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2. 发明授权

US07722962B2 Solder foil, semiconductor device and electronic device 失效
标题翻译：焊锡箔，半导体器件和电子器件
公开(公告)号：US07722962B2
公开(公告)日：2010-05-25
申请号：US10451610
申请日：2001-12-19
申请人： Tasao Soga , Hanae Hata , Toshiharu Ishida , Kanko Ishida, legal representative , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
发明人： Tasao Soga , Hanae Hata , Toshiharu Ishida , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
IPC分类号： H05K1/02 , H05K1/00 , B32B15/20
CPC分类号： H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298
摘要： A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.
摘要翻译：由包含作为金属颗粒的Cu等颗粒和作为焊料颗粒的Sn颗粒通过轧制形成的焊料箔适合于在温度分级粘合中的高温侧的焊料接合，以及通过使用制造的半导体器件和电子器件这种焊接结合具有突出的机械特性的可靠性等。

3. 发明申请

US20060061974A1 Solder foil semiconductor device and electronic device 失效
标题翻译：焊锡箔半导体器件及电子器件
公开(公告)号：US20060061974A1
公开(公告)日：2006-03-23
申请号：US10451610
申请日：2001-12-19
申请人： Tasao Soga , Hanae Hata , Toshiharu Ishida , Kanko Ishida , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
发明人： Tasao Soga , Hanae Hata , Toshiharu Ishida , Kanko Ishida , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
IPC分类号： H05K1/16 , H01L23/48 , H05K1/14
CPC分类号： H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298
摘要： A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.
摘要翻译：由包含作为金属颗粒的Cu等颗粒和作为焊料颗粒的Sn颗粒通过轧制形成的焊料箔适用于在温度分级粘合中的高温侧的焊接，以及通过使用制造的半导体器件和电子器件这种焊接结合具有突出的机械特性的可靠性等。

4. 发明授权

US06555052B2 Electron device and semiconductor device 失效
公开(公告)号：US06555052B2
公开(公告)日：2003-04-29
申请号：US09799486
申请日：2001-03-07
申请人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
发明人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
IPC分类号： C22C1302
CPC分类号： H01L24/32 , B23K35/262 , B23K2101/36 , H01L24/33 , H01L24/73 , H01L24/81 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/131 , H01L2224/13144 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/16152 , H01L2924/181 , H01L2924/20106 , H05K3/3463 , Y10T428/12528 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199
摘要： An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0˜2.0 mass %, In: 0.1˜10 mass %, and Sn: remaining amount.

5. 发明授权

US06774490B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US06774490B2
公开(公告)日：2004-08-10
申请号：US10395231
申请日：2003-03-25
申请人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
发明人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Masato Nakamura , Yuji Fujita , Toshiharu Ishida , Masahide Okamoto , Koji Serizawa , Toshihiro Hachiya , Hideki Mukuno
IPC分类号： H01L2848
CPC分类号： H01L24/32 , B23K35/262 , B23K2101/36 , H01L24/33 , H01L24/73 , H01L24/81 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/131 , H01L2224/13144 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/16152 , H01L2924/181 , H01L2924/20106 , H05K3/3463 , Y10T428/12528 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199
摘要： An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.
摘要翻译：电子设备能够改善电子设备中的抗冲击性或抗冲击性，并且提高半导体器件芯片接合Si芯片等中引起大变形的热冲击作用的焊点的可靠性，凸块安装的BGA，CSP，WPP，倒装芯片等，功率模块作用大的应力等等。电子设备具有电路板和电连接到电路板的电极的电子部件。电路板的电极和电子部件的电极通过使用由Cu：0-2.0质量％，In：0.1-10质量％和Sn：剩余量组成的无铅焊料进行焊接而连接。

6. 发明授权

US07131566B2 Packaging method using lead-free solder 有权
公开(公告)号：US07131566B2
公开(公告)日：2006-11-07
申请号：US10441662
申请日：2003-05-19
申请人： Tetsuya Nakatsuka , Masahide Okamoto , Tomoyuki Ohmura
发明人： Tetsuya Nakatsuka , Masahide Okamoto , Tomoyuki Ohmura
IPC分类号： H05K3/34
CPC分类号： B23K1/085 , B23K35/262 , B23K2101/40 , H05K3/3415 , H05K3/3447 , H05K3/3463 , H05K3/3468 , H05K3/3484 , H05K3/3489 , H05K2203/081 , H05K2203/111 , H05K2203/1121 , H05K2203/1572 , H05K2203/163 , Y02P70/613
摘要： This invention relates to a packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the circuit board is cooled or heated and the lower surface of the said circuit board is cooled, immediately after soldering in the flow-soldering step.

7. 发明授权

US07048173B2 Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly 失效
公开(公告)号：US07048173B2
公开(公告)日：2006-05-23
申请号：US10133778
申请日：2002-04-25
申请人： Tetsuya Nakatsuka , Masahide Okamoto , Tomoyuki Ohmura , Asao Nakano
发明人： Tetsuya Nakatsuka , Masahide Okamoto , Tomoyuki Ohmura , Asao Nakano
IPC分类号： B23K1/08
CPC分类号： B23K3/0653 , H01R4/023 , H01R4/029 , H01R4/58 , H01R4/625 , H01R43/0207
摘要： The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is wave soldered by contact with a molten lead-free solder blowout at a wave soldering portion provided in a chamber, and a cooling step in which an inert gas in the chamber is recirculated and cooled and is blown to the lower side of the substrate wave soldered with the lead-free solder in the wave soldering step and being conveyed, to cool the lower side of the substrate, at a blowing portion provided adjacently to the wave soldering portion in the chamber, and an apparatus therefor.

8. 发明授权

US06585149B2 Packaging method using lead-free solder 失效
标题翻译：包装方法采用无铅焊料
公开(公告)号：US06585149B2
公开(公告)日：2003-07-01
申请号：US09929215
申请日：2001-08-13
申请人： Tetsuya Nakatsuka , Masahide Okamoto , Tomoyuki Ohmura
发明人： Tetsuya Nakatsuka , Masahide Okamoto , Tomoyuki Ohmura
IPC分类号： B23K108
CPC分类号： B23K1/085 , B23K35/262 , B23K2101/40 , H05K3/3415 , H05K3/3447 , H05K3/3463 , H05K3/3468 , H05K3/3484 , H05K3/3489 , H05K2203/081 , H05K2203/111 , H05K2203/1121 , H05K2203/1572 , H05K2203/163 , Y02P70/613
摘要： A packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the circuit board is cooled or heated and the lower surface of the circuit board is cooled, immediately after soldering in the flow-soldering step.
摘要翻译：一种使用无铅焊料的封装方法，其特征在于包括回流焊步骤，其中表面安装器件用无铅焊膏焊接到电路板; 插入步骤，其中插入安装装置的引线或端子插入电路板; 将翘曲防止夹具安装在电路板上的步骤; 磁通施加步骤，其中向上述电路板施加磁通; 预热步骤，其中在施加助焊剂之后，电路板的下表面被预热; 加热在预热步骤中将其下表面预热的电路板的上表面加热到流动焊接步骤，并且通过将无铅焊膏施加到电路板的下表面，引线或端子插入安装装置被流焊到电路板上; 以及在流动焊接工序中焊接后立即对电路板的两面的温度进行调整的电路板的上表面被冷却或加热并且电路板的下表面冷却的温度控制步骤。

9. 发明授权

US08525330B2 Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer 有权
标题翻译：用于连接半导体元件和框架的连接构件，由Al基层和设置在Al基层的表面上的第一和第二Zn基层形成
公开(公告)号：US08525330B2
公开(公告)日：2013-09-03
申请号：US13382633
申请日：2010-08-30
申请人： Masahide Okamoto , Osamu Ikeda , Yuki Murasato
发明人： Masahide Okamoto , Osamu Ikeda , Yuki Murasato
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： C22C18/04 , B22F2998/00 , B23K1/0016 , B23K2101/42 , B32B15/017 , C22C21/00 , C22C21/06 , H01L23/04 , H01L23/3107 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29147 , H01L2224/29211 , H01L2224/2929 , H01L2224/29299 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2924/00013 , H01L2924/00014 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/10253 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/351 , Y10T29/49826 , Y10T428/12736 , B22F7/062 , H01L2924/0105 , H01L2924/00012 , H01L2924/01013 , H01L2924/0103 , H01L2924/01032 , H01L2924/01014 , H01L2924/01083 , H01L2924/01031 , H01L2924/01082 , H01L2924/01049 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要： Provided is a connecting part for a semiconductor device including a semiconductor element, a frame, and a connecting part which connects the semiconductor element and the frame to each other, in which an interface between the connecting part and the semiconductor element and an interface between the connecting part and the frame respectively have the area of Al oxide film which is more than 0% and less than 5% of entire area of the respective interfaces. The connecting part has an Al-based layer and first and second Zn-based layers on main surfaces of the Al-based layer, a thickness ratio of the Al-based layer relative to the Zn-based layers being less than 0.59.
摘要翻译：提供了一种半导体器件的连接部件，其包括半导体元件，框架和将半导体元件和框架彼此连接的连接部分，其中连接部分和半导体元件之间的界面和连接部和框架分别具有比各界面的整个面积大于0％且小于5％的Al氧化物膜的面积。连接部分在Al基层的主表面上具有Al基层和第一和第二Zn基层，Al基层相对于Zn基层的厚度比小于0.59。

10. 发明授权

US6118671A Circuit substrate and manufacture thereof, ceramic composition for circuit substrate, and electronics computer 失效
标题翻译：电路基板及其制造方法，电路基板用陶瓷组合物及电子计算机
公开(公告)号：US6118671A
公开(公告)日：2000-09-12
申请号：US103812
申请日：1998-06-24
申请人： Hirayoshi Tanei , Shoichi Iwanaga , Masahide Okamoto , Masato Nakamura , Kousaku Morita , Shousaku Ishihara , Fumikazu Tagami , Norio Sengoku , Tsuyoshi Fujita , Fumiyuki Kobayashi
发明人： Hirayoshi Tanei , Shoichi Iwanaga , Masahide Okamoto , Masato Nakamura , Kousaku Morita , Shousaku Ishihara , Fumikazu Tagami , Norio Sengoku , Tsuyoshi Fujita , Fumiyuki Kobayashi
IPC分类号： C03C3/089 , C03C8/16 , C03C14/00 , C03C17/06 , H01L21/48 , H01L23/15 , H05K1/03 , H05K1/11
CPC分类号： C03C14/004 , C03C17/06 , C03C3/089 , C03C8/16 , H01L21/4807 , H01L23/15 , C03C2217/253 , H01L2224/16 , H01L2224/16235 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H01L2924/15312 , H01L2924/15787 , H05K1/0306 , H05K3/4629 , Y10S428/901
摘要： Ceramic circuit substrate which is sintered at 900 to 1,050.degree. C. and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing are provided by using a glass with a softening point of 850 to 1,100.degree. C., that is, a glass having a composition included in an area in FIG. 1 (triangular composition diagram of SiO.sub.2 --B.sub.2 O.sub.3 --R.sub.2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively as raw material.
摘要翻译：陶瓷电路基板，其在900〜1050℃下烧结并具有低的相对介电常数，与硅相当的热膨胀系数和高的弯曲强度，以及制造方法是通过使用软化点为 850至1100℃，即具有包括在图1中的区域中的组成的玻璃。图1（SiO 2-B 2 O 3 -R 2 O的三角形组成图，组成由小圆的位置表示，小圆数表示组成数），用连接表示第一，第三，第十，第十一，和第四组分分别作为原料。

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