KoudelkaDavid B. SalzmanJerry M. Woodall
    • C30B15/14C30B23/02
    • H01L33/025C30B23/02C30B25/02C30B29/40C30B29/403C30B29/406H01L21/02395H01L21/02538H01L21/02546H01L21/02573H01L21/02579H01L21/02631H01L29/207H01L29/36H01L29/66318H01L29/66462H01L29/66924H01L29/7371H01L29/7785H01L29/802
    • Methods are disclosed for producing highly doped semiconductor materials. Using the invention, one can achieve doping densities that exceed traditional, established carrier saturation limits without deleterious side effects. Additionally, highly doped semiconductor materials are disclosed, as well as improved electronic and optoelectronic devices/components using said materials. The innovative materials and processes enabled by the invention yield significant performance improvements and/or cost reductions for a wide variety of semiconductor-based microelectronic and optoelectronic devices/systems.Materials are grown in an anion-rich environment, which, in the preferred embodiment, are produced by moderate substrate temperatures during growth in an oxygen-poor environment. The materials exhibit fewer non-radiative recombination centers at higher doping concentrations than prior art materials, and the highly doped state of matter can exhibit a minority carrier lifetime dominated by radiative recombination at higher doping levels and higher majority carrier concentrations than achieved in prior art materials. Important applications enabled by these novel materials include high performance electronic or optoelectronic devices, which can be smaller and faster, yet still capture or emit light efficiently, and high performance electronics, such as transistors, which can be smaller and faster, yet cooler.
    • 公开了用于生产高掺杂半导体材料的方法。 使用本发明,可以实现超过传统的已建立的载流子饱和极限而没有有害的副作用的掺杂密度。 此外,公开了高度掺杂的半导体材料,以及使用所述材料的改进的电子和光电子器件/部件。 通过本发明实现的创新材料和工艺为各种基于半导体的微电子和光电子器件/系统产生显着的性能改进和/或降低成本。 材料在富含阴离子的环境中生长,在优选的实施方案中,其在贫氧环境中生长期间由适度的底物温度产生。 与现有技术材料相比,这些材料在较高的掺杂浓度下表现出较少的非辐射复合中心,并且高度掺杂的物质状态可以表现出在较高的掺杂水平和较高的多数载流子浓度的情况下以辐射复合为主的少数载流子寿命, 。 这些新型材料所能实现的重要应用包括高性能电子或光电子器件,可以更小更快地捕获或发光,而高性能电子器件(如可以更小更快更冷却的晶体管)。
    • 2. 发明授权
    • Methods of hyperdoping semiconductor materials and hyperdoped semiconductor materials and devices
    • 超掺杂半导体材料和超掺杂半导体材料和器件的方法
    • US07179329B2
    • 2007-02-20
    • US10277352
    • 2002-10-22
    • Thomas BooneEric S. HarmonRobert D. KoudelkaDavid B. SalzmanJerry M. Woodall
    • Thomas BooneEric S. HarmonRobert D. KoudelkaDavid B. SalzmanJerry M. Woodall
    • C30B9/00
    • H01L33/025C30B23/02C30B25/02C30B29/40C30B29/403C30B29/406H01L21/02395H01L21/02538H01L21/02546H01L21/02573H01L21/02579H01L21/02631H01L29/207H01L29/36H01L29/66318H01L29/66462H01L29/66924H01L29/7371H01L29/7785H01L29/802
    • Methods are disclosed for producing highly doped semiconductor materials. Using the invention, one can achieve doping densities that exceed traditional, established carrier saturation limits without deleterious side effects. Additionally, highly doped semiconductor materials are disclosed, as well as improved electronic and optoelectronic devices/components using said materials. The innovative materials and processes enabled by the invention yield significant performance improvements and/or cost reductions for a wide variety of semiconductor-based microelectronic and optoelectronic devices/systems.Materials are grown in an anion-rich environment, which, in the preferred embodiment, are produced by moderate substrate temperatures during growth in an oxygen-poor environment. The materials exhibit fewer non-radiative recombination centers at higher doping concentrations than prior art materials, and the highly doped state of matter can exhibit a minority carrier lifetime dominated by radiative recombination at higher doping levels and higher majority carrier concentrations than achieved in prior art materials. Important applications enabled by these novel materials include high performance electronic or optoelectronic devices, which can be smaller and faster, yet still capture or emit light efficiently, and high performance electronics, such as transistors, which can be smaller and faster, yet cooler.
    • 公开了用于生产高掺杂半导体材料的方法。 使用本发明,可以实现超过传统的已建立的载流子饱和极限而没有有害的副作用的掺杂密度。 此外,公开了高度掺杂的半导体材料,以及使用所述材料的改进的电子和光电子器件/部件。 通过本发明实现的创新材料和工艺为各种基于半导体的微电子和光电子器件/系统产生显着的性能改进和/或降低成本。 材料在富含阴离子的环境中生长,在优选的实施方案中,其在贫氧环境中生长期间由适度的底物温度产生。 与现有技术材料相比,这些材料在较高的掺杂浓度下表现出较少的非辐射复合中心,并且高度掺杂的物质状态可以表现出在较高的掺杂水平和较高的多数载流子浓度的情况下以辐射复合为主的少数载流子寿命, 。 这些新型材料所能实现的重要应用包括高性能电子或光电子器件,可以更小更快地捕获或发光,而高性能电子器件(如可以更小更快更冷却的晶体管)。