会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US06139677A
    • 2000-10-31
    • US787916
    • 1997-01-23
    • Tetsuji TogawaSeiji KatsuokaNorio KimuraToyomi Nishi
    • Tetsuji TogawaSeiji KatsuokaNorio KimuraToyomi Nishi
    • B24B53/007B24B53/017B24B55/04C23F1/02
    • B24B53/017B24B55/045
    • A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.
    • 抛光装置70用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括:转台73,其上表面安装有抛光74布;顶环75,用于支撑待抛光的工件并将工件压靠在抛光布上;以及修整工具79,用于将抛光布修整在 转盘。 抛光装置还包括覆盖转台上表面以防止转台上的液体散落的盖10,以及形成在盖的上壁中的插入孔17和21,用于将顶环和修整工具穿过其中 。
    • 3. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US5839947A
    • 1998-11-24
    • US795511
    • 1997-02-05
    • Norio KimuraKunihiko SakuraiTetsuji TogawaSeiji KatsuokaToyomi Nishi
    • Norio KimuraKunihiko SakuraiTetsuji TogawaSeiji KatsuokaToyomi Nishi
    • B24B53/007B24B53/017B24B5/00B24B29/00
    • B24B53/017
    • A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.
    • 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台,用于保持要抛光的工件的顶环,并将工件压靠在抛光表面上,该抛光表面可在转盘内部的抛光位置和位于转盘外部的待机位置之间移动 转盘和用于在顶环处于待机位置时保持顶环的至少下表面湿润的第一装置。 抛光装置还包括用于修整转台上的抛光表面的修整工具,以及用于在修整工具处于待机位置时保持敷料工具的至少下表面湿润的第二装置。
    • 4. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US06413357B1
    • 2002-07-02
    • US09666855
    • 2000-09-21
    • Tetsuji TogawaSeiji KatsuokaNorio KimuraToyomi Nishi
    • Tetsuji TogawaSeiji KatsuokaNorio KimuraToyomi Nishi
    • C23F102
    • B24B53/017B24B55/045
    • A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.
    • 抛光装置用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平整镜面。 抛光装置包括:具有安装在其上表面上的抛光布的转台,用于支撑待抛光工件的顶环,并将工件压靠在抛光布上;以及修整工具,用于将抛光布修整在转台上。 抛光装置还包括覆盖转盘上表面以防止转台上的液体散落的盖,以及形成在盖的上壁中的插孔,用于插入顶环和修整工具。