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    • 1. 发明授权
    • Direct sealing of glass microstructures
    • 直接密封玻璃微结构
    • US09527724B2
    • 2016-12-27
    • US13989897
    • 2011-11-28
    • Thierry Luc Alain DannouxPaulo Gaspar Jorge MarquesRonan Tanguy
    • Thierry Luc Alain DannouxPaulo Gaspar Jorge MarquesRonan Tanguy
    • B81C1/00B01L3/00C03B23/24
    • B81C1/00119B01L3/502707B01L2200/12B01L2300/0887B81B2201/051B81C1/00357B81C2203/036C03B23/245
    • Embodiments of methods for sealing a glass microstructure assembly comprise providing one or more side retainer members on a base plate adjacent the glass microstructure assembly, the side retainer members having a height less than an uncompressed height defined by the glass microstructure assembly. The methods also comprise compressing the glass microstructure assembly via a load bearing top plate in intimate contact with the top glass layer while heating the glass microstructure assembly and the top plate to a glass sealing temperature, the glass sealing temperature being a temperature sufficient to make glass viscous, wherein the glass microstructure assembly is compressed until the load bearing top plate contacts the side retainer members, and wherein the lower surface of the top plate maintains adhesion to the upper surface of the top glass layer at the glass sealing temperature while the load bearing plate is supported by the side retainer members.
    • 用于密封玻璃微结构组件的方法的实施例包括在邻近玻璃微结构组件的基板上提供一个或多个侧面保持器构件,侧面保持构件的高度小于由玻璃微结构组件限定的未压缩高度。 所述方法还包括通过与顶部玻璃层紧密接触的承载顶板压缩玻璃微结构组件,同时将玻璃微结构组件和顶板加热至玻璃密封温度,玻璃密封温度为足以制备玻璃的温度 粘性,其中玻璃微结构组件被压缩直到承载顶板接触侧保持器构件,并且其中顶板的下表面在玻璃密封温度下保持与顶部玻璃层的上表面的粘附,而承载 板由侧保持构件支撑。
    • 2. 发明申请
    • DIRECT SEALING OF GLASS MICROSTRUCTURES
    • 直接密封玻璃微结构
    • US20130243663A1
    • 2013-09-19
    • US13989897
    • 2011-11-28
    • Thierry Luc Alain DannouxPaulo Gaspar Jorge MarquesRonan Tanguy
    • Thierry Luc Alain DannouxPaulo Gaspar Jorge MarquesRonan Tanguy
    • B81C1/00C03B23/24
    • B81C1/00119B01L3/502707B01L2200/12B01L2300/0887B81B2201/051B81C1/00357B81C2203/036C03B23/245
    • Embodiments of methods for sealing a glass microstructure assembly comprise providing one or more side retainer members on a base plate adjacent the glass microstructure assembly, the side retainer members having a height less than an uncompressed height defined by the glass microstructure assembly. The methods also comprise compressing the glass microstructure assembly via a load bearing top plate in intimate contact with the top glass layer while heating the glass microstructure assembly and the top plate to a glass sealing temperature, the glass sealing temperature being a temperature sufficient to make glass viscous, wherein the glass microstructure assembly is compressed until the load bearing top plate contacts the side retainer members, and wherein the lower surface of the top plate maintains adhesion to the upper surface of the top glass layer at the glass sealing temperature while the load bearing plate is supported by the side retainer members.
    • 用于密封玻璃微结构组件的方法的实施例包括在邻近玻璃微结构组件的基板上提供一个或多个侧面保持器构件,侧面保持构件的高度小于由玻璃微结构组件限定的未压缩高度。 所述方法还包括通过与顶部玻璃层紧密接触的承载顶板压缩玻璃微结构组件,同时将玻璃微结构组件和顶板加热至玻璃密封温度,玻璃密封温度为足以制备玻璃的温度 粘性,其中玻璃微结构组件被压缩直到承载顶板接触侧保持器构件,并且其中顶板的下表面在玻璃密封温度下保持与顶部玻璃层的上表面的粘附,而承载 板由侧保持构件支撑。
    • 5. 发明申请
    • METHODS FOR FORMING COMPOSITIONS CONTAINING GLASS
    • 用于形成包含玻璃的组合物的方法
    • US20100071418A1
    • 2010-03-25
    • US12526900
    • 2008-02-27
    • Thierry Luc Alain DannouxPaulo Gaspar Jorge MarquesRobert Michael MorenaCameron Wayne Tanner
    • Thierry Luc Alain DannouxPaulo Gaspar Jorge MarquesRobert Michael MorenaCameron Wayne Tanner
    • C03B17/00
    • C03B11/084B81B2201/051B81C99/0085B81C2201/019B81C2201/036C03B2215/07
    • Methods for molding glass and glass composites, including providing a first structure having a first surface, providing a second structure having a second surface, the second surface being patterned and porous, and disposing between the first and second surfaces an amount of a composition comprising a glass, then heating together the first and second structures and the first amount of the composition sufficiently to soften the first amount of the composition such that the first and second structures, under gravity or an otherwise applied force, move toward each other, such that the pattern of the second surface is formed into the first amount of the composition, then cooling the composition sufficiently to stabilize it, the second structure comprising porous carbon having an open porosity of at least 5% and wherein the amount of the composition is removable from the second surface, without damage to the amount of the composition or to the second surface, such that the second surface is in condition for re-use.
    • 用于模制玻璃和玻璃复合材料的方法,包括提供具有第一表面的第一结构,提供具有第二表面的第二结构,第二表面被图案化和多孔化,并且在第一表面和第二表面之间设置一定量的组合物, 玻璃,然后将第一和第二结构和第一量的组合物充分加热以软化第一量的组合物,使得第一和第二结构在重力或以其他方式施加的力下朝向彼此移动,使得 将第二表面的图案形成为第一量的组合物,然后充分冷却组合物以使其稳定,第二结构包括具有至少5%的开放孔隙率的多孔碳,并且其中组合物的量可从 第二表面,而不损害组合物的量或第二表面,使得第二表面是 在重新使用的条件下。
    • 10. 发明申请
    • Thermoelectric Device
    • 热电装置
    • US20090277489A1
    • 2009-11-12
    • US12376886
    • 2006-12-08
    • Thierry Luc Alain DannouxChristophe GoupilPaulo Gaspar Jorge Marques
    • Thierry Luc Alain DannouxChristophe GoupilPaulo Gaspar Jorge Marques
    • H01L35/34H01L35/00
    • H01L35/34H01L35/32
    • A thermoelectric device is provided which comprises a plurality of elements of a thermoelectric material, which are preferably either all of n-type material or all p-type. In this preferred device, each element has a first end region for exposure to a first temperature, and a second end region for exposure to a second temperature, with the temperature gradient being in the same direction in each of the elements, so each element develops a voltage between its end regions in the same direction. The first end regions of the elements are mounted on a substrate, but the second end regions of the elements are at least substantially free to move with respect to one another. The elements are connected electrically in series, so that the series connection produces a net voltage, the electrical connections being designed to produce only a small amount of heat conduction.
    • 提供了一种热电装置,其包括热电材料的多个元件,其优选地是n型材料或全部是p型。 在该优选装置中,每个元件具有用于暴露于第一温度的第一端部区域和用于暴露于第二温度的第二端部区域,其中温度梯度在每个元件中沿相同的方向,因此每个元件产生 其端部区域之间的电压在相同方向。 元件的第一端部区域安装在基板上,但是元件的第二端部区域至少基本上相对于彼此自由移动。 这些元件串联电连接,使得串联连接产生净电压,电连接被设计成仅产生少量的热传导。