专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5902171A Method and apparatus for slicing a work 失效
标题翻译：用于切片工作的方法和装置
公开(公告)号：US5902171A
公开(公告)日：1999-05-11
申请号：US918923
申请日：1997-08-26
申请人： Tatsumi Hamasaki , Yoshihiro Tadera , Yukinori Imada , Keishi Kawaguchi
发明人： Tatsumi Hamasaki , Yoshihiro Tadera , Yukinori Imada , Keishi Kawaguchi
IPC分类号： B24B27/06 , B23D59/00 , B28D5/02 , B28D1/02
CPC分类号： B23D59/002 , B28D5/028
摘要： An apparatus for slicing a work includes: a blade member rotating device which rotates a blade member having an internal circular cutting edge; a radial moving device which produces a relative movement between the blade member and a work in a radial direction of the blade member to cut an end portion of the work; an axial moving device which produces a relative movement between the blade member and the work in an axial direction of the blade member; a displacement detector which detects an axial displacement of an inner portion of the rotating blade member; a rotational controller which controls the rotational speed of the blade member based on a detected axial displacement to reduce the axial displacement; and an axial movement controller which controls the axial relative movement between the blade member and the work based on the detected axial displacement so that an actual cutting position of the internal cutting edge with respect to the work is at a predetermined cutting reference position.
摘要翻译：一种用于切割工件的设备包括：叶片构件旋转装置，其使具有内部圆形切割刃的叶片构件旋转; 径向移动装置，其在所述刀片构件和所述工件之间在所述刀片构件的径向方向上产生相对运动，以切割所述工件的端部; 轴向移动装置，其在叶片构件的轴向方向上产生叶片构件和作业之间的相对运动; 位移检测器，其检测所述旋转叶片构件的内部的轴向位移; 旋转控制器，其基于检测到的轴向位移来控制所述叶片构件的旋转速度，以减小所述轴向位移; 以及轴向移动控制器，其基于检测到的轴向位移来控制所述刀片构件和所述工件之间的轴向相对运动，使得所述内部切削刃相对于所述工件的实际切割位置处于预定的切割参考位置。

2. 发明授权

US5025593A Slicing machine and control method thereof 失效
标题翻译：切片机及其控制方法
公开(公告)号：US5025593A
公开(公告)日：1991-06-25
申请号：US297473
申请日：1989-01-13
申请人： Keishi Kawaguchi , Tatsumi Hamasaki , Yoshihiro Tadera , Sachio Yamazaki
发明人： Keishi Kawaguchi , Tatsumi Hamasaki , Yoshihiro Tadera , Sachio Yamazaki
IPC分类号： B23D59/00 , B23Q15/12
CPC分类号： B23D59/002 , B23Q15/12 , Y10T83/141 , Y10T83/148
摘要： A slicing machine of this invention includes a blade having a cutting edge for slicing a silicon ingot, a tension disk for rotatably supporting the blade, a drive motor for rotating the blade, a deformation detection mechanism for detecting a deformation amount of the blade, and a control unit responsive to the measured deformation for correcting the relative position between the support base and the blade. A control method of the slicing machine is also disclosed.
摘要翻译：本发明的切片机包括具有用于切割硅锭的切割边缘的刀片，用于可旋转地支撑刀片的张紧盘，用于旋转刀片的驱动马达，用于检测刀片的变形量的变形检测机构，以及响应于测量的变形以校正支撑基座和叶片之间的相对位置的控制单元。还公开了一种切片机的控制方法。

3. 发明授权

US5681204A Device for detecting a displacement of a blade member of a slicing apparatus 失效
标题翻译：用于检测切片装置的刀片部件的位移的装置
公开(公告)号：US5681204A
公开(公告)日：1997-10-28
申请号：US559406
申请日：1995-11-15
申请人： Keishi Kawaguchi , Yoshihiro Tadera , Tatsumi Hamasaki , Isao Matsumoto
发明人： Keishi Kawaguchi , Yoshihiro Tadera , Tatsumi Hamasaki , Isao Matsumoto
IPC分类号： B24B27/06 , B23D59/00 , B28D5/02 , B24B49/16
CPC分类号： B23D59/002
摘要： A detecting device for use in a slicing apparatus which includes a blade member having an internal cutting edge in the form of a circle, a rotating driver for rotating the blade member about a center of the circle of the internal cutting edge, and a radial movement driver for producing a relative movement between the blade member and a work in a radial direction of the blade member so that an end portion of the work is cut into a piece by the internal cutting edge of the blade member, the detecting device being adapted for detecting a displacement of the blade member, includes: a detector which is disposed at a position being spaced away from the blade member and the work and allowing the piece in the process of being cut to intervene between the detector and the blade member and being operable to detect a distance to a specified position of the blade member; and a corrector which is operable to eliminate an influence to the distance detection which is caused by the intervention of the piece.
摘要翻译：一种用于切片装置的检测装置，其包括具有圆形内部切割刃的刀片构件，用于使刀片构件围绕内切削刃的圆的中心旋转的旋转驱动器，以及径向运动驱动器，其用于在所述刀片构件和所述刀片构件的径向方向上的工件之间产生相对运动，使得所述工件的端部通过所述刀片构件的内切割刃切割成片，所述检测装置适于检测所述叶片构件的位移，包括：检测器，其设置在与所述叶片构件和所述工件间隔开的位置处，并且允许所述构件在切割过程中介入所述检测器和所述叶片构件之间并且可操作以检测到所述刀片构件的指定位置的距离; 以及校正器，其可操作以消除由该片干涉引起的对距离检测的影响。

4. 发明授权

US5975741A Wafer producing apparatus 失效
标题翻译：晶圆生产设备
公开(公告)号：US5975741A
公开(公告)日：1999-11-02
申请号：US814849
申请日：1997-03-11
申请人： Keishi Kawaguchi , Tatsumi Hamasaki , Yoshihiro Tadera
发明人： Keishi Kawaguchi , Tatsumi Hamasaki , Yoshihiro Tadera
IPC分类号： H01L21/304 , H01L21/00 , H01L21/677 , G06F19/00
CPC分类号： H01L21/67727 , H01L21/67276
摘要： In the wafer producing apparatus of this invention, wafers each obtained by a slicing operation of a plurality of slicing devices are transported to a common finishing device by a transport device for chamfering. When the wafer is transferred to the transport device, an identification signal for identifying the slicing device by which the wafer is obtained is stored in an identification signal storage device. When the wafer is transferred from the transport device to the finishing device, the identification signal stored in the identification signal storage device is transmitted on a finish control device. Upon completion of the chamfering operation to the wafer by the finishing device, the finish control device controls the finishing device to allow the wafer to be stored in one of a plurality of wafer storage cassettes corresponding to the inputted identification signal. Thereby, even in a case where a working speed of the working device for slicing out a wafer from an ingot differs greatly from a working speed of the finishing device for chamfering the wafer, the wafer producing apparatus can be operated with a high proficiency and wafers processed by the common finishing device can be accurately stored in the proper wafer storage portion.
摘要翻译：在本发明的晶片制造装置中，通过多个切片装置的切片操作获得的晶片通过倒角用输送装置输送到普通的精加工装置。当将晶片转移到传送装置时，将识别用于识别获得晶片的切片装置的识别信号存储在识别信号存储装置中。当晶片从传送装置传送到整理装置时，存储在识别信号存储装置中的识别信号在完成控制装置上传输。通过精加工装置完成对晶片的倒角操作后，精加工控制装置控制精加工装置，以允许将晶片存储在与输入的识别信号相对应的多个晶片存储盒中的一个中。因此，即使在用于从晶锭切片晶片的工作装置的工作速度与用于倒角晶片的精加工装置的工作速度差异的情况下，晶片制造装置也可以以高精度和晶片由普通整理装置处理的图像可以精确地存储在适当的晶片存储部分中。

5. 发明授权

US5571040A Method and device for detecting blade flexure and blade flexure control device for use with a slicing machine 失效
标题翻译：用于检测与切片机一起使用的叶片挠曲和叶片挠曲控制装置的方法和装置
公开(公告)号：US5571040A
公开(公告)日：1996-11-05
申请号：US168023
申请日：1993-12-15
申请人： Keishi Kawaguchi , Tatsumi Hamasaki , Yoshihiro Tadera , Kunio Matsuda
发明人： Keishi Kawaguchi , Tatsumi Hamasaki , Yoshihiro Tadera , Kunio Matsuda
IPC分类号： B23D59/00 , B23Q15/18 , B28D5/02 , G01N3/58 , G05B19/404 , H01L21/304 , B24B49/00
CPC分类号： G01N3/58 , B23D59/002 , B23Q15/18 , B28D5/028 , G05B19/404 , G01N2203/0623
摘要： A method and device are adapted for detecting and controlling the flexure of a flat ring blade member of a slicing machine in which a workpiece is placed in the blade member, and a relative movement is rendered between the blade member being rotated and a workpiece in a radial direction of the blade member to produce a wafer of the workpiece. An axial load acting between the workpiece and the blade member is detected. A flexure amount of the blade member is calculated on the basis of the axial load detected. The flexure of the blade member is corrected on the basis of the flexure amount calculated.
摘要翻译：一种方法和装置适用于检测和控制切片机的平环形叶片构件的弯曲，其中工件被放置在叶片构件中，并且在叶片构件旋转与工件之间产生相对运动从而产生工件的晶片。检测作用在工件和叶片构件之间的轴向载荷。基于检测到的轴向载荷来计算叶片构件的挠曲量。基于所计算的弯曲量来校正叶片构件的挠曲。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式