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    • 2. 发明授权
    • Bonding pad for gallium nitride-based light-emitting device
    • 用于氮化镓基发光器件的接合焊盘
    • US07002180B2
    • 2006-02-21
    • US10187468
    • 2002-06-28
    • Steve Tchang-Hun OhHong K. ChoiBor-Yeu TsaurJohn C. C. Fan
    • Steve Tchang-Hun OhHong K. ChoiBor-Yeu TsaurJohn C. C. Fan
    • H01L27/15
    • H01L33/40
    • A bonding pad for an electrode is in contact with p-type gallium nitride-based semiconductor material that includes aluminum. The bonding pad may also includes one or more metals selected from the group consisting of palladium, platinum, nickel and gold. The bonding pad can be used to attach a bonding wire to the p-electrode in a semiconductor device, such as a light-emitting diode or a laser diode without causing degradation of the light-transmission and ohmic properties of the electrode. The bonding pad may be formed of substantially the same material as an electrode in making an ohmic contact with n-type gallium nitride-based semiconductor material (n-electrode). This allows the bonding pad and the n-electrode to be formed simultaneously when manufacturing a gallium nitride-based light-emitting device which substantially reduces the cost to manufacture the device.
    • 用于电极的焊盘与包括铝的p型氮化镓基半导体材料接触。 接合焊盘还可以包括一种或多种选自钯,铂,镍和金的金属。 接合焊盘可以用于在诸如发光二极管或激光二极管的半导体器件中的p电极上附接接合线,而不会导致电极的光透射和欧姆特性的劣化。 接合焊盘可以与与n型氮化镓基半导体材料(n电极)欧姆接触的与电极基本相同的材料形成。 这允许在制造基本上降低制造器件的成本的氮化镓基发光器件时同时形成焊盘和n电极。
    • 3. 发明授权
    • Bonding pad for gallium nitride-based light-emitting devices
    • 用于氮化镓基发光器件的接合焊盘
    • US07122841B2
    • 2006-10-17
    • US10860798
    • 2004-06-03
    • Tchang-Hun OhHong K. ChoiJohn C. C. FanJagdish Narayan
    • Tchang-Hun OhHong K. ChoiJohn C. C. FanJagdish Narayan
    • H01L27/15
    • H01L29/452H01L21/28575H01L29/2003H01L33/32H01L33/40
    • A semiconductor device includes a substrate having a first major surface; a semiconductor device structure over the first surface of the substrate, the device structure comprising an n-type semiconductor layer, and a p-type semiconductor layer over the n-type semiconductor layer; a p-side electrode having a first and a second surface, wherein the first surface is in electrical contact with the p-type semiconductor layer; and a p-side bonding pad over the p-side electrode. Preferably, the semiconductor device further comprises an n-side bonding pad over an n-type semiconductor layer. The p-side and n-side bonding pads each independently includes a gold layer as its top layer and a single or multiple layers of a diffusion barrier under the top gold layer. Optionally, one or more metal layers are further included under the diffusion barrier. Typically, the p-side bonding pad is formed on the p-side electrode. The n-side bonding pad typically is formed on the n-type semiconductor layer, and forms a good ohmic contact with the n-type semiconductor layer.
    • 半导体器件包括具有第一主表面的衬底; 在所述衬底的第一表面上的半导体器件结构,所述器件结构包括n型半导体层和在所述n型半导体层上的p型半导体层; 具有第一表面和第二表面的p侧电极,其中所述第一表面与所述p型半导体层电接触; 以及p侧电极上的p侧接合焊盘。 优选地,半导体器件还包括在n型半导体层上的n侧焊盘。 p侧和n侧接合焊盘各自独立地包括作为其顶层的金层和在顶部金层下方的单层或多层扩散阻挡层。 任选地,在扩散阻挡层下方还包括一个或多个金属层。 通常,p侧焊盘形成在p侧电极上。 n型接合焊盘通常形成在n型半导体层上,与n型半导体层形成良好的欧姆接触。
    • 4. 发明授权
    • Light-emitting diode device geometry
    • 发光二极管器件几何
    • US06847052B2
    • 2005-01-25
    • US10463219
    • 2003-06-17
    • John C. C. FanHong K. ChoiTchang-Hun OhJyh Chia ChenJagdish Narayan
    • John C. C. FanHong K. ChoiTchang-Hun OhJyh Chia ChenJagdish Narayan
    • H01L21/285H01L33/32H01L33/38H01L33/40H01L33/42H01L27/15H01L31/12H01L33/00
    • H01L33/40H01L21/28575H01L33/32H01L33/38H01L2933/0016Y10S257/918
    • A semiconductor device includes: a substrate; an n-type semiconductor layer over the substrate, the n-type semiconductor layer having a planar top surface; a p-type semiconductor layer extending over a major portion of the n-type semiconductor layer and not extending over an exposed region of the n-type semiconductor layer located adjacent to at least one edge of the planar top surface of the n-type semiconductor layer; a first bonding pad provided on the exposed region of the n-type semiconductor layer; an electrode layer extending over the p-type semiconductor layer; and a second bonding pad on the electrode layer, the bonding pad including a central region for securing an electrical interconnect, and at least one finger-like region protruding from the central region, the finger-like region having a length extending away from the central region and a width that is substantially less than the length. A method for producing a semiconductor device also is described.
    • 半导体器件包括:衬底; 在该衬底上的n型半导体层,该n型半导体层具有平坦的顶表面; p型半导体层,其延伸在n型半导体层的主要部分上,并且不延伸在邻近n型半导体的平面顶表面的至少一个边缘的n型半导体层的暴露区域上 层; 设置在所述n型半导体层的所述露出区域上的第一焊盘; 在p型半导体层上延伸的电极层; 以及在所述电极层上的第二焊盘,所述焊盘包括用于固定电互连的中心区域和从所述中心区域突出的至少一个指状区域,所述指状区域具有远离所述中心部分的长度 区域和宽度明显小于长度。 还描述了一种半导体器件的制造方法。