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1. 发明授权

US06139677A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06139677A
公开(公告)日：2000-10-31
申请号：US787916
申请日：1997-01-23
申请人： Tetsuji Togawa , Seiji Katsuoka , Norio Kimura , Toyomi Nishi
发明人： Tetsuji Togawa , Seiji Katsuoka , Norio Kimura , Toyomi Nishi
IPC分类号： B24B53/007 , B24B53/017 , B24B55/04 , C23F1/02
CPC分类号： B24B53/017 , B24B55/045
摘要： A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.
摘要翻译：抛光装置70用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括：转台73，其上表面安装有抛光74布;顶环75，用于支撑待抛光的工件并将工件压靠在抛光布上;以及修整工具79，用于将抛光布修整在转盘。抛光装置还包括覆盖转台上表面以防止转台上的液体散落的盖10，以及形成在盖的上壁中的插入孔17和21，用于将顶环和修整工具穿过其中。

2. 发明授权

US5839947A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5839947A
公开(公告)日：1998-11-24
申请号：US795511
申请日：1997-02-05
申请人： Norio Kimura , Kunihiko Sakurai , Tetsuji Togawa , Seiji Katsuoka , Toyomi Nishi
发明人： Norio Kimura , Kunihiko Sakurai , Tetsuji Togawa , Seiji Katsuoka , Toyomi Nishi
IPC分类号： B24B53/007 , B24B53/017 , B24B5/00 , B24B29/00
CPC分类号： B24B53/017
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括其上具有抛光表面的转台，用于保持要抛光的工件的顶环，并将工件压靠在抛光表面上，该抛光表面可在转盘内部的抛光位置和位于转盘外部的待机位置之间移动转盘和用于在顶环处于待机位置时保持顶环的至少下表面湿润的第一装置。抛光装置还包括用于修整转台上的抛光表面的修整工具，以及用于在修整工具处于待机位置时保持敷料工具的至少下表面湿润的第二装置。

3. 发明授权

US06413357B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06413357B1
公开(公告)日：2002-07-02
申请号：US09666855
申请日：2000-09-21
申请人： Tetsuji Togawa , Seiji Katsuoka , Norio Kimura , Toyomi Nishi
发明人： Tetsuji Togawa , Seiji Katsuoka , Norio Kimura , Toyomi Nishi
IPC分类号： C23F102
CPC分类号： B24B53/017 , B24B55/045
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.
摘要翻译：抛光装置用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平整镜面。抛光装置包括：具有安装在其上表面上的抛光布的转台，用于支撑待抛光工件的顶环，并将工件压靠在抛光布上;以及修整工具，用于将抛光布修整在转台上。抛光装置还包括覆盖转盘上表面以防止转台上的液体散落的盖，以及形成在盖的上壁中的插孔，用于插入顶环和修整工具。

4. 发明授权

US5931723A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5931723A
公开(公告)日：1999-08-03
申请号：US864905
申请日：1997-05-29
申请人： Seiji Katsuoka , Toyomi Nishi , Tetsuji Togawa
发明人： Seiji Katsuoka , Toyomi Nishi , Tetsuji Togawa
IPC分类号： H01L21/302 , B08B15/02 , B24B55/12 , H01L21/02 , H01L21/304 , H01L21/3065 , B24B1/00
CPC分类号： B24B37/105 , B08B15/02 , B24B55/12
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has an exhaust device for exhausting air in the polishing apparatus. The polishing apparatus includes a housing, a polishing section housed in the housing for polishing a workpiece, a cleaning section housed in the housing for cleaning the workpiece which has been polished, and a base comprising a plurality of structural members for supporting at least one device in at least one of the cleaning section and the polishing section. At least one of the structural members has a fluid passage therein and intake openings to serve as an exhaust duct. The polishing apparatus further comprises a main exhaust duct communicating with the exhaust duct and extending to an exterior of the housing for exhausting air introduced in the exhaust duct.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置具有用于在抛光装置中排出空气的排气装置。抛光装置包括壳体，容纳在用于抛光工件的壳体中的抛光部分，容纳在壳体中用于清洁已经被抛光的工件的清洁部分，以及包括多个结构部件的基部，用于支撑至少一个装置在清洁部分和抛光部分中的至少一个中。结构构件中的至少一个具有其中的流体通道和用作排气管的进气口。抛光装置还包括与排气管道连通并延伸到壳体的外部的主排气管道，用于排出引入排气管道中的空气。

5. 发明授权

US5860847A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5860847A
公开(公告)日：1999-01-19
申请号：US708948
申请日：1996-09-06
申请人： Kunihiko Sakurai , Tetsuji Togawa , Toyomi Nishi , Seiji Katsuoka , Hiromi Yajima , Masako Kodera
发明人： Kunihiko Sakurai , Tetsuji Togawa , Toyomi Nishi , Seiji Katsuoka , Hiromi Yajima , Masako Kodera
IPC分类号： B24B37/013 , B24B37/04 , B24B49/04 , B24B49/16 , H01L21/66 , B24B49/00
CPC分类号： B24B37/013 , B24B37/04 , B24B49/04 , B24B49/16 , H01L22/26
摘要： A polishing apparatus has a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring disposed above the turntable for supporting a workpiece to be polished against the abrasive cloth under predetermined pressure. The turntable is rotatable by a first motor through a timing pulley connected to the first motor, and the top ring is rotatable by a second motor through a timing pulley connected to the second motor. A torque detector incorporated in the timing pulley connected to at least one of the first motor and the second motor detects an output torque produced by the at least one of the first motor and the second motor.
摘要翻译：抛光装置具有安装在其上表面上的研磨布的转台和设置在转盘上方的顶环，用于在预定压力下将待抛光的工件支撑在磨料上。转盘可以通过连接到第一马达的定时皮带由第一马达旋转，并且顶环可以通过连接到第二马达的定时皮带的第二马达转动。并入到与第一电动机和第二电动机中的至少一个连接的正时轮中的转矩检测器检测由第一电动机和第二电动机中的至少一个产生的输出转矩。

6. 发明授权

US07708618B2 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device 失效
标题翻译：用于干燥，干燥抛光和洗涤半导体器件的方法和设备
公开(公告)号：US07708618B2
公开(公告)日：2010-05-04
申请号：US11980667
申请日：2007-10-31
申请人： Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
发明人： Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
IPC分类号： B24B51/00
CPC分类号： H01L21/67161 , B08B1/04 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67167 , H01L21/67219 , H01L21/67745 , H01L21/67778 , H03M13/39 , H04N5/4401 , H04N5/455
摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
摘要翻译：抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元得到清洁和干燥的抛光工件。

7. 发明申请

US20060084369A1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US20060084369A1
公开(公告)日：2006-04-20
申请号：US11294365
申请日：2005-12-06
申请人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号： B24B1/00
CPC分类号： B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
摘要翻译：用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

8. 发明授权

US06409582B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06409582B1
公开(公告)日：2002-06-25
申请号：US09531589
申请日：2000-03-20
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Shunichiro Kojima , Toyomi Nishi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Shunichiro Kojima , Toyomi Nishi
IPC分类号： B24B722
CPC分类号： B24B37/345 , B08B3/02 , B24B41/005 , H01L21/67051
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus, includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转盘上的抛光表面上。推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

9. 发明授权

US6074276A Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US6074276A
公开(公告)日：2000-06-13
申请号：US215147
申请日：1998-12-18
申请人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
发明人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
IPC分类号： B24B37/04 , B24B49/00 , B24B55/00 , B24B55/12 , B24B57/02 , H01L21/302 , B24B7/24
CPC分类号： B24B57/02 , B24B37/005 , B24B37/04 , B24B49/00 , B24B55/00 , B24B55/12 , H01L21/302 , Y10T137/5762
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括用于抛光工件表面的抛光部分，用于清洁已经被抛光的工件的清洁部分，设置在用于检测在抛光部分中发生的液体泄漏的抛光部分中的第一液体泄漏传感器，以及第二液体泄漏传感器，设置在清洁部分中，用于检测在清洁部分中发生的液体泄漏。抛光装置还包括一个控制装置，用于当第一和第二液体泄漏传感器中的任何一个检测到液体泄漏时，停止向抛光部分或清洁部分供应液体泄漏。

10. 再颁专利

USRE38215E1 Polishing apparatus 有权
公开(公告)号：USRE38215E1
公开(公告)日：2003-08-12
申请号：US09814060
申请日：2001-03-22
申请人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
发明人： Miki Shibata , Toyomi Nishi , Hidetaka Nakao , Tetsuji Togawa
IPC分类号： B24B724
CPC分类号： B24B57/02 , B24B37/005 , B24B37/04 , B24B49/00 , B24B55/00 , B24B55/12 , H01L21/302 , Y10T137/5762
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

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