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1. 发明授权

US5836808A Slicing machine with built-in grinder 失效
标题翻译：切片机内置磨床
公开(公告)号：US5836808A
公开(公告)日：1998-11-17
申请号：US667791
申请日：1996-06-21
申请人： Susumu Sawafuji , Nozomi Takai
发明人： Susumu Sawafuji , Nozomi Takai
IPC分类号： B24B7/22 , B28D1/00 , B28D5/02 , B24B27/06
CPC分类号： B28D1/003 , B24B7/228 , B28D5/028
摘要： The rotational center of a grinding wheel is eccentric to a slicing side in a slice feed direction with regard to the rotational center of an inner diameter saw. As a result, the diameter of the grinding wheel can be smaller, and the slice movement distance of the ingot can be shorter. Therefore, it is possible to provide a low-priced slicing machine with built-in grinder wherein a slicing time is short and the grinding face is accurate.
摘要翻译：砂轮的旋转中心相对于内径锯的旋转中心以切片进给方向偏心于切片侧。结果，砂轮的直径可以更小，并且锭的切片移动距离可以更短。因此，可以提供具有内置研磨机的低价切片机，其中切片时间短并且研磨面准确。

2. 发明授权

US5571040A Method and device for detecting blade flexure and blade flexure control device for use with a slicing machine 失效
标题翻译：用于检测与切片机一起使用的叶片挠曲和叶片挠曲控制装置的方法和装置
公开(公告)号：US5571040A
公开(公告)日：1996-11-05
申请号：US168023
申请日：1993-12-15
申请人： Keishi Kawaguchi , Tatsumi Hamasaki , Yoshihiro Tadera , Kunio Matsuda
发明人： Keishi Kawaguchi , Tatsumi Hamasaki , Yoshihiro Tadera , Kunio Matsuda
IPC分类号： B23D59/00 , B23Q15/18 , B28D5/02 , G01N3/58 , G05B19/404 , H01L21/304 , B24B49/00
CPC分类号： G01N3/58 , B23D59/002 , B23Q15/18 , B28D5/028 , G05B19/404 , G01N2203/0623
摘要： A method and device are adapted for detecting and controlling the flexure of a flat ring blade member of a slicing machine in which a workpiece is placed in the blade member, and a relative movement is rendered between the blade member being rotated and a workpiece in a radial direction of the blade member to produce a wafer of the workpiece. An axial load acting between the workpiece and the blade member is detected. A flexure amount of the blade member is calculated on the basis of the axial load detected. The flexure of the blade member is corrected on the basis of the flexure amount calculated.
摘要翻译：一种方法和装置适用于检测和控制切片机的平环形叶片构件的弯曲，其中工件被放置在叶片构件中，并且在叶片构件旋转与工件之间产生相对运动从而产生工件的晶片。检测作用在工件和叶片构件之间的轴向载荷。基于检测到的轴向载荷来计算叶片构件的挠曲量。基于所计算的弯曲量来校正叶片构件的挠曲。

3. 发明授权

US5144938A Method and device for resharpening saws especially used for making semiconductor wafers 失效
标题翻译：用于制备特殊用于制造半导体波导的SAW的方法和装置
公开(公告)号：US5144938A
公开(公告)日：1992-09-08
申请号：US616783
申请日：1990-11-20
申请人： Helmut Seeburger , Peter Lehfeld , Wolf-Rudiger Kurtze
发明人： Helmut Seeburger , Peter Lehfeld , Wolf-Rudiger Kurtze
IPC分类号： B24B53/00 , B24D99/00 , B28D5/00 , B28D5/02 , H01L21/304
CPC分类号： B28D5/028 , B24B53/00
摘要： A device and method for resharpening the cutting edge of saws used in particular in the centerhole sawing of semiconductor bars. It contains a sharpening system which consists of at least one elongate sharpening stone facing the cutting edge with its end face, is movable laterally relative to the saw blade and has at the end face two working surfaces which are located opposite one another and, during sharpening, can be brought into contact laterally with the cutting-edge surface facing them. The device affords trouble-free operation and permits sharpening actions during the sawing operations.
摘要翻译：一种用于再磨削特别是半导体棒的中心孔锯切锯的切割刃的装置和方法。它包含一个磨削系统，该系统由至少一个面向切割边缘的细长磨石与其端面组成，可相对于锯片横向移动，并且在端面处具有两个相对定位的工作表面，并且在磨削过程中，可以与面向它们的前沿表面横向接触。该设备提供无故障的操作，并允许锯切操作期间的锐化动作。

4. 发明授权

US5074276A Slicing method by a slicing machine 失效
标题翻译：切片机的切片方法
公开(公告)号：US5074276A
公开(公告)日：1991-12-24
申请号：US577128
申请日：1990-09-04
申请人： Ichiro Katayama
发明人： Ichiro Katayama
IPC分类号： B23D59/00 , B24B1/00 , B24B7/16 , B24B7/22 , B24B27/06 , B24B49/02 , B28D1/00 , B28D5/00 , B28D5/02
CPC分类号： B24B49/02 , B23D59/001 , B24B1/00 , B24B27/0616 , B24B7/16 , B24B7/228 , B28D1/003 , B28D5/028
摘要： A slicing method by use of a slicing machine in which, after a cylindrical material is moved by a predetermined amount of indexing, the cylindrical material is moved to a rotating blade in the slicing direction of the blade and is sliced into a wafer having a predetermined thickness, and at the same time the end face of the cylindrical material is ground. In the slicing method according to the invention, the grinding position and the amount of indexing of the cylindrical material can be corrected in accordance with the actually measured data of the thicknesses of the wafer after slicing, the data of axial displacements of the blade detected during slicing, and the actually measured data of the shapes of the end face of the cylindrical material after slicing of the wafer. Thus, the grinding position can be calculated accurately, the loss of the cylindrical material can be minimized, and the slicing can be carried out with an accurate amount of indexing, so that the wafer can be manufactured with high accuracy.

5. 发明授权

US5036274A Method of monitoring the path of an annular blade through a semiconductor material 失效
标题翻译：通过半导体材料监测环形叶片的路径的方法
公开(公告)号：US5036274A
公开(公告)日：1991-07-30
申请号：US480758
申请日：1990-02-16
申请人： Helmut Seeburger
发明人： Helmut Seeburger
IPC分类号： H01L21/66 , B23D59/00 , B28D5/02 , G01D5/20 , H01L21/304 , G01B7/14
CPC分类号： B23D59/002 , B28D5/028 , G01D5/202 , G01D5/2053
摘要： A plurality of eddy-current sensors are provided with covers made of silicon on the side thereof facing the saw blade, the sensors being disposed in a fixed position relative to the saw blade and at a distance from the side face saw blade which is greater than the intended wafer thickness.
摘要翻译：多个涡流传感器在其面向锯片的一侧设置有由硅制成的盖，传感器相对于锯片设置在固定位置，并且距离侧面锯片大一点距离预期的晶片厚度。

6. 发明授权

US4949700A Ingot support device in slicing apparatus 失效
标题翻译：切片装置中的锭支撑装置
公开(公告)号：US4949700A
公开(公告)日：1990-08-21
申请号：US281534
申请日：1988-12-08
申请人： Masao Ebashi
发明人： Masao Ebashi
IPC分类号： B28D5/00 , B28D5/02 , B28D1/04
CPC分类号： B28D5/028 , B28D5/0082 , Y10T83/654
摘要： A slicing apparatus is disclosed which slices a cylindrical ingot into disc-shaped wafers by a rotating blade. The slicing apparatus includes an ingot support device which is used to contact support the ingot at a position opposed to the position of the ingot to be sliced by the blade. Therefore, a rection force which is produced in the ingot slicing can be supported by the ingot support device, thereby eliminating any ill effects on the hold surface of the ingot.

7. 发明授权

US4834062A Multiblade inner hole saw for the sawing of crystal rods into thin blades 失效
标题翻译：用于将晶棒锯切成薄刀片的多刃内孔锯
公开(公告)号：US4834062A
公开(公告)日：1989-05-30
申请号：US201356
申请日：1988-05-26
申请人： Walter Frank , Gerhard Palme
发明人： Walter Frank , Gerhard Palme
IPC分类号： B28D5/00 , B28D5/02 , H01L21/304
CPC分类号： B28D5/029 , B28D5/0082 , B28D5/024 , B28D5/028 , Y10T83/0538 , Y10T83/778
摘要： A multi-blade inner hole saw for the sawing of crystal rods or blocks, such as solar cell base material on a silicon base, into thin wafers has saw blades arranged mirror-symmetrically with respect to the bearing on either side of a common drive cylinder. In the sawing operation, the workpieces are sawn synchronously by the saw blades.
摘要翻译：用于将晶体棒或块（例如硅基底上的太阳能电池基底材料）锯切成薄晶片的多刃内孔锯具有相对于公共驱动筒的任一侧上的轴承镜对称地布置的锯片。在锯切操作中，工件由锯片同步锯切。

8. 发明授权

US4811722A Process for sharpening cutting-off tools and cutting-off process 失效
标题翻译：磨削切割工具和切断工艺的过程
公开(公告)号：US4811722A
公开(公告)日：1989-03-14
申请号：US190496
申请日：1988-05-05
申请人： Gerhard Brehm , Johann Niedermeier
发明人： Gerhard Brehm , Johann Niedermeier
IPC分类号： B24B3/36 , B23D63/14 , B24B53/00 , B28D5/02
CPC分类号： B28D5/028 , B23D63/14 , B24B53/00
摘要： Cutting-off tools whose cutting edge has a cutting layer with a bonded cutting grain are sharpened by sawing momentarily into a solid sharpening substance, in which case, in addition to a relative movement between cutting edge and solid material corresponding to the sawing operation, an oscillating relative movement transversely thereto is also performed. The process is used with particular advantage in combination with processes for the centerhole sawing of semiconductor or oxidic material.
摘要翻译：切割刀具具有切割层的切割工具通过立即切割成固体磨料物质而被锐化，在这种情况下，除了对应于锯切操作的切削刃和固体材料之间的相对运动之外，也进行横向振荡的相对运动。该方法特别适用于半导体或氧化物材料的中心孔锯切工艺。

9. 发明授权

US3702604A Work mounting mechanism in slicing machine 失效
标题翻译：切片机的安装机构
公开(公告)号：US3702604A
公开(公告)日：1972-11-14
申请号：US3702604D
申请日：1971-05-20
申请人： SILICON TECHNOLOGY
发明人： JONES DON R
IPC分类号： B28D5/00 , B28D5/02 , B23D45/08 , B23D47/04
CPC分类号： B28D5/028 , B28D5/0058 , Y10S83/952 , Y10T83/4539 , Y10T83/6566
摘要： A machine for slicing wafers of brittle material from an ingot in which the ingot to be sliced is secured for stepwise movement into the path of a rotating saw blade which moves through a slicing path perpendicular to the direction of movement of the ingot. The mounting means for the ingot includes a way table mounted on a fixed base for movement between a cutting position adjacent said saw blade and a clearance position away from the said saw blade. Positive stop means define the cutting position of the way table such that the ingot can be moved away from the saw and back to the saw with an accurate repositioning of the ingot in its cutting position. A variety of adjustable mounting means are provided to mount the ingot on the way table whereby the ingot may be oriented vertically, horizontally and axially for proper angle of cut.
摘要翻译：用于从锭中切割脆性材料晶片的机器，其中待切割的锭被固定以逐步移动到通过垂直于锭的移动方向的切片路径的旋转锯片的路径中。用于锭的安装装置包括安装在固定基座上的方式台，用于在与所述锯片相邻的切割位置与远离所述锯片的间隙位置之间移动。正停止装置限定了方式台的切割位置，使得锭可以从锯移动并返回到锯，准确地将锭重新定位在切割位置。提供了各种可调节的安装装置以将铸锭安装在工作台上，由此铸锭可以垂直，水平和轴向地定向以适当的切割角度。

10. 发明授权

US3577861A Transfer device for cutting apparatus 失效
标题翻译：用于切割装置的转移装置
公开(公告)号：US3577861A
公开(公告)日：1971-05-11
申请号：US3577861D
申请日：1969-04-07
申请人： KAYEX CORP
发明人： BENDER DAVID L , MOORE ROBERT E
IPC分类号： B24B27/06 , B28D5/00 , B28D5/02 , H01L21/304 , B24B7/20
CPC分类号： B28D5/028 , B28D5/0094
摘要： A device for retrieving a thin slice or wafer of material that has been cut from a billet and for transferring it to a storage receptacle comprises two pivotal members. A first pivotal member retrieves the slice after cutting and moves it along one side of an annular cutting member into a transfer position relative to the inner diameter of the annular member. A second pivotal member takes the slice at the transfer position and moves it axially and then in an arcuate path to a storage receptacle where it is released. The slice of material is retained on the pivotal members by suction. Suitable circuitry controls the application of the suction in proper timed relation to the movement of the pivotal members. A movable support member for the billet is also pivotally mounted so it can move the billet into a position in which it is spaced from the annular member on movement of the latter to its home position, thereby preventing damage to its exposed surface by contact with the annular member. In its home position the billet is moved axially to establish the thickness of the slice to be cut next and then radially relative to the annular member in another cycle of operation to cut the slice. Movement of the support member is also controlled by circuitry interconnected with that for controlling movement of the pivotal members.

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